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LS1026ASN8Q1A

NXP Semiconductors

LS1026ASN8Q1A by NXP Semiconductors

LS1026ASN8Q1A by NXP Semiconductors is a multi-functional peripheral with 64-bit external data bus width, 14-bit address bus width, and 780 terminals. It is suitable for applications requiring I2C, PCI, SPI, UART, or USB bus compatibility.

Median Price

$81.597

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 9,960 parts In-Stock

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$81.597

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Flip Electronics (Authorized)

USA . 360 parts In-Stock

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360

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Vyrian

USA . 7,036 parts In-Stock

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7,036

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Digiode

USA . 3,939 parts In-Stock

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Anansix

USA . 502 parts In-Stock

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Flip Electronics

USA . 120 parts In-Stock

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Nova Conductors

Japan . 43 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 360 parts In-Stock

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$1.000

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AZTECH Wire

Italy . 471 parts In-Stock

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$9.862

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Aztec Data Supply Inc.

USA . 2,558 parts In-Stock

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$31.660

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Corohmni

South Africa . 239 parts In-Stock

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$71.507

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Vigor

Singapore . 2,240 parts In-Stock

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$113.820

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Microchip USA

USA . 2,159 parts In-Stock

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$202.773

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UNI Independent Distributors

Spain . 6,567 parts In-Stock

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Continental Prestige Electronics

USA . 4,544 parts In-Stock

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Argo Parts USA

USA . 3,021 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Corphita

USA . 1,975 parts In-Stock

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Overview

Enhance your electronic designs with the LS1026ASN8Q1A by NXP Semiconductors, a cutting-edge multi-functional peripheral that offers unparalleled quality and reliability. Manufactured by industry leaders, this innovative component is perfect for a wide range of applications. With its advanced technology and high-performance features, customers can expect seamless integration and exceptional functionality. Elevate your projects with the LS1026ASN8Q1A and experience the value and benefits it brings to your creations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight, durable, and cost-effective, making it a good choice for a multi-functional peripheral that needs to be portable and long-lasting.

Maximum Supply Voltage: 1.03 V

Having a maximum supply voltage of 1.03V ensures the device can handle a sufficient power input without risking damage, providing stable performance.

External Data Bus Width: 64

A wider external data bus width of 64 bits allows for faster data transfer speeds and increased efficiency when handling multiple tasks simultaneously.

Technology: CMOS

CMOS technology is known for its low power consumption, making the device energy-efficient and suitable for prolonged use without draining the power source quickly.

Nominal Supply Voltage: 1 V

The nominal supply voltage of 1V ensures optimal performance and compatibility with various power sources, making the device versatile and reliable.

Technical Specifications

Multi-functional Peripherals LS1026ASN8Q1A attributes and parameters. Explore more Multi-functional Peripherals devices from NXP Semiconductors

Specs

Address Bus Width:

14

Boundary Scan:

YES

Bus Compatibility:

I2C, PCI, SPI, UART, USB

External Data Bus Width:

64

JESD-30 Code:

S-PBGA-B780

JESD-609 Code:

e1

Length:

23 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

76

No. of Terminals:

780

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

2.61 mm

Maximum Supply Voltage:

1.03 V

Minimum Supply Voltage:

.97 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Trade Compliance

LS1026ASN8Q1A Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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