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ZPSD512B1-70JI

STMicroelectronics

ZPSD512B1-70JI by STMicroelectronics

ZPSD512B1-70JI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at 5V. It features a max clock frequency of 36 MHz, ideal for industrial applications. Its compact chip carrier design ensures efficient space utilization in electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,970 parts In-Stock

1+ parts

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4,970

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Anansix

USA . 1,861 parts In-Stock

1+ parts

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1k+ parts

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1,861

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Digiode

USA . 891 parts In-Stock

1+ parts

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100+ parts

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891

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 875 parts In-Stock

1+ parts

$58.570

100+ parts

-

1k+ parts

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10k+ parts

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875

$58.570

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IDEA Electronic Components Group

UK . 527 parts In-Stock

1+ parts

$67.388

100+ parts

-

1k+ parts

$60.649

10k+ parts

-

527

$67.388

-

$60.649

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MKK Technologies

India . 1,814 parts In-Stock

1+ parts

$126.719

100+ parts

-

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1,814

$126.719

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DigiPath Technology Company

USA . 1,814 parts In-Stock

1+ parts

$126.719

100+ parts

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1k+ parts

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1,814

$126.719

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Corphita

USA . 3,842 parts In-Stock

1+ parts

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3,842

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Parana Technologies

USA . 420 parts In-Stock

1+ parts

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100+ parts

$80.573

1k+ parts

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420

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$80.573

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Overview

Unlock the potential of your devices with the ZPSD512B1-70JI from STMicroelectronics, a leader in innovation and quality. This versatile multi-functional peripheral is designed for reliability in demanding applications, ensuring robustness across industrial environments. With its seamless integration and impressive performance, this chip empowers your projects to achieve higher efficiency and enhanced functionality, delivering exceptional value and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material ensures durability and resistance to environmental factors, making the device suitable for various industrial applications.

Surface Mount: YES

Surface mount technology allows for a more compact design, facilitating better space utilization on circuit boards and improving overall product efficiency.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5V promotes compatibility with a wide range of power management systems, ensuring reliable operation in various conditions.

Address Bus Width: 16

A 16-bit address bus width allows for a larger addressing capability, enabling the product to access more memory and thus improve processing power.

Package Shape: SQUARE

The square package shape aids in uniform heat distribution, enhancing thermal management during operation.

Power Supplies (V): 5

Designed for standard 5V power supplies, this product integrates easily into existing systems without the need for additional components.

No. of Terminals: 68

With 68 terminals, this product supports extensive interfacing options, allowing for flexibility and integration with multiple devices.

Package Style (Meter): CHIP CARRIER

The chip carrier package style is conducive for use in automated assembly processes, promoting efficiency in production.

Minimum Supply Voltage: 4.5 V

Operating at a minimum supply voltage of 4.5V offers a wide voltage range for adaptability in different electrical environments.

Maximum Operating Temperature: 85 °C

An operating temperature up to 85 °C makes this product well-suited for high-temperature environments often encountered in industrial applications.

Minimum Operating Temperature: -40 °C

The capability to operate at -40 °C ensures reliability in extreme cold conditions, catering to outdoor and harsh environment applications.

Terminal Finish: TIN LEAD

The tin lead terminal finish enhances solderability and longevity of the connections, ensuring stable operations over time.

Ultraviolet Erasable: N

Non-ultraviolet erasable nature reduces the risk of accidental data loss, making it a secure option for critical applications.

Terminal Position: QUAD

Quad terminal position allows for enhanced connectivity in compact designs, supporting multi-functional uses without increasing footprint.

Maximum Seated Height: 4.57 mm

A low maximum seated height of 4.57 mm allows for tighter packing in electronic assemblies, optimizing space in compact devices.

RAM Words: 1024

With 1024 RAM words, the product can handle complex computations and data processing tasks efficiently.

Width: 24.1808 mm

A width of 24.1808 mm strikes a balance between compactness and performance, making it ideal for space-constrained designs.

External Data Bus Width: 8

The 8-bit external data bus width offers flexibility in data transfer, accommodating various applications that require efficient data handling.

Maximum Clock Frequency: 36 MHz

Operating at a maximum clock frequency of 36 MHz ensures fast processing speeds, contributing to quicker task execution and responsiveness.

Length: 24.1808 mm

The length of 24.1808 mm allows for a standardized footprint, making it easier to integrate into existing designs while maintaining performance.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature grade, this product is built to last in harsh environments, ensuring long-term reliability and performance.

ROM Bits Size: 512 Bits

With a ROM size of 512 bits, the product can retain essential firmware, ensuring reliability in operational processes.

Technology: CMOS

Using CMOS technology enhances energy efficiency and reduces heat generation, making the product suitable for battery-operated devices.

Terminal Form: J BEND

J bend terminal form simplifies PCB assembly, enabling quick and efficient integration into various devices.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5V ensures compatibility with common digital circuits, promoting ease of use and integration.

Bus Compatibility: 8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Broad bus compatibility makes this product versatile for various applications and systems, enhancing its usability in diverse projects.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm supports high-density mounting options, allowing for efficient use of PCB space.

Maximum Standby Current: 0.00002 Amp

A low maximum standby current of 0.00002 Amps contributes to energy efficiency, vital for modern power-sensitive applications.

Maximum Access Time: 0.00000007 ns

An extremely low access time ensures rapid data retrieval, facilitating high-speed operations in time-critical applications.

No. of I/O Lines: 40

With 40 I/O lines, this product can manage substantial input and output operations, making it ideal for complex multifunctional peripherals.

Technical Specifications

Multi-functional Peripherals ZPSD512B1-70JI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000007 ns

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Maximum Clock Frequency:

36 MHz

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e0

Length:

24.1808 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

1024

ROM Bits Size:

512 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

24.1808 mm

Trade Compliance

ZPSD512B1-70JI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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