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ZPSD501B1V-25J

STMicroelectronics

ZPSD501B1V-25J by STMicroelectronics

ZPSD501B1V-25J by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5 V. It features 512 RAM words and supports various bus types, making it ideal for embedded systems. Its compact chip carrier design ensures efficient integration in space-constrained applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,108 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,108

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Vyrian

USA . 374 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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374

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Anansix

USA . 314 parts In-Stock

1+ parts

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100+ parts

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314

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,801 parts In-Stock

1+ parts

$41.354

100+ parts

-

1k+ parts

$37.219

10k+ parts

-

1,801

$41.354

-

$37.219

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MKK Technologies

India . 1,363 parts In-Stock

1+ parts

$77.764

100+ parts

-

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10k+ parts

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1,363

$77.764

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DigiPath Technology Company

USA . 1,363 parts In-Stock

1+ parts

$77.764

100+ parts

-

1k+ parts

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10k+ parts

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1,363

$77.764

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Corphita

USA . 4,404 parts In-Stock

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4,404

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Parana Technologies

USA . 1,293 parts In-Stock

1+ parts

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100+ parts

$49.445

1k+ parts

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10k+ parts

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1,293

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$49.445

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Overview

Unlock the potential of your designs with the ZPSD501B1V-25J from STMicroelectronics—a trusted leader in innovative technology. This versatile multi-functional peripheral enhances performance across a range of applications, from automotive systems to consumer electronics. With superior quality and reliability, it streamlines integration, boosts efficiency, and ensures longevity in demanding environments. Elevate your projects and enjoy unmatched value by choosing STMicroelectronics—where excellence meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic and epoxy materials ensures durability and resistance to environmental factors, making this multi-functional peripheral suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient assembly, making it ideal for space-constrained applications.

Maximum Supply Voltage: 5.5 V

The wide maximum supply voltage enables compatibility with various power sources, enhancing the versatility of the product.

Address Bus Width: 16

A 16-bit address bus allows for a large address space, supporting a significant memory capacity for complex applications.

Package Shape: SQUARE

The square shape provides a balanced layout for circuit board design, facilitating efficient use of board space.

No. of Terminals: 68

A higher number of terminals increases connectivity options, allowing for enhanced functionality and ease of integration with other components.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging enables better performance in surface mounting and serves applications where robust reliability is essential.

Minimum Supply Voltage: 2.7 V

The low minimum supply voltage enhances power efficiency, making this product suitable for battery-operated and energy-sensitive applications.

Maximum Operating Temperature: 70 °C

Designed to operate at high temperatures, this product is robust for demanding thermal environments, enhancing reliability.

Minimum Operating Temperature: 0 °C

With the ability to operate from 0 °C, this peripheral is compatible with a broad range of operating conditions, ensuring versatility.

Terminal Position: QUAD

Quad terminal positioning allows easier routing and increased layout flexibility, optimizing the circuit board design.

Maximum Seated Height: 4.57 mm

A low profile aids in compact device designs, contributing to sleeker product forms.

RAM Words: 512

With 512 words of RAM, this product supports efficient data processing and handling for applications requiring quick access to memory.

Width: 24.18 mm

The compact width enables integration into smaller enclosures, catering to space-constrained electronic designs.

External Data Bus Width: 16

A 16-bit external data bus allows for high data throughput, improving performance for data-intensive applications.

Maximum Clock Frequency: 33.33 MHz

With a maximum clock frequency of 33.33 MHz, this peripheral can handle fast processing demands, enhancing application responsiveness.

Length: 24.18 mm

The compact length aids in space optimization on circuit boards, making it suitable for compact electronic devices.

Temperature Grade: COMMERCIAL

Designed for commercial temperature ranges, this product is suitable for a broad array of consumer electronics.

Technology: CMOS

CMOS technology ensures low power consumption while providing high density and performance, making it an excellent choice for modern applications.

Terminal Form: J BEND

J bend terminals allow for secure connections on the circuit board, enhancing reliability and ease of soldering.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3 V makes this device ideal for low-power applications, improving energy efficiency.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Wide bus compatibility makes this product adaptable for various systems, facilitating ease of integration into existing designs.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch optimizes the layout for high-density applications, promoting efficient use of PCB space.

No. of I/O Lines: 40

With 40 input/output lines, this peripheral supports a wide range of functionalities, making it versatile for many applications.

Technical Specifications

Multi-functional Peripherals ZPSD501B1V-25J attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

33.33 MHz

External Data Bus Width:

16

JESD-30 Code:

S-PQCC-J68

Length:

24.18 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

RAM Words:

512

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

24.18 mm

Trade Compliance

ZPSD501B1V-25J Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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