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ZPSD502B1-15LI

STMicroelectronics

ZPSD502B1-15LI by STMicroelectronics

ZPSD502B1-15LI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features UV erasable memory, making it ideal for industrial applications requiring reliability in extreme temperatures (-40 °C to 85 °C). With a compact ceramic package and 68 terminals, it's perfect for space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,737 parts In-Stock

1+ parts

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3,737

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Anansix

USA . 2,671 parts In-Stock

1+ parts

-

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1k+ parts

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2,671

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Digiode

USA . 1,533 parts In-Stock

1+ parts

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1,533

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,343 parts In-Stock

1+ parts

$71.575

100+ parts

-

1k+ parts

$64.418

10k+ parts

-

2,343

$71.575

-

$64.418

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MKK Technologies

India . 1,355 parts In-Stock

1+ parts

$134.592

100+ parts

-

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-

10k+ parts

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1,355

$134.592

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DigiPath Technology Company

USA . 1,355 parts In-Stock

1+ parts

$134.592

100+ parts

-

1k+ parts

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10k+ parts

-

1,355

$134.592

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-

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Corphita

USA . 2,264 parts In-Stock

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2,264

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Parana Technologies

USA . 522 parts In-Stock

1+ parts

-

100+ parts

$85.579

1k+ parts

-

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522

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$85.579

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Overview

Unlock unparalleled performance with the ZPSD502B1-15LI from STMicroelectronics, a leader in innovative technology. This versatile multi-functional peripheral enhances your designs with robust reliability and advanced features suited for industrial applications. Its superior ceramic and metal-sealed construction ensure durability even in extreme environments. Experience seamless integration, reduced downtime, and exceptional value that will elevate your projects to new heights!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

Durable materials ensure better protection against environmental factors, enhancing longevity.

Surface Mount: YES

Surface mount technology allows for compact designs and improved performance in multi-functional peripherals.

Maximum Supply Voltage: 5.5 V

Allows for a wide range of power supply options while ensuring stable operation.

Address Bus Width: 16

16-bit address bus supports efficient data handling and increases the device's overall performance.

Package Shape: SQUARE

Square package shape improves space utilization in PCB layouts.

Power Supplies (V): 5

Standard 5V power supply simplifies integration into existing systems.

No. of Terminals: 68

A higher number of terminals enhances connectivity options for additional peripherals.

Package Style (Meter): CHIP CARRIER, WINDOW

Chip carrier packaging with a window provides easy visual inspection of the chip.

Minimum Supply Voltage: 4.5 V

Allows for flexibility in lower voltage operations without compromising performance.

Maximum Operating Temperature: 85 °C

Operating at higher temperatures ensures reliability in industrial applications.

Minimum Operating Temperature: -40 °C

Wide temperature range supports deployment in extreme environments.

Terminal Finish: TIN LEAD

Tin-lead finish enhances solderability, ensuring reliable connections.

Ultraviolet Erasable: Y

UV erasable feature enables easy reprogramming, saving time during prototype development.

Terminal Position: QUAD

Quad terminal positioning allows for effective board layout and better signal integrity.

Maximum Seated Height: 4.57 mm

Compact height maintains a low profile on PCBs, making it suitable for space-constrained applications.

RAM Words: 512

512 words of RAM support efficient data processing for multi-functional tasks.

Width: 24.105 mm

Standard width facilitates easy integration into pre-existing designs.

External Data Bus Width: 16

16-bit data bus enhances the throughput and efficiency of data transfer.

Maximum Clock Frequency: 34.48 MHz

High clock frequency enables faster processing, improving overall device performance.

Length: 24.105 mm

Standard length allows compatibility with various components and designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures use in robust and demanding environments.

ROM Bits Size: 512 Bits

512 bits of ROM provides sufficient storage for firmware and essential operations.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity.

Terminal Form: J BEND

J bend terminals provide robust connection options for secure mounting.

Nominal Supply Voltage: 5 V

Nominal voltage supports consistent performance across different applications.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Broad bus compatibility allows for versatile application across many systems and technologies.

Terminal Pitch: 1.27 mm

Standard terminal pitch enhances soldering accuracy and eases PCB design.

Maximum Standby Current: 0.00002 Amp

Extremely low standby current contributes to energy efficiency in multi-functional applications.

Maximum Access Time: 0.00000015 ns

Fast access time ensures quick data retrieval, boosting system performance.

No. of I/O Lines: 40

40 I/O lines enable multiple connections and facilitate complex functionalities.

Technical Specifications

Multi-functional Peripherals ZPSD502B1-15LI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000015 ns

Additional Features:

32K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

34.48 MHz

External Data Bus Width:

16

JESD-30 Code:

S-CQCC-J68

JESD-609 Code:

e0

Length:

24.105 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

512

ROM Bits Size:

512 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

Y

Width:

24.105 mm

Trade Compliance

ZPSD502B1-15LI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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