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ZPSD503B1-70L

STMicroelectronics

ZPSD503B1-70L by STMicroelectronics

ZPSD503B1-70L by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max supply voltage of 5.5V. It features 512 RAM words and supports various bus types, making it ideal for embedded applications. Its compact ceramic package ensures reliable performance in commercial environments up to 70 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,498 parts In-Stock

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2,498

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Digiode

USA . 2,134 parts In-Stock

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2,134

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Vyrian

USA . 639 parts In-Stock

1+ parts

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639

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,679 parts In-Stock

1+ parts

$40.652

100+ parts

-

1k+ parts

$36.587

10k+ parts

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1,679

$40.652

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$36.587

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Corohmni

South Africa . 82 parts In-Stock

1+ parts

$48.304

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82

$48.304

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MKK Technologies

India . 1,936 parts In-Stock

1+ parts

$76.444

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1,936

$76.444

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DigiPath Technology Company

USA . 1,936 parts In-Stock

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$76.444

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1,936

$76.444

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Parana Technologies

USA . 1,852 parts In-Stock

1+ parts

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$48.606

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1,852

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$48.606

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Corphita

USA . 1,517 parts In-Stock

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1,517

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Overview

Unlock unparalleled performance with the ZPSD503B1-70L from STMicroelectronics, a leader in innovative solutions. This robust multi-functional peripheral combines superior quality and reliability, ensuring your designs meet the highest standards. Engineered for versatility, it's perfect for industrial automation, consumer electronics, and more. Elevate your projects with enhanced efficiency and seamless integration—experience the STMicroelectronics advantage today!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRE

The durable ceramic and metal-sealed design ensures high reliability and durability, making it ideal for demanding applications.

Surface Mount: YES

Surface mount capability allows for compact design and ease of integration into modern electronic assemblies.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage flexibility supports a wide range of applications in low-power devices.

Address Bus Width: 16

The 16-bit address bus width enables efficient processing and access to a larger memory space.

Package Shape: SQUARE

The square package shape allows for efficient use of PCB space and enhances thermal performance.

No. of Terminals: 68

With 68 terminals, this device provides ample connectivity options for versatile functionality.

Package Style (Meter): CHIP CARRIER, WINDOW

The chip carrier design enhances the device's performance and is suitable for various applications.

Minimum Supply Voltage: 4.5 V

Operating at a minimum voltage of 4.5 V ensures compatibility with numerous low-voltage applications.

Maximum Operating Temperature: 70 °C

The high operational temperature range facilitates reliable use in warmer environments.

Minimum Operating Temperature: 0 °C

Zero degree minimum operational capability allows deployment in diverse climates.

Terminal Position: QUAD

Quad terminal positioning aids in reducing PCB space and improved device layout.

Maximum Seated Height: 4.57 mm

The low seated height allows for shallow surface profiles, beneficial for compact designs.

RAM Words: 512

Having 512 words of RAM ensures adequate memory for applications requiring moderate data processing.

Width: 24.105 mm

A width of 24.105 mm balances physical size with accessibility and connectivity.

External Data Bus Width: 16

The 16-bit external data bus width supports high data transfer rates, improving overall system performance.

Maximum Clock Frequency: 50 MHz

With a maximum clock frequency of 50 MHz, it can handle fast operations and real-time applications.

Length: 24.105 mm

Similar to the width, the length of 24.105 mm ensures precise dimensions for standard designs.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates good reliability for general-use applications.

Technology: CMOS

CMOS technology supports low power consumption while maintaining high performance.

Terminal Form: J BEND

J bend terminal formation simplifies soldering and enhances board attachment reliability.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V is standard for many electronic components, enabling easy integration.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Wide bus compatibility ensures flexibility for use in various legacy and contemporary systems.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is suitable for dense PCB layouts while retaining usability.

No. of I/O Lines: 40

With 40 I/O lines, it provides extensive input/output capabilities, making it ideal for complex applications.

Technical Specifications

Multi-functional Peripherals ZPSD503B1-70L attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

64K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

JESD-30 Code:

S-CQCC-J68

Length:

24.105 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Qualification:

Not Qualified

RAM Words:

512

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

24.105 mm

Trade Compliance

ZPSD503B1-70L Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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