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ZPSD501B1-70JI

STMicroelectronics

ZPSD501B1-70JI by STMicroelectronics

ZPSD501B1-70JI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features a compact chip carrier package, ideal for industrial applications. With 512 RAM words and a max clock frequency of 36 MHz, it ensures efficient performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,213 parts In-Stock

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2,213

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Anansix

USA . 346 parts In-Stock

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346

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Digiode

USA . 91 parts In-Stock

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91

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,966 parts In-Stock

1+ parts

$35.959

100+ parts

-

1k+ parts

$32.363

10k+ parts

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1,966

$35.959

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$32.363

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MKK Technologies

India . 2,076 parts In-Stock

1+ parts

$67.619

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2,076

$67.619

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DigiPath Technology Company

USA . 2,076 parts In-Stock

1+ parts

$67.619

100+ parts

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2,076

$67.619

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Parana Technologies

USA . 966 parts In-Stock

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$42.995

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966

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$42.995

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Corphita

USA . 815 parts In-Stock

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815

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Overview

Unlock superior performance and versatility with the ZPSD501B1-70JI from STMicroelectronics, a leader in innovation. This multi-functional peripheral is designed for seamless integration in various applications, ensuring reliability even in challenging environments. With its compact design, this chip provides exceptional power efficiency and operational stability, making it the ideal choice for your next project. Elevate your designs and experience unmatched quality that only STMicroelectronics can deliver!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures long-term reliability and protection against environmental factors, making the product sturdy.

Surface Mount: YES

Surface mount technology allows for a compact design and simplifies the assembly process, enhancing the product's efficiency.

Maximum Supply Voltage: 5.5 V

The ability to operate at a maximum supply voltage of 5.5 V allows for compatibility with various power sources, increasing versatility.

Address Bus Width: 16

A 16-bit address bus enables a larger memory address space, enhancing the device’s capability to handle complex tasks.

Package Shape: SQUARE

The square package shape facilitates easier integration and better utilization of PCB space in multi-functional peripherals.

Power Supplies (V): 5

Standard 5V power supply compatibility makes it easy to integrate with existing systems and reduces the need for additional components.

No. of Terminals: 68

With 68 terminals, this device provides ample connectivity options for various peripherals and enhancements.

Package Style (Meter): CHIP CARRIER

Chip carrier style packaging promotes thermal efficiency and reliable electrical performance, essential for multi-functional use.

Minimum Supply Voltage: 4.5 V

Support for a minimum supply voltage of 4.5 V ensures stable operation across a wide range of conditions.

Maximum Operating Temperature: 85 °C

An operational temperature limit of 85 °C allows for stable performance even in demanding environments.

Minimum Operating Temperature: -40 °C

The ability to function at -40 °C makes this device suitable for use in extreme conditions, increasing its application range.

Terminal Finish: TIN LEAD

Tin lead terminal finish offers excellent solderability and durability, ensuring a reliable connection over time.

Terminal Position: QUAD

The quad terminal position enables efficient use of space and simplifies routing on circuit boards.

Maximum Seated Height: 4.57 mm

A low seated height supports high-density applications and keeps the overall profile of the product compact.

RAM Words: 512

With 512 RAM words, this device offers sufficient memory for processing a variety of tasks quickly.

Width: 24.1808 mm

The precise width allows for seamless integration into standard-sized PCBs and devices.

External Data Bus Width: 16

A 16-bit external data bus enhances data transfer efficiency, making it a strong choice for high-performance applications.

Maximum Clock Frequency: 36 MHz

A maximum clock frequency of 36 MHz provides robust processing capabilities, improving the overall performance of the device.

Length: 24.1808 mm

The length matches the width to maintain a uniform size, assisting in design compatibility across multiple platforms.

Temperature Grade: INDUSTRIAL

Industrial temperature grading indicates reliability in challenging environments, making this peripheral ideal for commercial use.

ROM Bits Size: 256 Bits

With a ROM size of 256 bits, it is well-equipped for basic firmware storage while keeping costs efficient.

Technology: CMOS

CMOS technology provides low power consumption and high speed, ideal for power-sensitive applications.

Terminal Form: J BEND

The J bend terminal form enhances stability during soldering, ensuring secure connections on PCBs.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V signifies compatibility with the majority of electronic devices and reduces design complexity.

Bus Compatibility: 8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Extensive bus compatibility makes this peripheral adaptable to a wide range of systems, supporting greater flexibility in design.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch provides a balance between compactness and ease of soldering, optimizing assembly processes.

Maximum Standby Current: 0.00002 Amp

Extremely low standby current enhances energy efficiency, making this component suitable for battery-powered devices.

Maximum Access Time: 0.00000007 ns

Ultra-fast access time ensures rapid data retrieval and processing capabilities, vital for high-speed applications.

No. of I/O Lines: 40

Forty I/O lines provide significant input/output flexibility, allowing for multiple connections to various devices and peripherals.

Technical Specifications

Multi-functional Peripherals ZPSD501B1-70JI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000007 ns

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Maximum Clock Frequency:

36 MHz

External Data Bus Width:

16

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e0

Length:

24.1808 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

512

ROM Bits Size:

256 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

24.1808 mm

Trade Compliance

ZPSD501B1-70JI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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