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Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.

Cellphone ICs

Available Parts 1,927

Part RoHS Manufacturer Description Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level No. of Transceivers Maximum Supply Current Nominal Supply Voltage Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Resolution (um) Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Width Qualification Companding Law Input Type Additional Features Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter
AD9361BBCZ by Analog Devices

AD9361BBCZ

Analog Devices

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 144; Package Code: LFBGA; Package Shape: SQUARE;

RF AND BASEBAND CIRCUIT

INDUSTRIAL

BALL

144

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.3 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B144

3

1.7 mm

10 mm

e1

260

10 mm

CC1101RGPR by Texas Instruments

CC1101RGPR

Texas Instruments

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

1.8/3.6

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC20,.16SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

QUAD

.5 Mbps

S-PQCC-N20

3

1 mm

4 mm

Not Qualified

e4

NOT SPECIFIED

260

4 mm

AD9361BBCZ-REEL by Analog Devices

AD9361BBCZ-REEL

Analog Devices

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 144; Package Code: LFBGA; Package Shape: SQUARE;

RF AND BASEBAND CIRCUIT

INDUSTRIAL

BALL

144

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.3 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B144

3

1.7 mm

10 mm

e1

260

10 mm

AD9361BBCZ-CSL by Analog Devices

AD9361BBCZ-CSL

Analog Devices

RF AND BASEBAND CIRCUIT; Terminal Form: BALL; No. of Terminals: 144; Package Code: LFBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;

RF AND BASEBAND CIRCUIT

BALL

144

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

150 mA

1.3 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA144,12X12,32

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B144

1.7 mm

10 mm

NOT SPECIFIED

NOT SPECIFIED

10 mm

NRF9160-SICA-B1A-R7 by Nordic Semiconductor Asa

NRF9160-SICA-B1A-R7

Nordic Semiconductor Asa

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 127; Package Code: LGA; Package Shape: RECTANGULAR;

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

127

LGA

RECTANGULAR

UNSPECIFIED

YES

1

3.8 V

GRID ARRAY

LGA127,21X30,20

.5 mm

85 Cel

-40 Cel

BOTTOM

R-XBGA-N127

1.1 mm

10.5 mm

16 mm

NRF9160-SICA-B1A-R by Nordic Semiconductor Asa

NRF9160-SICA-B1A-R

Nordic Semiconductor Asa

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 127; Package Code: LGA; Package Shape: RECTANGULAR;

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

127

LGA

RECTANGULAR

UNSPECIFIED

YES

1

3.8 V

GRID ARRAY

LGA127,21X30,20

.5 mm

85 Cel

-40 Cel

BOTTOM

R-XBGA-N127

1.1 mm

10.5 mm

16 mm

CC1101RGPT by Texas Instruments

CC1101RGPT

Texas Instruments

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

1.8/3.6

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC20,.16SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

QUAD

.5 Mbps

S-PQCC-N20

3

1 mm

4 mm

Not Qualified

e4

NOT SPECIFIED

260

4 mm

NRF9160-SIAA-B1A-R7 by Nordic Semiconductor Asa

NRF9160-SIAA-B1A-R7

Nordic Semiconductor Asa

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 127; Package Code: LGA; Package Shape: RECTANGULAR;

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

127

LGA

RECTANGULAR

UNSPECIFIED

YES

1

3.8 V

GRID ARRAY

LGA127,21X30,20

.5 mm

85 Cel

-40 Cel

BOTTOM

R-XBGA-N127

1.1 mm

10.5 mm

16 mm

NRF9160-SIAA-B1A-R by Nordic Semiconductor Asa

NRF9160-SIAA-B1A-R

Nordic Semiconductor Asa

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 127; Package Code: LGA; Package Shape: RECTANGULAR;

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

127

LGA

RECTANGULAR

UNSPECIFIED

YES

1

3.8 V

GRID ARRAY

LGA127,21X30,20

.5 mm

85 Cel

-40 Cel

BOTTOM

R-XBGA-N127

1.1 mm

10.5 mm

16 mm

NRF9160-SIBA-B1A-R7 by Nordic Semiconductor Asa

NRF9160-SIBA-B1A-R7

Nordic Semiconductor Asa

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 127; Package Code: LGA; Package Shape: RECTANGULAR;

