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CY8C24423A-24LTXI

Infineon Technologies

CY8C24423A-24LTXI by Infineon Technologies

CY8C24423A-24LTXI by Infineon: 8-bit, 24.6 MHz CPU with 4096 ROM words and 256 RAM bytes. Ideal for industrial applications with USB bus compatibility and operating temperature range of -40 to 85 °C.

Median Price

$5.040

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 90 parts In-Stock

1+ parts

$3.250

100+ parts

$2.250

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-

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90

$3.250

$2.250

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Chip1Stop

Japan . 933 parts In-Stock

1+ parts

$5.030

100+ parts

$3.310

1k+ parts

-

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933

$5.030

$3.310

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Mouser Electronics

USA . 3,714 parts In-Stock

1+ parts

$5.050

100+ parts

$3.260

1k+ parts

$3.100

10k+ parts

-

3,714

$5.050

$3.260

$3.100

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DigiKey

USA . 2,872 parts In-Stock

1+ parts

$5.050

100+ parts

$3.252

1k+ parts

$3.100

10k+ parts

-

2,872

$5.050

$3.252

$3.100

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Newark

USA . 90 parts In-Stock

1+ parts

$5.200

100+ parts

$3.880

1k+ parts

$3.630

10k+ parts

-

90

$5.200

$3.880

$3.630

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Element14

Singapore . 90 parts In-Stock

1+ parts

$6.940

100+ parts

$5.120

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-

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90

$6.940

$5.120

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Rochester

USA . 2,259 parts In-Stock

1+ parts

-

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$3.100

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$2.770

10k+ parts

$2.610

2,259

-

$3.100

$2.770

$2.610

Verical

USA . 2,102 parts In-Stock

1+ parts

-

100+ parts

$3.875

1k+ parts

$3.462

10k+ parts

$3.263

2,102

-

$3.875

$3.462

$3.263

Flip Electronics (Authorized)

USA . 148 parts In-Stock

1+ parts

-

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148

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Distributors (In-Stock)

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Digiode

USA . 228 parts In-Stock

1+ parts

$2.840

100+ parts

-

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228

$2.840

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Vyrian

USA . 559 parts In-Stock

1+ parts

$2.990

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559

$2.990

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IBS Electronics

USA . 1,787 parts In-Stock

1+ parts

$4.090

100+ parts

$4.355

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1,787

$4.090

$4.355

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Chip Stock

USA . 10,700 parts In-Stock

1+ parts

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10,700

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Flip Electronics

USA . 148 parts In-Stock

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148

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Electronics Depot

USA . 5 parts In-Stock

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 164 parts In-Stock

1+ parts

$2.691

100+ parts

-

1k+ parts

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164

$2.691

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Ampacity Inc.

Singapore . 1,217 parts In-Stock

1+ parts

$2.810

100+ parts

-

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1,217

$2.810

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Modulus Dynamics

Lithuania . 770 parts In-Stock

1+ parts

$3.993

100+ parts

$3.833

1k+ parts

$3.674

10k+ parts

-

770

$3.993

$3.833

$3.674

-

Corohmni

South Africa . 30 parts In-Stock

1+ parts

$3.993

100+ parts

-

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30

$3.993

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Component Stockers USA

USA . 7,102 parts In-Stock

1+ parts

$6.430

100+ parts

$4.030

1k+ parts

$3.230

10k+ parts

$4.100

7,102

$6.430

$4.030

$3.230

$4.100

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$56.000

100+ parts

$50.960

1k+ parts

$45.920

10k+ parts

-

1,000

$56.000

$50.960

$45.920

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A-Z Elektronik GmbH

Germany . 7,088 parts In-Stock

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7,088

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Alle Elektronik GmbH

Germany . 4,725 parts In-Stock

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4,725

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QUARKTWIN TECHNOLOGY LTD

USA . 4,339 parts In-Stock

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4,339

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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ChipstoGo Electronic ltd

UK . 3,707 parts In-Stock

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3,707

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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3,700

