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ZPSD503B1-90JI

STMicroelectronics

ZPSD503B1-90JI by STMicroelectronics

ZPSD503B1-90JI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at 5V. It features a max clock frequency of 30 MHz, ideal for industrial applications. Its compact chip carrier design ensures efficient performance in various systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,514 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,514

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-

-

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Anansix

USA . 2,518 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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2,518

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Vyrian

USA . 2,067 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,067

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 2,505 parts In-Stock

1+ parts

$39.812

100+ parts

-

1k+ parts

-

10k+ parts

-

2,505

$39.812

-

-

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IDEA Electronic Components Group

UK . 1,178 parts In-Stock

1+ parts

$48.927

100+ parts

-

1k+ parts

$44.035

10k+ parts

-

1,178

$48.927

-

$44.035

-

MKK Technologies

India . 943 parts In-Stock

1+ parts

$92.005

100+ parts

-

1k+ parts

-

10k+ parts

-

943

$92.005

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-

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DigiPath Technology Company

USA . 943 parts In-Stock

1+ parts

$92.005

100+ parts

-

1k+ parts

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10k+ parts

-

943

$92.005

-

-

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Corphita

USA . 2,121 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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2,121

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Parana Technologies

USA . 1,541 parts In-Stock

1+ parts

-

100+ parts

$58.500

1k+ parts

-

10k+ parts

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1,541

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$58.500

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Overview

Unlock unparalleled performance with the ZPSD503B1-90JI from STMicroelectronics, a leader in innovative solutions. This multi-functional peripheral combines reliability and versatility, making it ideal for automotive, industrial, and consumer applications. With its robust design and superior quality, it ensures optimal operation even in extreme conditions, delivering efficiency and longevity that enhance your projects. Choose this product to elevate your designs and achieve excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and cost-effectiveness, making this peripheral suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of PCB space, making it ideal for modern, space-constrained electronics.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with a variety of low-voltage systems, enhancing versatility in different environments.

Address Bus Width: 16

A 16-bit address bus width provides a balance between performance and efficiency, allowing for more memory addresses and better data handling.

Package Shape: SQUARE

The square package shape facilitates easier PCB layout and assembly, contributing to a more straightforward manufacturing process.

Power Supplies (V): 5

Operating with a standard 5V power supply makes it convenient to integrate with existing systems, minimizing the need for additional power management.

No. of Terminals: 68

With 68 terminals, this peripheral supports a wide range of connectivity options, making it highly versatile for multiple applications.

Package Style (Meter): CHIP CARRIER

Being a chip carrier allows for easier installation and compatibility with various mounting techniques, enhancing usability.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V supports flexibility in design, accommodating systems that may operate at lower voltages.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures up to 85 °C makes this product suitable for industrial applications where thermal conditions may be harsh.

Minimum Operating Temperature: -40 °C

Operating efficiently in temperatures as low as -40 °C ensures reliability in extreme environments, making it suitable for outdoor or harsh conditions.

Terminal Finish: TIN LEAD

The tin-lead terminal finish offers good solderability and helps in maintaining strong connections over time, promoting product longevity.

Terminal Position: QUAD

The quad terminal position provides enhanced connectivity and simplifies routing on PCBs, improving the overall design layout.

Maximum Seated Height: 4.57 mm

A low maximum seated height allows for compact design and helps in maintaining a low profile in devices.

RAM Words: 512

512 RAM words provide adequate memory capacity for most standard applications, supporting efficient data processing.

Width: 24.1808 mm

The specific width measurement supports standardization in design, making integration into various products easier.

External Data Bus Width: 16

Having a 16-bit external data bus width enhances throughput and data transfer rates, improving overall system performance.

Maximum Clock Frequency: 30 MHz

A maximum clock frequency of 30 MHz supports fast operation speeds, making it suitable for high-performance applications.

Length: 24.1808 mm

Similar to the width, the length measurement aids in maintaining compatibility with existing design layouts.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability and robustness in demanding applications, enhancing product lifespan.

ROM Bits Size: 1024 Bits

A ROM size of 1024 bits provides ample space for storing essential boot and configuration data, enhancing system functionality.

Technology: CMOS

CMOS technology contributes to low power consumption while maintaining high efficiency, crucial for energy-sensitive applications.

Terminal Form: J BEND

J bend terminal form facilitates easier handling and insertion, improving the assembly process.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V harmonizes with common electronics, making it straightforward to adopt in diverse circuits.

Bus Compatibility: 8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Wide bus compatibility ensures that this peripheral can be used with various controllers and microprocessors, enhancing its adaptability.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm provides an optimal balance between pin density and ease of soldering, simplifying assembly.

Maximum Standby Current: 0.00002 Amp

A very low maximum standby current helps in reducing overall power consumption, making it ideal for battery-operated devices.

Maximum Access Time: 0.00000009 ns

An extremely fast maximum access time ensures quick read/write operations, enhancing system responsiveness.

No. of I/O Lines: 40

With 40 I/O lines, this product supports extensive interfacing capabilities, allowing for greater connection options and functionalities.

Technical Specifications

Multi-functional Peripherals ZPSD503B1-90JI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000009 ns

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e0

Length:

24.1808 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

512

ROM Bits Size:

1024 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

24.1808 mm

Trade Compliance

ZPSD503B1-90JI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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