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ZPSD512B0-70J

STMicroelectronics

ZPSD512B0-70J by STMicroelectronics

ZPSD512B0-70J by STMicroelectronics is a versatile CMOS peripheral with a 16-bit address bus and 40 I/O lines. It operates at 4.5-5.5V, supports up to 36 MHz clock frequency, and is ideal for applications in embedded systems requiring compact design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,895 parts In-Stock

1+ parts

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3,895

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Anansix

USA . 1,919 parts In-Stock

1+ parts

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1,919

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Digiode

USA . 211 parts In-Stock

1+ parts

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211

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 1,144 parts In-Stock

1+ parts

$51.629

100+ parts

-

1k+ parts

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10k+ parts

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1,144

$51.629

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IDEA Electronic Components Group

UK . 1,754 parts In-Stock

1+ parts

$66.795

100+ parts

-

1k+ parts

$60.115

10k+ parts

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1,754

$66.795

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$60.115

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MKK Technologies

India . 2,054 parts In-Stock

1+ parts

$125.603

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2,054

$125.603

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DigiPath Technology Company

USA . 2,054 parts In-Stock

1+ parts

$125.603

100+ parts

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2,054

$125.603

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Corphita

USA . 4,392 parts In-Stock

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4,392

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Parana Technologies

USA . 679 parts In-Stock

1+ parts

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$79.863

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679

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$79.863

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Overview

Elevate your designs with the ZPSD512B0-70J from STMicroelectronics, a leader in innovative semiconductor solutions. This versatile multi-functional peripheral offers exceptional reliability and performance for diverse applications, from consumer electronics to industrial automation. With its robust features and ease of integration, you'll enjoy enhanced efficiency and reduced development time, ensuring your projects shine in today's competitive market. Choose quality, choose ST!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic and epoxy materials ensures durability and lightweight design which is ideal for efficient heat dissipation and portability.

Surface Mount: YES

Surface mount technology allows for compact design and reduced PCB space, making the product suitable for modern electronics with limited real estate.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V adds flexibility for integration into various systems while ensuring safe operation.

Address Bus Width: 16

With a 16-bit address bus width, this peripheral can access a larger memory space, enhancing the device's performance for complex applications.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board, optimizing layout and component placement.

No. of Terminals: 68

Having 68 terminals increases connectivity options, enabling robust integration with other components in a multi-functional system.

Package Style (Meter): CHIP CARRIER

The chip carrier style is designed for ease of handling during manufacturing, reducing assembly time and costs.

Minimum Supply Voltage: 4.5 V

This low minimum supply voltage ensures compatibility with battery-operated devices, extending the product's application range.

Maximum Operating Temperature: 70 °C

A high maximum operating temperature allows the product to function reliably in demanding environments with increased heat exposure.

Minimum Operating Temperature: 0 °C

The cold operating temperature ensures functionality in colder climates, making this peripheral versatile across various conditions.

Terminal Position: QUAD

Quad terminal position promotes easier soldering and better electrical performance, enhancing product reliability.

Maximum Seated Height: 4.57 mm

A low seated height optimizes the form factor, allowing for better compatibility with low-profile designs.

Width: 24.1808 mm

The specific width dimension helps ensure a precise fit for mounting in various electronic devices.

External Data Bus Width: 8

An 8-bit external data bus width facilitates standard data communication protocols, making integration easier with most microcontrollers.

Maximum Clock Frequency: 36 MHz

A clock frequency of 36 MHz allows for better performance in terms of processing speed, suitable for high-speed applications.

Length: 24.1808 mm

The length enables efficient space management, making the design compact without sacrificing performance.

Temperature Grade: COMMERCIAL

A commercial temperature grade indicates reliability for general use in consumer electronics, suitable for a wide market.

Technology: CMOS

CMOS technology provides low power consumption along with high-speed performance, making it energy-efficient.

Terminal Form: J BEND

J bend terminals facilitate easy handling and soldering, enhancing assembly efficiency while reducing manufacturing errors.

Nominal Supply Voltage: 5 V

The nominal voltage of 5 V is a standard level for many electronic devices, ensuring compatibility across a wide range of applications.

Bus Compatibility: 8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Broad bus compatibility allows for integration with multiple architectures, improving the peripheral's usability in various designs.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for a tighter layout, supporting more terminals in a compact area for intricate circuit designs.

No. of I/O Lines: 40

With 40 I/O lines, this peripheral provides significant interfacing capabilities, making it versatile for various input/output configurations.

Technical Specifications

Multi-functional Peripherals ZPSD512B0-70J attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Maximum Clock Frequency:

36 MHz

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

Length:

24.1808 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

24.1808 mm

Trade Compliance

ZPSD512B0-70J Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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