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ZPSD511B1-90JI

STMicroelectronics

ZPSD511B1-90JI by STMicroelectronics

ZPSD511B1-90JI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features 1024 RAM words, supports various bus types, and functions effectively in industrial applications. Its compact design ensures efficient performance across -40 °C to 85 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,255 parts In-Stock

1+ parts

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2,255

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Vyrian

USA . 1,908 parts In-Stock

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1,908

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Anansix

USA . 402 parts In-Stock

1+ parts

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402

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,373 parts In-Stock

1+ parts

$40.106

100+ parts

-

1k+ parts

$36.096

10k+ parts

-

2,373

$40.106

-

$36.096

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MKK Technologies

India . 456 parts In-Stock

1+ parts

$75.418

100+ parts

-

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456

$75.418

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DigiPath Technology Company

USA . 456 parts In-Stock

1+ parts

$75.418

100+ parts

-

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456

$75.418

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Corohmni

South Africa . 2,637 parts In-Stock

1+ parts

$81.065

100+ parts

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2,637

$81.065

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Corphita

USA . 2,087 parts In-Stock

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2,087

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Parana Technologies

USA . 456 parts In-Stock

1+ parts

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$47.953

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456

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$47.953

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Overview

Unlock unparalleled performance with the ZPSD511B1-90JI from STMicroelectronics, a leader in innovative technology. This versatile chip seamlessly bridges multiple functionalities, making it perfect for industrial applications where reliability and efficiency are paramount. With enhanced durability under extreme temperatures and robust design, it ensures longevity and stability in demanding environments. Elevate your projects with a trusted solution that optimizes your operations and delivers exceptional value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and resilience, making the product suitable for various industrial applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of space on printed circuit boards.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides versatility in a range of environments, ensuring compatibility with various devices.

Address Bus Width: 16

A 16-bit address bus width enables access to a larger memory space, enhancing the device's capability to handle complex tasks.

Package Shape: SQUARE

The square shape allows for easy placement and alignment on circuit boards, optimizing space utilization.

Power Supplies (V): 5

Operating on a standard 5 V supply makes integration with other components straightforward, reducing complexity.

No. of Terminals: 68

With 68 terminals, the device offers multiple connectivity options, supporting various interfacing requirements.

Package Style (Meter): CHIP CARRIER

The chip carrier package style enhances heat dissipation and provides robust mounting options on PCBs.

Minimum Supply Voltage: 4.5 V

A low minimum supply voltage increases the device's utility in low-power applications, promoting energy efficiency.

Maximum Operating Temperature: 85 °C

Designed to operate at high temperatures, this product ensures reliability in challenging environments.

Minimum Operating Temperature: -40 °C

Withstanding low temperatures guarantees functionality in extreme conditions, making it ideal for industrial use.

Terminal Finish: TIN LEAD

The tin-lead finish enhances solderability and reliability of connections, ensuring long-lasting performance.

Ultraviolet Erasable: N

Not being UV erasable simplifies the design, reducing the complexity involved in programming and memory management.

Terminal Position: QUAD

Quad terminal positioning facilitates easier layout and routing options on PCBs, significantly improving design flexibility.

Maximum Seated Height: 4.57 mm

A low seated height helps in achieving compact designs, essential for modern electronics with space constraints.

RAM Words: 1024

With 1024 RAM words, the device can efficiently handle moderate data processing tasks, providing decent performance.

Width: 24.1808 mm

The specified width aligns with various standard footprints, making integration easier within existing designs.

External Data Bus Width: 8

An 8-bit external data bus width balances performance with simplicity, suitable for straightforward data transfer applications.

Maximum Clock Frequency: 30 MHz

A maximum clock frequency of 30 MHz allows for rapid data processing, enhancing overall device performance.

Length: 24.1808 mm

This length also conforms to standard sizes, making it compatible with a wide array of hardware designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grading guarantees the device is built for long-term reliability in harsh environments.

ROM Bits Size: 256 Bits

With 256 bits of ROM, the device is adequately provisioned for firmware storage requirements in various applications.

Technology: CMOS

CMOS technology allows for low power consumption and high-speed operation, making it suitable for modern applications.

Terminal Form: J BEND

J bend terminals facilitate easy handling and secure connection to boards, simplifying the installation process.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V aligns with many devices, enhancing compatibility and ease of integration.

Bus Compatibility: 8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Wide bus compatibility ensures that this product can be integrated into various existing systems without modifications.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm supports high-density designs while maintaining ease of soldering and PCB layout.

Maximum Standby Current: 0.00002 Amp

Ultra-low maximum standby current enhances power efficiency, making this device suitable for battery-operated applications.

Maximum Access Time: 0.00000009 ns

An extremely low access time allows for near-instantaneous data retrieval, critical for high-speed processing tasks.

No. of I/O Lines: 40

With 40 I/O lines, this product offers substantial interfacing capabilities, accommodating complex configurations and devices.

Technical Specifications

Multi-functional Peripherals ZPSD511B1-90JI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000009 ns

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e0

Length:

24.1808 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

1024

ROM Bits Size:

256 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

24.1808 mm

Trade Compliance

ZPSD511B1-90JI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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