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PSD501B1-15UI

STMicroelectronics

PSD501B1-15UI by STMicroelectronics

The STMicroelectronics PSD501B1-15UI is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features 512 RAM words, supports various bus types, and functions effectively in industrial applications from -40 °C to 85°C. Its low-profile design makes it ideal for space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,859 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,859

-

-

-

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Digiode

USA . 3,769 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,769

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-

-

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Anansix

USA . 2,424 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

2,424

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-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 410 parts In-Stock

1+ parts

$24.788

100+ parts

-

1k+ parts

$22.309

10k+ parts

-

410

$24.788

-

$22.309

-

MKK Technologies

India . 330 parts In-Stock

1+ parts

$46.611

100+ parts

-

1k+ parts

-

10k+ parts

-

330

$46.611

-

-

-

DigiPath Technology Company

USA . 330 parts In-Stock

1+ parts

$46.611

100+ parts

-

1k+ parts

-

10k+ parts

-

330

$46.611

-

-

-

Parana Technologies

USA . 1,453 parts In-Stock

1+ parts

-

100+ parts

$29.637

1k+ parts

-

10k+ parts

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1,453

-

$29.637

-

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Corphita

USA . 1,001 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,001

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Overview

Elevate your projects with the PSD501B1-15UI from STMicroelectronics, a leader in high-quality multi-functional peripherals. Designed for versatility, this low-profile component ensures optimal performance across various applications, from industrial automation to consumer electronics. Its robust architecture guarantees reliability under extreme temperatures, making it ideal for challenging environments. Invest in the PSD501B1-15UI and unlock unparalleled value, efficiency, and innovation for your designs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy materials ensures the product is lightweight yet robust, making it suitable for various environments.

Surface Mount: YES

Surface mount technology allows for efficient use of PCB space, making it easier to integrate into compact designs.

Maximum Supply Voltage: 5.5 V

The flexibility to operate up to 5.5 V makes the product compatible with a wide range of electronic circuits.

Address Bus Width: 16

A 16-bit address bus width allows for addressing a larger memory space, enhancing data handling capabilities.

Package Shape: SQUARE

The square package shape facilitates easier placement and alignment on printed circuit boards.

Power Supplies (V): 5

Operating on a standard 5V power supply makes it convenient for integration into existing systems.

No. of Terminals: 80

With 80 terminals, the product provides ample connectivity options for various applications.

Package Style (Meter): FLATPACK, LOW PROFILE

The flatpack, low-profile design helps save space in compact electronic devices.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V ensures consistent operation during voltage fluctuations.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C indicates reliability in high-temperature environments.

Minimum Operating Temperature: -40 °C

A wide temperature range from -40 °C to 85 °C makes this product suitable for industrial applications.

Terminal Finish: TIN LEAD

Tin-lead terminal finishes offer excellent solderability and corrosion resistance, enhancing longevity.

Terminal Position: QUAD

Quad terminal positioning provides versatility in mounting options and connection flexibility.

Maximum Seated Height: 1.6 mm

A maximum seated height of 1.6 mm fits easily into low-profile designs, maximizing efficiency.

RAM Words: 512

Having 512 RAM words allows for efficient data storage and processing, beneficial for multitasking.

Width: 14 mm

A compact width of 14 mm enables integration into tight spaces without compromising performance.

External Data Bus Width: 16

A 16-bit external data bus enhances data throughput, making it suitable for high-speed applications.

Maximum Clock Frequency: 34.48 MHz

Operating at a maximum clock frequency of 34.48 MHz ensures high-performance processing for demanding tasks.

Length: 14 mm

The 14 mm length allows for high-density PCB designs, keeping devices compact and efficient.

Temperature Grade: INDUSTRIAL

Adhering to industrial temperature grades ensures performance and reliability in harsh environments.

ROM Bits Size: 256 Bits

With 256 bits of ROM, the product provides essential fundamental programming and system instructions.

Technology: CMOS

CMOS technology contributes to low power consumption and high-speed operation, making it energy efficient.

Terminal Form: GULL WING

Gull wing terminals allow for easy handling and soldering, ensuring reliable connections.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is standard in many applications, ensuring easy integration.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Broad bus compatibility makes this product versatile and adaptable to various systems and architectures.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm optimizes layout density, making it suitable for modern, compact PCB designs.

Maximum Standby Current: 0.00002 Amp

Extremely low standby current helps to conserve energy, making the product ideal for battery-operated devices.

Maximum Access Time: 0.00000015 ns

Fast access time guarantees quick response, crucial for high-speed applications and real-time processing.

No. of I/O Lines: 40

40 I/O lines provide a rich interface for connecting multiple peripherals and expanding functionality.

Technical Specifications

Multi-functional Peripherals PSD501B1-15UI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000015 ns

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

34.48 MHz

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e0

Length:

14 mm

No. of I/O Lines:

40

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

512

ROM Bits Size:

256 Bits

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

14 mm

Trade Compliance

PSD501B1-15UI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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