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LS1046ASN8P1A

NXP Semiconductors

LS1046ASN8P1A by NXP Semiconductors

LS1046ASN8P1A by NXP Semiconductors is a multi-functional peripheral with 64-bit external data bus width, 1400 MHz max clock frequency, and 780 terminals. It is ideal for applications requiring I2C, PCI, SPI, UART, or USB bus compatibility in a compact square package with a terminal pitch of 0.8 mm.

Median Price

$96.787

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 108 parts In-Stock

1+ parts

$99.300

100+ parts

$77.900

1k+ parts

$77.500

10k+ parts

-

108

$99.300

$77.900

$77.500

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Rochester

USA . 3,138 parts In-Stock

1+ parts

-

100+ parts

$77.430

1k+ parts

$69.280

10k+ parts

$65.200

3,138

-

$77.430

$69.280

$65.200

DigiKey

USA . 3,138 parts In-Stock

1+ parts

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3,138

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Verical

USA . 3,020 parts In-Stock

1+ parts

-

100+ parts

$96.787

1k+ parts

$86.600

10k+ parts

$81.500

3,020

-

$96.787

$86.600

$81.500

Flip Electronics (Authorized)

USA . 413 parts In-Stock

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413

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,348 parts In-Stock

1+ parts

$81.719

100+ parts

-

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3,348

$81.719

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Nova Conductors

Japan . 550 parts In-Stock

1+ parts

$101.745

100+ parts

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550

$101.745

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Vyrian

USA . 1,198 parts In-Stock

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1,198

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Anansix

USA . 1,128 parts In-Stock

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Flip Electronics

USA . 335 parts In-Stock

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335

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 276 parts In-Stock

1+ parts

$38.290

100+ parts

-

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276

$38.290

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Corohmni

South Africa . 2,098 parts In-Stock

1+ parts

$41.451

100+ parts

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2,098

$41.451

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Semicontronic

India . 1,339 parts In-Stock

1+ parts

$73.120

100+ parts

$71.292

1k+ parts

$70.926

10k+ parts

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1,339

$73.120

$71.292

$70.926

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Ampacity Inc.

Singapore . 1,210 parts In-Stock

1+ parts

$73.120

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1,210

$73.120

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Corphita

USA . 1,883 parts In-Stock

1+ parts

$77.418

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1,883

$77.418

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Component Stockers USA

USA . 4,136 parts In-Stock

1+ parts

$96.840

100+ parts

$91.020

1k+ parts

$82.310

10k+ parts

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4,136

$96.840

$91.020

$82.310

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Continental Prestige Electronics

USA . 2,301 parts In-Stock

1+ parts

$101.745

100+ parts

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1k+ parts

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10k+ parts

$99.710

2,301

$101.745

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-

$99.710

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$101.745

100+ parts

$99.710

1k+ parts

-

10k+ parts

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2,000

$101.745

$99.710

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Microchip USA

USA . 2,035 parts In-Stock

1+ parts

$131.290

100+ parts

$127.790

1k+ parts

$126.040

10k+ parts

$124.290

2,035

$131.290

$127.790

$126.040

$124.290

Vigor

Singapore . 58 parts In-Stock

1+ parts

$154.220

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58

$154.220

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UNI Independent Distributors

Spain . 7,410 parts In-Stock

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7,410

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Argo Parts USA

USA . 3,855 parts In-Stock

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3,855

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Perfect Parts

USA . 403 parts In-Stock

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403

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Overview

Unleash the power of innovation with NXP Semiconductors' LS1046ASN8P1A, a cutting-edge multi-functional peripherals chip that offers unmatched performance and versatility. With NXP's renowned reputation for manufacturing excellence, this product delivers superior quality and reliability. Ideal for a variety of applications, this chip provides seamless integration and high-speed processing capabilities. Elevate your projects to new heights with the LS1046ASN8P1A and experience the value, benefits, and advantages that only NXP Semiconductors can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product, reducing manufacturing costs.

Maximum Supply Voltage: 1.03 V

The high maximum supply voltage ensures stable operation and reliable performance of the product.

Address Bus Width: 14

The wide address bus width allows for efficient data transfer and processing, enhancing the product's performance.

Package Shape: SQUARE

The square package shape is compact and space-saving, making the product suitable for applications where size constraints are present.

No. of Terminals: 780

The large number of terminals provides ample connectivity options, allowing the product to interface with various devices and peripherals.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array, fine pitch package style enables high-density integration of components, making the product suitable for complex multi-functional applications.

Minimum Supply Voltage: 0.97 V

The low minimum supply voltage ensures energy efficiency and extends the product's battery life in portable devices.

Terminal Finish: TIN SILVER COPPER

The tin-silver-copper terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability of the product.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy and secure connection of the product to external devices or circuit boards.

Maximum Seated Height: 2.61 mm

The low maximum seated height allows for compact and slim design of the product, making it suitable for space-constrained applications.

Width: 23 mm

The narrow width of the product makes it easy to integrate into existing systems or assemblies, enhancing flexibility in product design.

Boundary Scan: YES

Boundary scan capability enables easy testing and debugging of the product during development and production, ensuring high quality and reliability.

External Data Bus Width: 64

The wide external data bus width allows for high-speed data transfer and processing, improving the product's performance in multi-functional tasks.

Maximum Clock Frequency: 1400 MHz

The high maximum clock frequency enables fast and efficient operation of the product, suitable for demanding multi-functional applications.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures the product's components are not exposed to excessive heat, helping to maintain their integrity during manufacturing processes.

Peak Reflow Temperature °C: 250

The high peak reflow temperature allows for reliable soldering of components, ensuring strong connections and robust construction of the product.

Length: 23 mm

The compact length of the product makes it suitable for space-constrained applications, without compromising on functionality or performance.

Technology: CMOS

The CMOS technology used in the product enables low power consumption and high-speed operation, making it efficient for multi-functional tasks.

Terminal Form: BALL

The ball terminal form provides easy and reliable connections, reducing the risk of signal loss or disconnection in the product.

Nominal Supply Voltage: 1 V

The nominal supply voltage ensures stable and consistent power supply to the product, supporting its reliable and continuous operation.

Bus Compatibility: I2C, PCI, SPI, UART, USB

The wide range of bus compatibility options allows the product to interface with various devices and systems, enhancing its versatility and usability.

Terminal Pitch: 0.8 mm

The small terminal pitch enables high-density packaging of components, optimizing space utilization and enhancing the product's performance.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that the product can withstand moderate exposure to moisture, ensuring reliability in various environmental conditions.

No. of I/O Lines: 76

The large number of I/O lines allows for versatile connectivity options, enabling the product to interface with a wide range of external devices and peripherals.

Technical Specifications

Multi-functional Peripherals LS1046ASN8P1A attributes and parameters. Explore more Multi-functional Peripherals devices from NXP Semiconductors

Specs

Address Bus Width:

14

Boundary Scan:

YES

Bus Compatibility:

I2C, PCI, SPI, UART, USB

Maximum Clock Frequency:

1400 MHz

External Data Bus Width:

64

JESD-30 Code:

S-PBGA-B780

JESD-609 Code:

e1

Length:

23 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

76

No. of Terminals:

780

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

2.61 mm

Maximum Supply Voltage:

1.03 V

Minimum Supply Voltage:

.97 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Trade Compliance

LS1046ASN8P1A Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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