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Aranea Global

USA . 2,000 parts In-Stock

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2,000

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Continental Prestige Electronics

USA . 1,798 parts In-Stock

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1,798

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Argo Parts USA

USA . 1,256 parts In-Stock

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1,256

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Perfect Parts

USA . 888 parts In-Stock

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888

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Overview

Discover endless possibilities with the CY8C24423A-24LTXI by Infineon Technologies, a cutting-edge multi-functional peripheral designed to elevate your projects to new heights. With a robust package style, wide operating temperature range, and compatibility with USB bus, this product offers unparalleled value and flexibility. From industrial applications to consumer electronics, this versatile chip carrier is the perfect solution for all your needs. Experience the quality and innovation that only Infineon Technologies can deliver, and unlock a world of possibilities with the CY8C24423A-24LTXI.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and reliable installation onto a circuit board for seamless integration.

Maximum Supply Voltage: 5.25 V

Provides a wide voltage range for flexibility in power supply options.

Package Shape: SQUARE

Compact and efficient design for space-saving applications.

Bit Size: 8

Offers sufficient processing power for multi-functional operations.

Power Supplies (V): 2.7/5

Supports multiple voltage inputs for versatile power options.

No. of Terminals: 32

Plenty of terminals for connecting to various components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Variety of package styles to suit different mounting and heat dissipation needs.

Minimum Supply Voltage: 4.75 V

Ensures stable operation even at lower supply voltages.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures for reliable performance in tough environments.

CPU Family: M8C

Specialized CPU family optimized for multi-functional tasks.

Minimum Operating Temperature: -40 °C

Capable of operating in cold temperatures for versatility in deployment.

Terminal Finish: NICKEL PALLADIUM GOLD

Durable and corrosion-resistant finish for long-term reliability.

Terminal Position: QUAD

Quad terminal configuration for efficient connectivity and signal transmission.

ROM Words: 4096

Large ROM capacity for storing program instructions and data.

Maximum Seated Height: 1 mm

Low profile design for compact and space-constrained installations.

RAM Words: 256

Adequate RAM capacity for temporary data storage and swift processing.

Width: 5 mm

Narrow width for fitting into tight spaces or alongside other components.

Maximum Clock Frequency: 24.6 MHz

High clock frequency for rapid data processing and response times.

Maximum Time At Peak Reflow Temperature (s): 40

Can withstand peak reflow temperatures for efficient soldering processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance for robust soldering operations.

Length: 5 mm

Compact length for space-saving installations.

Temperature Grade: INDUSTRIAL

Suitable for industrial environments with varying temperature conditions.

RAM Bytes: 256

Sufficient RAM capacity in bytes for handling data-intensive tasks.

Technology: CMOS

CMOS technology for efficient power consumption and high performance.

Terminal Form: NO LEAD

Lead-free terminal form for environmental friendliness and compliance.

Maximum Supply Current: 8 mA

Low supply current for energy-efficient operation.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage for consistent performance.

ROM Programmability: FLASH

Flash ROM programmability for easy updates and customization of firmware.

Bus Compatibility: USB

USB bus compatibility for seamless connectivity and data exchange.

Terminal Pitch: 0.5 mm

Fine terminal pitch for compact layout and efficient signal transmission.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity level for robust performance in various environments.

Speed: 24 rpm

Decent speed for efficient data processing and multitasking capabilities.

No. of I/O Lines: 24

Sufficient I/O lines for interfacing with external devices and peripherals.

Technical Specifications

Multi-functional Peripherals CY8C24423A-24LTXI attributes and parameters. Explore more Multi-functional Peripherals devices from Infineon Technologies

Specs

Additional Features:

ALSO OPERATES AT 2.7V AND 3.3V SUPPLY

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

Bus Compatibility:

USB

CPU Family:

M8C

Maximum Clock Frequency:

24.6 MHz

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

24

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.7/5

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

256

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

8 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

5 mm

Trade Compliance

CY8C24423A-24LTXI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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