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CY8C5888LTI-LP097

Infineon Technologies

CY8C5888LTI-LP097 by Infineon Technologies

CY8C5888LTI-LP097 by Infineon operates at 1.71-5.5V with 32768 RAM words, 2097152 ROM bits, and 33MHz clock frequency. Ideal for industrial applications, it features I2C and USB bus compatibility with a quad terminal position in a square package style.

Median Price

$23.218

Lifecycle Status

Suppliers In-Stock

22

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 314 parts In-Stock

1+ parts

$17.400

100+ parts

$15.400

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314

$17.400

$15.400

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Arrow

USA . 4 parts In-Stock

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$17.520

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4

$17.520

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Verical

USA . 1,628 parts In-Stock

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$20.252

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$20.252

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Farnell

UK . 2,431 parts In-Stock

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$26.184

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$20.618

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2,431

$26.184

$20.618

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DigiKey

USA . 1,525 parts In-Stock

1+ parts

$26.680

100+ parts

$18.766

1k+ parts

$17.656

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-

1,525

$26.680

$18.766

$17.656

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Mouser Electronics

USA . 12 parts In-Stock

1+ parts

$26.680

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$18.770

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$18.070

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12

$26.680

$18.770

$18.070

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Element14

Singapore . 2,930 parts In-Stock

1+ parts

$37.800

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$27.840

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$37.800

$27.840

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Rochester

USA . 82 parts In-Stock

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$16.160

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$14.460

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$13.610

82

-

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$14.460

$13.610

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 764 parts In-Stock

1+ parts

$16.274

100+ parts

-

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764

$16.274

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Nova Conductors

Japan . 300 parts In-Stock

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$22.630

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300

$22.630

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Chip Stock

USA . 5,200 parts In-Stock

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Bristol Electronics

USA . 1,851 parts In-Stock

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Vyrian

USA . 972 parts In-Stock

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Rutronik

Germany . 520 parts In-Stock

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$20.100

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520

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$20.100

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DigiKey Marketplace

USA . 385 parts In-Stock

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385

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Cyclops Electronics Ltd

UK . 300 parts In-Stock

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300

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Component Sense

UK . 246 parts In-Stock

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246

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IBS Electronics

USA . 205 parts In-Stock

1+ parts

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$24.698

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-

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$24.698

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New Tech Sourcing

USA . 200 parts In-Stock

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200

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Elcom Components

USA . 15 parts In-Stock

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15

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Prism Electronics

USA . 7 parts In-Stock

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7

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Semtec, LLC

USA . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 745 parts In-Stock

1+ parts

$14.140

100+ parts

$13.786

1k+ parts

$13.716

10k+ parts

-

745

$14.140

$13.786

$13.716

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Ampacity Inc.

Singapore . 680 parts In-Stock

1+ parts

$14.140

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680

$14.140

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Corphita

USA . 12 parts In-Stock

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$15.418

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12

$15.418

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Modulus Dynamics

Lithuania . 130 parts In-Stock

1+ parts

$15.980

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$15.341

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$14.702

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130

$15.980

$15.341

$14.702

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Continental Prestige Electronics

USA . 3,113 parts In-Stock

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$21.640

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$21.640

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Corohmni

South Africa . 626 parts In-Stock

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$45.523

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Aztec Data Supply Inc.

USA . 2,276 parts In-Stock

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$49.964

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2,276

$49.964

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Microchip USA

USA . 138 parts In-Stock

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$60.260

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$59.210

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$58.690

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$58.160

138

$60.260

$59.210

$58.690

$58.160

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$87.563

100+ parts

$83.185

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$83.185

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$87.563

$83.185

$83.185

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S.R.D Solutions

India . 30,000 parts In-Stock

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Lixinc

USA . 7,913 parts In-Stock

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7,913

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Robosynatics

Brazil . 3,537 parts In-Stock

1+ parts

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$69.387

1k+ parts

$67.971

10k+ parts

$67.971

3,537

-

$69.387

$67.971

$67.971

Lucentia Tech

USA . 3,537 parts In-Stock

1+ parts

-

100+ parts

$69.387

1k+ parts

$67.971

10k+ parts

$67.971

3,537

-

$69.387

$67.971

$67.971

Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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Futuretech Components

Singapore . 3,000 parts In-Stock

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GreenTree Electronics

Israel . 3,000 parts In-Stock

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Epart123

USA . 1,040 parts In-Stock

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$187.500

1,040

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$187.500

Argo Parts USA

USA . 934 parts In-Stock

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934

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RC Electronics

USA . 853 parts In-Stock

1+ parts

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$23.080

1k+ parts

$21.070

10k+ parts

$20.430

853

-

$23.080

$21.070

$20.430

Perfect Parts

USA . 109 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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$22.177

