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ZPSD501B1V-20UI

STMicroelectronics

ZPSD501B1V-20UI by STMicroelectronics

ZPSD501B1V-20UI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates b/w 2.7V to 5.5V. It features a max clock frequency of 33.33 MHz and supports various bus architectures, making it ideal for industrial applications. Its compact flatpack design ensures efficient space utilization in electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,998 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,998

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-

-

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Vyrian

USA . 4,601 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,601

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-

-

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Anansix

USA . 736 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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736

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 680 parts In-Stock

1+ parts

$39.710

100+ parts

-

1k+ parts

$35.739

10k+ parts

-

680

$39.710

-

$35.739

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MKK Technologies

India . 155 parts In-Stock

1+ parts

$74.672

100+ parts

-

1k+ parts

-

10k+ parts

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155

$74.672

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-

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DigiPath Technology Company

USA . 155 parts In-Stock

1+ parts

$74.672

100+ parts

-

1k+ parts

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10k+ parts

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155

$74.672

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-

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Corphita

USA . 3,649 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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3,649

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Parana Technologies

USA . 1,920 parts In-Stock

1+ parts

-

100+ parts

$47.479

1k+ parts

-

10k+ parts

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1,920

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$47.479

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Overview

Elevate your designs with the ZPSD501B1V-20UI from STMicroelectronics, a trusted leader in innovative microcontrollers. This multi-functional peripheral combines exceptional performance with robust reliability for industrial applications, ensuring your projects meet the highest standards. With its compact design and versatile compatibility, it empowers engineers to achieve greater efficiency and flexibility, making it an indispensable asset for next-gen electronic solutions. Choose STMicroelectronics for quality that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, which enhances the longevity of the product.

Surface Mount: YES

Surface mount technology allows for a smaller footprint on the PCB, making it ideal for compact multi-functional peripherals.

Maximum Supply Voltage: 5.5 V

A higher maximum supply voltage offers flexibility in integration with various power supply designs.

Address Bus Width: 16

A 16-bit address bus width allows for accessing a larger memory space, making it suitable for sophisticated applications.

Package Shape: SQUARE

The square package shape optimizes the layout and design, ensuring efficient space utilization on circuit boards.

No. of Terminals: 80

With 80 terminals, this product can connect to more peripherals and devices, enhancing its versatility.

Package Style (Meter): FLATPACK, LOW PROFILE

The low profile flatpack style aids in better thermal dissipation and is ideal for space-constrained designs.

Minimum Supply Voltage: 2.7 V

Operating at a minimum voltage of 2.7 V allows for compatibility with low-power applications, improving energy efficiency.

Maximum Operating Temperature: 85 °C

Designed for high temperatures, it ensures reliable operation in demanding environments, perfect for industrial use.

Minimum Operating Temperature: -40 °C

The capability to operate in extreme cold makes it suitable for use in harsh environments.

Terminal Position: QUAD

Quad terminal positioning enhances soldering and connectivity options in multi-layer PCB designs.

Maximum Seated Height: 1.6 mm

A low seated height allows for more compact assembly in devices, optimizing design and reducing overall size.

RAM Words: 512

With 512 RAM words, this peripheral can handle more data efficiently, boosting performance in complex applications.

Width: 14 mm

A compact width of 14 mm aids in fitting the device into tighter spaces while maintaining functionality.

External Data Bus Width: 16

A 16-bit external data bus increases the data throughput, enhancing overall system performance.

Maximum Clock Frequency: 33.33 MHz

A high clock frequency supports faster operations, ensuring responsiveness and effective processing of tasks.

Length: 14 mm

Like its width, a length of 14 mm supports compact designs, crucial for modern electronic devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grading guarantees robustness and reliability in extreme conditions typical of industrial applications.

Technology: CMOS

CMOS technology supports low power consumption while providing high speed, making it ideal for energy-efficient devices.

Terminal Form: GULL WING

Gull wing terminals provide ease of handling and effective soldering processes, enhancing manufacturability.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V balances performance with power efficiency, suitable for battery-powered devices.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Wide bus compatibility ensures that this product can be integrated into a variety of existing systems, maximizing its usefulness.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for a denser arrangement of connections, optimizing space on PCBs.

No. of I/O Lines: 40

With 40 I/O lines, this device can interact with multiple components simultaneously, improving system capabilities.

Technical Specifications

Multi-functional Peripherals ZPSD501B1V-20UI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

33.33 MHz

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G80

Length:

14 mm

No. of I/O Lines:

40

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Qualification:

Not Qualified

RAM Words:

512

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

ZPSD501B1V-20UI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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