Loading...

ZPSD501B1-90JI

STMicroelectronics

ZPSD501B1-90JI by STMicroelectronics

ZPSD501B1-90JI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at 5V. It features a max clock frequency of 30 MHz, supports various bus types, and is ideal for industrial applications due to its wide temp range (-40 °C to 85 °C).

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,795 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,795

-

-

-

-

Vyrian

USA . 1,733 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,733

-

-

-

-

Anansix

USA . 1,579 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,579

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 185 parts In-Stock

1+ parts

$43.464

100+ parts

-

1k+ parts

$39.117

10k+ parts

-

185

$43.464

-

$39.117

-

MKK Technologies

India . 510 parts In-Stock

1+ parts

$81.730

100+ parts

-

1k+ parts

-

10k+ parts

-

510

$81.730

-

-

-

DigiPath Technology Company

USA . 510 parts In-Stock

1+ parts

$81.730

100+ parts

-

1k+ parts

-

10k+ parts

-

510

$81.730

-

-

-

Corphita

USA . 4,188 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,188

-

-

-

-

Parana Technologies

USA . 898 parts In-Stock

1+ parts

-

100+ parts

$51.967

1k+ parts

-

10k+ parts

-

898

-

$51.967

-

-

Overview

Unlock the potential of your next project with the ZPSD501B1-90JI from STMicroelectronics. Renowned for their commitment to quality and innovation, STMicroelectronics delivers a versatile multi-functional peripheral that seamlessly integrates into various applications, ensuring reliability in demanding environments. With its robust design and energy efficiency, this product empowers engineers to enhance performance while reducing system complexity. Experience unmatched value and performance with ST's trusted technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures a lightweight and robust design, making it ideal for various environments.

Surface Mount: YES

Surface mount technology allows for efficient space utilization on the PCB, enabling compact device designs.

Maximum Supply Voltage: 5.5 V

The maximum supply voltage of 5.5 V provides flexibility for integration with various power sources while maintaining device safety.

Address Bus Width: 16

A 16-bit address bus width allows for a larger memory addressing capability, enhancing the potential complexity of applications.

Package Shape: SQUARE

The square package shape is conducive for efficient thermal management and easy integration into existing systems.

Power Supplies (V): 5

Operating at a nominal power supply of 5 V is standard and ensures compatibility with a wide range of electronic systems.

No. of Terminals: 68

Having 68 terminals facilitates numerous input/output operations, making it suitable for multi-functional applications.

Package Style (Meter): CHIP CARRIER

The chip carrier style provides convenient mounting and assembly options, enhancing manufacturing efficiency.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V ensures the device can operate effectively under lower power conditions.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C guarantees reliable performance in demanding industrial environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product is suitable for extreme conditions, ensuring reliability and longevity.

Terminal Finish: TIN LEAD

The tin-lead terminal finish enhances solderability and reliability during assembly, resulting in better performance.

Terminal Position: QUAD

The quad terminal position allows for efficient routing in PCB design, facilitating better electrical connections.

Maximum Seated Height: 4.57 mm

The compact seated height minimizes the overall footprint of the device, making it ideal for space-constrained applications.

RAM Words: 512

512 words of RAM facilitates efficient data processing and storage for various multitasking applications.

Width: 24.1808 mm

A standardized width of 24.1808 mm allows for ease of integration with existing PCB layouts.

External Data Bus Width: 16

The 16-bit external data bus width enhances data transfer rates, making it suitable for high-performance applications.

Maximum Clock Frequency: 30 MHz

Operating at a maximum clock frequency of 30 MHz supports high-speed processing, improving overall product performance.

Length: 24.1808 mm

The length of 24.1808 mm complements the overall compact design, ensuring efficient use of board space.

Temperature Grade: INDUSTRIAL

An industrial temperature grade makes this device suitable for demanding applications in harsh environments.

ROM Bits Size: 256 Bits

256 bits of ROM storage is sufficient for basic firmware storage, enabling essential functionality.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed operation, making it energy-efficient.

Terminal Form: J BEND

The J bend terminal form facilitates easy handling and assembly, improving manufacturability.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V ensures compatibility with a wide range of existing systems, facilitating easy integration.

Bus Compatibility: 8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

The product's compatibility with multiple bus systems enhances its versatility across numerous applications.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for easy soldering and reliable electrical connections on PCBs.

Maximum Standby Current: 0.00002 Amp

A low maximum standby current translates to energy efficiency, making it suitable for power-sensitive applications.

Maximum Access Time: 0.00000009 ns

An extremely low maximum access time supports rapid data processing, enhancing system performance.

No. of I/O Lines: 40

With 40 I/O lines, the device supports multiple peripheral connections, enhancing its multi-functionality.

Technical Specifications

Multi-functional Peripherals ZPSD501B1-90JI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000009 ns

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e0

Length:

24.1808 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

512

ROM Bits Size:

256 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

24.1808 mm

Trade Compliance

ZPSD501B1-90JI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20