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ZPSD501B1-70LI

STMicroelectronics

ZPSD501B1-70LI by STMicroelectronics

ZPSD501B1-70LI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features UV erasable memory, making it ideal for industrial applications. With a compact ceramic package, it supports various bus types and offers reliable performance in extreme temperatures.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,775 parts In-Stock

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4,775

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Vyrian

USA . 2,104 parts In-Stock

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2,104

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Anansix

USA . 961 parts In-Stock

1+ parts

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961

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 73 parts In-Stock

1+ parts

$19.468

100+ parts

-

1k+ parts

$17.521

10k+ parts

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73

$19.468

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$17.521

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MKK Technologies

India . 1,072 parts In-Stock

1+ parts

$36.609

100+ parts

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1,072

$36.609

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DigiPath Technology Company

USA . 1,072 parts In-Stock

1+ parts

$36.609

100+ parts

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1,072

$36.609

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Corphita

USA . 802 parts In-Stock

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802

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Parana Technologies

USA . 771 parts In-Stock

1+ parts

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$23.277

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771

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$23.277

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Overview

Unlock the potential of your next project with the ZPSD501B1-70LI from STMicroelectronics. Renowned for its commitment to innovation and quality, STMicroelectronics delivers unparalleled reliability in multi-functional peripherals. This versatile device is perfect for industrial applications, offering robust performance across extreme temperatures. Experience exceptional functionality and efficiency that ensures your designs stand out, giving you a competitive edge.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The durable ceramic and metal-sealed co-fired package ensures protection against environmental factors, making it suitable for industrial applications.

Surface Mount: YES

Surface mount technology allows for a compact design and efficient use of space, facilitating integration into modern electronic devices.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V enables compatibility with a wide range of power supply systems.

Address Bus Width: 16

A 16-bit address bus width allows for addressing a larger memory space, enhancing the performance of multitasking operations.

Package Shape: SQUARE

The square package shape is beneficial for uniform thermal distribution, improving performance and reliability.

Power Supplies (V): 5

The standard 5V power supply requirement makes it easy to integrate into existing systems.

No. of Terminals: 68

A higher number of terminals provides greater connectivity options, allowing for more functionalities and features.

Package Style (Meter): CHIP CARRIER, WINDOW

The chip carrier style optimizes PCB space while the window allows for visual inspection, enhancing maintenance capabilities.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V ensures stability in variable voltage conditions, increasing reliability.

Maximum Operating Temperature: 85 °C

Designed for high-temperature environments, this product is reliable in industrial settings that experience significant heat.

Minimum Operating Temperature: -40 °C

The wide operating temperature range (-40 °C to 85 °C) makes this product suitable for extreme environmental conditions.

Terminal Finish: TIN LEAD

The tin-lead terminal finish provides excellent solderability, ensuring reliable long-term connections.

Ultraviolet Erasable: Y

Being ultraviolet erasable allows for easy reprogramming, adding flexibility for product updates and adaptations.

Terminal Position: QUAD

Quad terminal positioning optimizes space on the PCB and allows for better routing of signals.

Maximum Seated Height: 4.57 mm

A low maximum seated height helps in compact designs essential for space-constrained applications.

RAM Words: 512

With 512 RAM words, the device can handle moderate data processing tasks efficiently.

Width: 24.105 mm

A consistent width aids in standardized PCB designs, promoting ease of integration.

External Data Bus Width: 16

A 16-bit external data bus width enhances data transfer rates, improving overall performance in high-speed applications.

Maximum Clock Frequency: 36 MHz

The capability of operating at a maximum clock frequency of 36 MHz allows for fast processing speeds, ideal for demanding applications.

Length: 24.105 mm

A standardized length simplifies the manufacturing process and ensures compatibility with various designs.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature applications, ensuring reliability in harsh environments.

ROM Bits Size: 256 Bits

With 256 bits of ROM storage, this product can execute basic firmware without consuming excessive space.

Technology: CMOS

CMOS technology enables low power consumption and high noise immunity, enhancing overall system efficiency.

Terminal Form: J BEND

J-bend terminals provide strong mechanical stability and are easier to handle during assembly.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V makes the product versatile and compatible with numerous devices.

Bus Compatibility: 8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Wide bus compatibility enhances integration options, allowing the device to be used in various applications seamlessly.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for denser packaging on PCBs, maximizing design efficiency.

Maximum Standby Current: 0.00002 Amp

Extremely low standby current ensures minimal power consumption when not in use, making it energy efficient.

Maximum Access Time: 0.07 ns

A very quick access time improves the response rate of the device, making it suitable for high-speed applications.

No. of I/O Lines: 40

With 40 I/O lines, ample connectivity options are provided for interfacing with other devices and peripherals.

Technical Specifications

Multi-functional Peripherals ZPSD501B1-70LI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000007 ns

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Maximum Clock Frequency:

36 MHz

External Data Bus Width:

16

JESD-30 Code:

S-CQCC-J68

JESD-609 Code:

e0

Length:

24.105 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

512

ROM Bits Size:

256 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

Y

Width:

24.105 mm

Trade Compliance

ZPSD501B1-70LI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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