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PSD513B1-70J

STMicroelectronics

PSD513B1-70J by STMicroelectronics

PSD513B1-70J by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max supply voltage of 5.5V. It features 1024 RAM words and supports various bus types, making it ideal for embedded applications. Its compact chip carrier design ensures efficient integration in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,789 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,789

-

-

-

-

Vyrian

USA . 2,780 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,780

-

-

-

-

Anansix

USA . 2,634 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,634

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,244 parts In-Stock

1+ parts

$14.127

100+ parts

-

1k+ parts

$12.714

10k+ parts

-

2,244

$14.127

-

$12.714

-

MKK Technologies

India . 1,455 parts In-Stock

1+ parts

$26.564

100+ parts

-

1k+ parts

-

10k+ parts

-

1,455

$26.564

-

-

-

DigiPath Technology Company

USA . 1,455 parts In-Stock

1+ parts

$26.564

100+ parts

-

1k+ parts

-

10k+ parts

-

1,455

$26.564

-

-

-

Corohmni

South Africa . 100 parts In-Stock

1+ parts

$76.930

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$76.930

-

-

-

Corphita

USA . 724 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

724

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-

-

-

Parana Technologies

USA . 267 parts In-Stock

1+ parts

-

100+ parts

$16.890

1k+ parts

-

10k+ parts

-

267

-

$16.890

-

-

Overview

Unlock the potential of your designs with the PSD513B1-70J from STMicroelectronics, a leader in innovative semiconductor solutions. This versatile multi-functional peripheral combines reliability and efficiency, perfect for advanced applications across automotive, industrial, and consumer electronics. Benefit from its compact design and superior performance, ensuring enhanced functionality while minimizing power consumption. Elevate your projects with unmatched quality and groundbreaking technology—choose STMicroelectronics for excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection from environmental factors, making the peripheral reliable for various applications.

Surface Mount: YES

Surface mount technology enables compact designs and efficient use of space on the PCB, which is advantageous for multi-functional peripherals.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with a wide range of electronic equipment while optimizing power consumption.

Address Bus Width: 16

A 16-bit address bus width allows for a larger memory addressing capability, enhancing performance in data-intensive applications.

Package Shape: SQUARE

The square package shape facilitates efficient board layout and space-saving designs in compact peripheral systems.

Power Supplies (V): 5

Designed for 5V power supply, this peripheral matches common voltage levels in many systems, simplifying integration.

No. of Terminals: 68

Having 68 terminals increases connectivity options, allowing for versatile integration with various components.

Package Style (Meter): CHIP CARRIER

The chip carrier package style is ideal for high-density interconnections, supporting efficient signal integrity and performance.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V ensures stable operation under varying conditions, increasing the product's reliability.

Maximum Operating Temperature: 70 °C

Operating at a maximum temperature of 70 °C ensures that the peripheral can withstand typical operating environments without failure.

Minimum Operating Temperature: 0 °C

A minimum operating temperature of 0 °C allows for functionality in cooler environments, widening the application range.

Terminal Finish: TIN LEAD

The tin-lead finish provides excellent solderability and enhances the overall durability of the connections.

Terminal Position: QUAD

Quad terminal positioning enhances the ease of mounting and improves space efficiency on PCBs.

Maximum Seated Height: 4.57 mm

The low seated height of 4.57 mm allows for compact designs, making the product suitable for space-constrained environments.

RAM Words: 1024

With 1024 RAM words, this product supports diverse applications requiring substantial memory for temporary data storage.

Width: 24.18 mm

A width of 24.18 mm strikes a balance between compactness and stability in physical applications.

External Data Bus Width: 8

An 8-bit external data bus width ensures compatibility with a wide array of existing technologies while offering efficient data handling.

Maximum Clock Frequency: 50 MHz

A maximum clock frequency of 50 MHz allows for rapid processing, enhancing the overall performance of the multi-functional peripheral.

Length: 24.18 mm

The length of 24.18 mm complements the width, resulting in a square form factor that is optimal for certain applications.

Temperature Grade: COMMERCIAL

Commercial temperature grading ensures the product can operate reliably within standard environmental conditions encountered in typical usage.

ROM Bits Size: 1024 Bits

With a ROM size of 1024 bits, this peripheral can store firmware or critical data, thus ensuring efficient operation in various applications.

Technology: CMOS

CMOS technology offers low power consumption, making it ideal for battery-operated and energy-sensitive applications.

Terminal Form: J BEND

J bend terminals provide improved mechanical stability and solder joint integrity, enhancing the product's overall reliability.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V is standard in the industry, ensuring easy integration and compatibility with other devices.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Wide bus compatibility allows this peripheral to work with numerous microcontrollers and processors, enhancing its applicability across various platforms.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch facilitates easier soldering and ensures compact layouts in PCB design.

Maximum Standby Current: 0.00002 Amp

A maximum standby current of 0.00002 A helps conserve power during non-active periods, making it energy-efficient.

Maximum Access Time: 0.00000007 ns

Extremely low access time ensures rapid data retrieval, improving the efficiency and speed of operations.

No. of I/O Lines: 40

With 40 I/O lines, this product supports extensive peripheral connectivity, catering to a broad range of functionalities.

Technical Specifications

Multi-functional Peripherals PSD513B1-70J attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000007 ns

Additional Features:

128K X 8 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e0

Length:

24.18 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

1024

ROM Bits Size:

1024 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

24.18 mm

Trade Compliance

PSD513B1-70J Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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