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CY8C29866-24AXI

Infineon Technologies

CY8C29866-24AXI by Infineon Technologies

CY8C29866-24AXI by Infineon: 8-bit CPU, 24 MHz clock, 5V supply. Ideal for industrial applications with 64 I/O lines, FLASH ROM, and thin profile flatpack package.

Median Price

$13.229

Lifecycle Status

Suppliers In-Stock

23

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 1,672 parts In-Stock

1+ parts

$9.880

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$9.180

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$9.880

$9.180

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Avnet

USA . 900 parts In-Stock

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$10.842

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$9.750

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900

$10.842

$9.750

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Farnell

UK . 3 parts In-Stock

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$14.270

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$9.520

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3

$14.270

$9.520

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Arrow

USA . 203 parts In-Stock

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$16.617

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$11.537

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$10.880

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203

$16.617

$11.537

$10.880

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DigiKey

USA . 902 parts In-Stock

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$16.800

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$11.574

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$10.760

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902

$16.800

$11.574

$10.760

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Mouser Electronics

USA . 414 parts In-Stock

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$16.800

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$11.210

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$10.760

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414

$16.800

$11.210

$10.760

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Element14

Singapore . 10 parts In-Stock

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$21.410

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$17.710

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10

$21.410

$17.710

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Future Electronics

Canada . 871 parts In-Stock

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$9.180

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Rochester

USA . 132 parts In-Stock

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$9.750

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$8.720

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$8.210

132

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$8.720

$8.210

Verical

USA . 116 parts In-Stock

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$12.188

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$10.900

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$10.262

116

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$10.900

$10.262

Distributors (In-Stock)

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Digiode

USA . 255 parts In-Stock

1+ parts

$9.262

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$9.262

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Nova Conductors

Japan . 10 parts In-Stock

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$12.380

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$12.380

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Vyrian

USA . 1,039 parts In-Stock

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1,039

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IBS Electronics

USA . 871 parts In-Stock

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$15.091

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871

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$15.091

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DigiKey Marketplace

USA . 625 parts In-Stock

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625

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Chip Stock

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Euro-Tech

UK . 33 parts In-Stock

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Electronics Depot

USA . 33 parts In-Stock

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Prism Electronics

USA . 30 parts In-Stock

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Cyclops Electronics Ltd

UK . 28 parts In-Stock

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Standard Data Resources

USA . 15 parts In-Stock

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Bristol Electronics

USA . 11 parts In-Stock

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J & M Industries LLC

USA . 6 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,432 parts In-Stock

1+ parts

$7.790

100+ parts

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$7.790

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Corphita

USA . 881 parts In-Stock

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$8.775

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881

$8.775

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Continental Prestige Electronics

USA . 5,002 parts In-Stock

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$12.380

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$12.132

5,002

$12.380

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$12.380

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$11.761

10k+ parts

$11.513

2,000

$12.380

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$11.761

$11.513

Semicontronic

India . 1,032 parts In-Stock

1+ parts

$16.960

100+ parts

$16.536

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$16.451

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$16.960

$16.536

$16.451

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Microchip USA

USA . 2,849 parts In-Stock

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$48.160

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Corohmni

South Africa . 2,551 parts In-Stock

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$60.907

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Aztec Data Supply Inc.

USA . 898 parts In-Stock

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$77.158

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Modulus Dynamics

Lithuania . 3,307 parts In-Stock

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$79.970

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$76.771

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$73.572

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3,307

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$76.771

$73.572

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A-Z Elektronik GmbH

Germany . 6,656 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,437 parts In-Stock

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Robosynatics

Brazil . 1,799 parts In-Stock

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$72.964

1k+ parts

$71.475

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$71.475

1,799

-

$72.964

$71.475

$71.475

Lucentia Tech

USA . 1,799 parts In-Stock

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$72.964

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$71.475

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$71.475

1,799

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$71.475

$71.475

Perfect Parts

USA . 1,088 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Argo Parts USA

USA . 563 parts In-Stock

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563

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GreenTree Electronics

Israel . 50 parts In-Stock

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Kepictronics

USA . 32 parts In-Stock

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Overview

Discover the Infineon Technologies CY8C29866-24AXI, a cutting-edge multi-functional peripheral that delivers unparalleled performance and reliability. Infineon Technologies is known for its superior quality and innovative solutions, making this product a top choice for a wide range of applications. With advanced features and a sleek design, this device offers exceptional value and benefits to customers looking for seamless integration and high-speed processing. Upgrade your project with the CY8C29866-24AXI and experience the difference Infineon Technologies can make in your next endeavor.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and ensures a light weight, making it easy to transport and handle.

Maximum Supply Voltage: 5.25 V

Allows for efficient power distribution and supports various components without the risk of overloading.

Bit Size: 8

With a larger bit size, the product can handle more complex operations and calculations effectively.

Maximum Operating Temperature: 85 °C

Capable of operating in a wide range of temperatures, making it suitable for various environments.

RAM Bytes: 2048

With a large RAM capacity, the product can store and process a significant amount of data quickly.

Technical Specifications

Multi-functional Peripherals CY8C29866-24AXI attributes and parameters. Explore more Multi-functional Peripherals devices from Infineon Technologies

Specs

Additional Features:

ALSO OPERATES AT 3V SUPPLY

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

M8C

Maximum Clock Frequency:

24 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

64

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

2048

RAM Words:

1024

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

14 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Trade Compliance

CY8C29866-24AXI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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