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PSD501B1-70L

STMicroelectronics

PSD501B1-70L by STMicroelectronics

PSD501B1-70L by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features 512 RAM words and supports various bus types, making it ideal for embedded systems. Its ceramic, metal-sealed package ensures durability in commercial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,295 parts In-Stock

1+ parts

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3,295

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Digiode

USA . 1,480 parts In-Stock

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1,480

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Anansix

USA . 96 parts In-Stock

1+ parts

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96

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 253 parts In-Stock

1+ parts

$61.265

100+ parts

-

1k+ parts

$55.138

10k+ parts

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253

$61.265

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$55.138

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MKK Technologies

India . 1,357 parts In-Stock

1+ parts

$115.204

100+ parts

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1,357

$115.204

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DigiPath Technology Company

USA . 1,357 parts In-Stock

1+ parts

$115.204

100+ parts

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1,357

$115.204

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Corphita

USA . 3,844 parts In-Stock

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3,844

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Parana Technologies

USA . 1,803 parts In-Stock

1+ parts

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$73.251

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1,803

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$73.251

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Overview

Unlock unparalleled performance with the PSD501B1-70L by STMicroelectronics, a leader in innovative semiconductor solutions. This multi-functional peripheral shines in various applications, from industrial automation to consumer electronics, thanks to its robust design and superior reliability. With cutting-edge technology and a commitment to quality, STMicroelectronics ensures you benefit from enhanced efficiency and longevity, empowering your projects to reach new heights.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The durable ceramic and metal-sealed package offers excellent thermal stability and protection, making it suitable for high-performance applications.

Surface Mount: YES

Surface mount technology enables compact design and easy integration into modern PCB layouts, ensuring efficient space utilization.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with various power systems while maintaining reliability.

Address Bus Width: 16

The 16-bit address bus width supports a wide range of memory addresses, enhancing the device's capacity to handle larger data sets.

Package Shape: SQUARE

The square package shape simplifies PCB design and can improve thermal performance due to a balanced distribution of heat.

No. of Terminals: 68

With 68 terminals, this device offers extensive connectivity options for various peripheral components, allowing for greater flexibility in design.

Package Style (Meter): CHIP CARRIER, WINDOW

The chip carrier package style provides ease of handling and assembly while allowing visual inspection of the die for quality assurance.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5 V ensures reliable operation in a variety of environments, promoting stability in performance.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this product is suitable for use in moderately high-temperature applications, enhancing its versatility.

Minimum Operating Temperature: 0 °C

The ability to operate from 0 °C allows this device to function effectively in cooler environments, broadening application possibilities.

Terminal Position: QUAD

The quad terminal positioning allows for better electrical performance and easier routing on printed circuit boards.

Maximum Seated Height: 4.57 mm

A low maximum seated height of 4.57 mm helps maintain compact designs and fits well in space-constrained applications.

RAM Words: 512

512 RAM words provide sufficient memory for temporary data storage and processing, enhancing the device's overall speed and efficiency.

Width: 24.105 mm

With a width of 24.105 mm, this device can easily fit into standard layouts, facilitating ease of integration into existing systems.

External Data Bus Width: 16

A 16-bit external data bus width allows for high-speed data transfer rates, improving the responsiveness of connected devices.

Maximum Clock Frequency: 50 MHz

A maximum clock frequency of 50 MHz supports high-speed operations, making it ideal for performance-critical applications.

Length: 24.105 mm

The length of 24.105 mm ensures compatibility with standard PCB layouts, offering ease of assembly and design integration.

Temperature Grade: COMMERCIAL

Commercial temperature grade allows this device to perform reliably in typical operational environments, suitable for a wide range of applications.

Technology: CMOS

CMOS technology provides lower power consumption and higher efficiency, enhancing battery life in portable applications.

Terminal Form: J BEND

The J Bend terminal form ensures reliable mechanical connections and is commonly used in surface mount technology for better electrical performance.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V fits industry standards, ensuring compatibility with a broad range of electronic systems.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

The extensive bus compatibility ensures that this device can interface easily with many existing systems, enhancing its adaptability.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch is commonly used, making this device compatible with a variety of mounting technology and enabling dense component layouts.

No. of I/O Lines: 40

With 40 I/O lines, this product provides ample connectivity for interfacing with sensors, peripherals, and other devices, increasing its functionality.

Technical Specifications

Multi-functional Peripherals PSD501B1-70L attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

JESD-30 Code:

S-CQCC-J68

Length:

24.105 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Qualification:

Not Qualified

RAM Words:

512

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

24.105 mm

Trade Compliance

PSD501B1-70L Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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