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ZPSD501B1-15JI

STMicroelectronics

ZPSD501B1-15JI by STMicroelectronics

ZPSD501B1-15JI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features 512 RAM words, supports various bus types, and functions effectively in industrial applications from -40 °C to 85 °C. Its compact chip carrier design ensures efficient integration into electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,981 parts In-Stock

1+ parts

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2,981

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Anansix

USA . 1,976 parts In-Stock

1+ parts

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1,976

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Vyrian

USA . 540 parts In-Stock

1+ parts

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540

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 558 parts In-Stock

1+ parts

$78.813

100+ parts

-

1k+ parts

$70.931

10k+ parts

-

558

$78.813

-

$70.931

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MKK Technologies

India . 1,100 parts In-Stock

1+ parts

$148.202

100+ parts

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1,100

$148.202

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DigiPath Technology Company

USA . 1,100 parts In-Stock

1+ parts

$148.202

100+ parts

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1,100

$148.202

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Corphita

USA . 4,876 parts In-Stock

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4,876

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Parana Technologies

USA . 591 parts In-Stock

1+ parts

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100+ parts

$94.233

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591

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$94.233

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Overview

Unlock limitless potential with the ZPSD501B1-15JI from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This versatile peripheral is crafted for reliability and designed to elevate your applications, whether in industrial control or consumer electronics. Benefit from its robust performance across extreme temperatures, while enjoying seamless integration and enhanced efficiency. Choose STMicroelectronics for quality you can depend on!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic and epoxy materials ensures a strong, reliable package that can withstand various environmental factors.

Surface Mount: YES

Surface mount technology allows for compact designs and easier assembly on PCBs, making the product suitable for modern manufacturing.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with a variety of low-power applications.

Address Bus Width: 16

A 16-bit address bus width allows for accessing a larger memory space, enhancing the performance of data handling.

Package Shape: SQUARE

The square package shape facilitates efficient space utilization on PCBs, making it suitable for compact device designs.

Power Supplies (V): 5

Operating with a standard 5V power supply makes integration into existing systems straightforward and cost-effective.

No. of Terminals: 68

With 68 terminals, this product offers extensive connectivity options for various peripherals and components.

Package Style (Meter): CHIP CARRIER

The chip carrier style enhances the ease of mounting and soldering to printed circuit boards.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V ensures the product can operate reliably in a broader range of power conditions.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C indicates that this product is suitable for industrial applications where higher temperatures may be encountered.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product is ideal for use in harsh environments.

Terminal Finish: TIN LEAD

The tin-lead terminal finish ensures good solderability, which is critical for reliable connections.

Ultraviolet Erasable: N

Being non-ultraviolet erasable indicates a reliability in data retention which is essential for mission-critical applications.

Terminal Position: QUAD

The quad terminal position allows for more flexible layout options on printed circuit boards.

Maximum Seated Height: 4.57 mm

A compact seated height of 4.57 mm makes it easier to fit this component into tight spaces.

RAM Words: 512

A RAM capacity of 512 words provides ample memory for temporary data storage, improving processing efficiency.

Width: 24.18 mm

The moderate width allows for easy integration into various applications while maintaining a compact footprint.

External Data Bus Width: 16

A 16-bit external data bus width enables faster data transfer rates, enhancing overall system performance.

Maximum Clock Frequency: 34.48 MHz

A high maximum clock frequency of 34.48 MHz allows for faster processing speeds, making this product suitable for demanding applications.

Length: 24.18 mm

The length of 24.18 mm contributes to a balanced and compact design, ideal for multi-functional peripherals.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature grades, this product is reliable in a wide variety of operating conditions.

ROM Bits Size: 256 Bits

With a ROM size of 256 bits, the product can store essential firmware and system data efficiently.

Technology: CMOS

Using CMOS technology ensures low power consumption and high noise immunity, enhancing efficiency and performance.

Terminal Form: J BEND

The J bend terminal form allows for better mechanical stability when mounted on circuit boards.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is recognized in many electronic applications, ensuring compatibility and ease of use.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Extensive bus compatibility makes this product versatile for integration into various legacy and modern systems.

Terminal Pitch: 1.27 mm

A standard terminal pitch of 1.27 mm supports ease of assembly and compatibility with various PCB layouts.

Maximum Standby Current: 0.00002 Amp

A very low standby current indicates efficiency, making this product ideal for battery-operated devices.

Maximum Access Time: 0.00000015 ns

With a very fast access time, this product can quickly process instructions, improving overall system responsiveness.

No. of I/O Lines: 40

Having 40 I/O lines allows for a wide range of interfacing options with multiple peripherals, enhancing functionality.

Technical Specifications

Multi-functional Peripherals ZPSD501B1-15JI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000015 ns

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

34.48 MHz

External Data Bus Width:

16

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e0

Length:

24.18 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

512

ROM Bits Size:

256 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

24.18 mm

Trade Compliance

ZPSD501B1-15JI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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