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CY8C3666AXI-037

Infineon Technologies

CY8C3666AXI-037 by Infineon Technologies

CY8C3666AXI-037 by Infineon: 8-bit CPU, 67 MHz clock, 62 I/O lines. Ideal for industrial applications with -40 to 85°C operating temp range. Features Flash ROM, USB and I2C bus compatibility.

Median Price

$13.884

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 464 parts In-Stock

1+ parts

$15.293

100+ parts

$11.540

1k+ parts

$10.392

10k+ parts

-

464

$15.293

$11.540

$10.392

-

DigiKey

USA . 46 parts In-Stock

1+ parts

$17.860

100+ parts

$12.320

1k+ parts

$11.456

10k+ parts

-

46

$17.860

$12.320

$11.456

-

Rochester

USA . 260 parts In-Stock

1+ parts

-

100+ parts

$9.980

1k+ parts

$8.930

10k+ parts

$8.410

260

-

$9.980

$8.930

$8.410

Verical

USA . 183 parts In-Stock

1+ parts

-

100+ parts

$12.475

1k+ parts

$11.162

10k+ parts

$10.512

183

-

$12.475

$11.162

$10.512

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 494 parts In-Stock

1+ parts

$9.092

100+ parts

-

1k+ parts

-

10k+ parts

-

494

$9.092

-

-

-

Nova Conductors

Japan . 15 parts In-Stock

1+ parts

$14.374

100+ parts

-

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-

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15

$14.374

-

-

-

Vyrian

USA . 252 parts In-Stock

1+ parts

-

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-

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-

10k+ parts

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252

-

-

-

-

IBS Electronics

USA . 90 parts In-Stock

1+ parts

-

100+ parts

$15.470

1k+ parts

$15.273

10k+ parts

-

90

-

$15.470

$15.273

-

ACDS - Activité Composants Distribution Service

France . 47 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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47

-

-

-

-

Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 5 parts In-Stock

1+ parts

-

100+ parts

-

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-

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5

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 4,940 parts In-Stock

1+ parts

$3.510

100+ parts

-

1k+ parts

-

10k+ parts

-

4,940

$3.510

-

-

-

Modulus Dynamics

Lithuania . 3,222 parts In-Stock

1+ parts

$3.510

100+ parts

$3.370

1k+ parts

$3.229

10k+ parts

-

3,222

$3.510

$3.370

$3.229

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Corphita

USA . 974 parts In-Stock

1+ parts

$8.614

100+ parts

-

1k+ parts

-

10k+ parts

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974

$8.614

-

-

-

Semicontronic

India . 279 parts In-Stock

1+ parts

$9.330

100+ parts

$9.097

1k+ parts

$9.050

10k+ parts

-

279

$9.330

$9.097

$9.050

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Ampacity Inc.

Singapore . 299 parts In-Stock

1+ parts

$9.430

100+ parts

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-

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299

$9.430

-

-

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Bastille Electronics

Australia . 100 parts In-Stock

1+ parts

$14.370

100+ parts

$13.652

1k+ parts

-

10k+ parts

$12.789

100

$14.370

$13.652

-

$12.789

Continental Prestige Electronics

USA . 1,123 parts In-Stock

1+ parts

$14.374

100+ parts

-

1k+ parts

-

10k+ parts

$14.086

1,123

$14.374

-

-

$14.086

Aztec Data Supply Inc.

USA . 1,196 parts In-Stock

1+ parts

$54.940

100+ parts

-

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-

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1,196

$54.940

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Perfect Parts

USA . 284 parts In-Stock

1+ parts

-

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284

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Argo Parts USA

USA . 112 parts In-Stock

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112

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Cyclops Electronics Ltd (Excess)

UK . 47 parts In-Stock

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47

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Overview

Elevate your projects with the CY8C3666AXI-037 from Infineon Technologies, a top-tier manufacturer known for delivering high-quality multi-functional peripherals. This versatile device offers endless possibilities for applications across various industries, providing customers with unmatched value and benefits. With advanced technology and reliable performance, this product is designed to meet your needs and exceed your expectations. Experience innovation like never before with the CY8C3666AXI-037.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material is durable and lightweight, making the product easy to handle and transport.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, the device can handle a wide range of power inputs without risk of damage.

Bit Size: 8

An 8-bit architecture allows for efficient processing of data and instructions, contributing to fast performance.

CPU Family: 8051

The 8051 CPU family is known for its reliability and versatility, making it a popular choice for various applications.

RAM Bytes: 8192

With a large RAM capacity, the device can store and access a significant amount of data quickly, enhancing overall performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the device efficient and reliable in operation.

Bus Compatibility: I2C; USB

Compatibility with I2C and USB buses allows for easy integration with other devices and systems, enhancing connectivity options.

Maximum Clock Frequency: 67 MHz

A high clock frequency enables fast data processing and execution, improving the overall speed and efficiency of the product.

Technical Specifications

Multi-functional Peripherals CY8C3666AXI-037 attributes and parameters. Explore more Multi-functional Peripherals devices from Infineon Technologies

Specs

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

YES

Bus Compatibility:

I2C; USB

CPU Family:

8051

Maximum Clock Frequency:

67 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

62

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

RAM Bytes:

8192

RAM Words:

4096

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

67 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Trade Compliance

CY8C3666AXI-037 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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