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$21.498

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$21.046

50

-

$22.177

$21.498

$21.046

Overview

Unlock limitless possibilities with the CY8C5888LTI-LP097 by Infineon Technologies, a top-tier manufacturer renowned for quality and reliability. This multi-functional peripheral offers unparalleled versatility in a compact square package, making it ideal for a wide range of applications. With a nominal supply voltage of 1.8V and maximum clock frequency of 33MHz, this innovative product delivers exceptional performance in industrial settings. Experience seamless integration with I2C and USB bus compatibility, ensuring effortless connectivity and enhanced functionality. Elevate your projects with the CY8C5888LTI-LP097 and unleash the full potential of your designs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for compact, space-saving designs and easy integration into various electronic products.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in powering the device and ensures compatibility with a wide range of power sources.

Package Shape: SQUARE

The square package shape provides stability and ease of handling during manufacturing and assembly processes.

Power Supplies (V): 1.8/5

Support for dual power supply voltages enhances the versatility and functionality of the device.

No. of Terminals: 68

A higher number of terminals allow for more connectivity options and enable the device to interact with other components effectively.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles enhances thermal management, compactness, and overall performance of the device.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage ensures efficient power consumption and operation under various voltage conditions.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the device can function reliably in demanding industrial environments without overheating.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature ensures the device can operate effectively in both extreme cold and hot conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish of nickel, palladium, and gold provides excellent conductivity, corrosion resistance, and durability for long-term performance.

Ultraviolet Erasable: N

The non-ultraviolet erasable feature ensures data retention and reliability of stored information in the device.

Terminal Position: QUAD

The quad terminal position allows for efficient signal routing and connectivity, optimizing the device's functionality.

Maximum Seated Height: 1 mm

The low maximum seated height facilitates a compact and slim design, ideal for space-constrained applications.

RAM Words: 32768

With a high RAM capacity of 32768 words, the device can store and process large amounts of data efficiently.

Width: 8 mm

The compact width of 8 mm enables easy integration into various electronic systems and PCB layouts.

Boundary Scan: YES

The boundary scan feature allows for efficient debugging, testing, and programming of the device, enhancing overall reliability and performance.

Maximum Clock Frequency: 33 MHz

The high maximum clock frequency of 33 MHz ensures fast and responsive operation, suitable for high-speed data processing applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and mounting during assembly processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures proper bonding and reliability of solder joints during manufacturing.

Length: 8 mm

The compact length of 8 mm enhances the overall form factor and integration possibilities of the device.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, the device can withstand harsh environmental conditions and ensure reliable operation in demanding settings.

ROM Bits Size: 2097152 Bits

The large ROM size of 2097152 bits allows for storage of critical firmware and data, ensuring efficient operation and versatility of the device.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with a wide range of digital systems, making it suitable for various applications.

Terminal Form: NO LEAD

The no-lead terminal form reduces environmental impact and complies with RoHS regulations, ensuring sustainability and safety in manufacturing processes.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage of 1.8 V provides efficient power consumption and stable performance for the device.

Bus Compatibility: I2C; USB

Support for I2C and USB bus interfaces allows for easy connectivity with other devices and systems, enhancing the device's functionality and versatility.

Terminal Pitch: 0.4 mm

The fine terminal pitch of 0.4 mm allows for high-density mounting and compact design, ideal for space-constrained applications.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the device can withstand moderate exposure to moisture during handling and storage.

No. of I/O Lines: 38

A high number of I/O lines (38) enable the device to communicate with external peripherals and systems effectively, enhancing its functionality and connectivity.

Technical Specifications

Multi-functional Peripherals CY8C5888LTI-LP097 attributes and parameters. Explore more Multi-functional Peripherals devices from Infineon Technologies

Specs

Boundary Scan:

YES

Bus Compatibility:

I2C; USB

Maximum Clock Frequency:

33 MHz

JESD-30 Code:

S-XQCC-N68

JESD-609 Code:

e4

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

38

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC68,.32SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

RAM Words:

32768

ROM Bits Size:

2097152 Bits

Maximum Seated Height:

1 mm

Sub-Category:

Other uPs/uCs/Peripheral ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Ultraviolet Erasable:

N

Width:

8 mm

Trade Compliance

CY8C5888LTI-LP097 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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