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

127

LGA

RECTANGULAR

UNSPECIFIED

YES

1

3.8 V

GRID ARRAY

LGA127,21X30,20

.5 mm

85 Cel

-40 Cel

BOTTOM

R-XBGA-N127

1.1 mm

10.5 mm

16 mm

CC1101RGP by Texas Instruments

CC1101RGP

Texas Instruments

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

1.8/3.6

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC20,.16SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

QUAD

.5 Mbps

S-PQCC-N20

3

1 mm

4 mm

Not Qualified

e4

NOT SPECIFIED

260

4 mm

S2-LPQTR by STMicroelectronics

S2-LPQTR

STMicroelectronics

RF AND BASEBAND CIRCUIT; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;

RF AND BASEBAND CIRCUIT

3

NOT SPECIFIED

260

ADL5561ACPZ-R7 by Analog Devices

ADL5561ACPZ-R7

Analog Devices

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N16

3

1 mm

3 mm

e3

30

260

3 mm

ST25R3911B-AQFT by STMicroelectronics

ST25R3911B-AQFT

STMicroelectronics

RF AND BASEBAND CIRCUIT; Terminal Finish: MATTE TIN; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;

RF AND BASEBAND CIRCUIT

MATTE TIN

3

e3

260

LMH2110TMX/NOPB by Texas Instruments

LMH2110TMX/NOPB

Texas Instruments

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 6; Package Code: VFBGA; Package Shape: RECTANGULAR;

RF AND BASEBAND CIRCUIT

INDUSTRIAL

BALL

6

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1

5.5 mA

4.5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B6

1

.675 mm

.84 mm

e1

30

260

1.24 mm

ADF4360-4BCPZRL by Analog Devices

ADF4360-4BCPZRL

Analog Devices

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;

BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N24

3

1 mm

4 mm

Not Qualified

e3

30

260

4 mm

ST25R3916-AQWT by STMicroelectronics

ST25R3916-AQWT

STMicroelectronics

RF AND BASEBAND CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;

RF AND BASEBAND CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

NRF24L01-REEL by Nordic Semiconductor Asa

NRF24L01-REEL

Nordic Semiconductor Asa

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N20

2

.95 mm

4 mm

e3

260

4 mm

ADF4360-7BCPZ by Analog Devices

ADF4360-7BCPZ

Analog Devices

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;

BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N24

3

1 mm

4 mm

Not Qualified

e3

30

260

4 mm

BG95M1LA-64-SGNS by Quectel Wireless Solutions

BG95M1LA-64-SGNS

Quectel Wireless Solutions

RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 102; Package Code: QMA; Package Shape: RECTANGULAR; Package Style (Meter): MICROELECTRONIC ASSEMBLY;

RF AND BASEBAND CIRCUIT

NO LEAD

102

QMA

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

MICROELECTRONIC ASSEMBLY

75 Cel

-35 Cel

QUAD

R-XQMA-N102

2.2 mm

19.9 mm

EXTENDED TEMP AVAILABLE WITH -40 TO 85

23.6 mm

BG77LA-64-SGNS by Quectel Wireless Solutions

BG77LA-64-SGNS

Quectel Wireless Solutions

BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 94; Package Shape: RECTANGULAR; Maximum Seated Height: 1.7 mm; Length: 14.9 mm;

BASEBAND CIRCUIT

NO LEAD

94

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

75 Cel

-35 Cel

BOTTOM

R-XBGA-N94

1.7 mm

12.9 mm

Extended Temperature Range also available -40 to 85

14.9 mm

ADF4360-4BCPZ by Analog Devices

ADF4360-4BCPZ

Analog Devices

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;

BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N24

3

1 mm

4 mm

Not Qualified

e3

30

260

4 mm

A7682E by Simcom Wireless Solutions

A7682E

Simcom Wireless Solutions

RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 85; Package Code: XMA; Package Shape: SQUARE; JESD-30 Code: S-XXMA-N85;

RF AND BASEBAND CIRCUIT

NO LEAD

85

XMA

SQUARE

UNSPECIFIED

NO

1

3.8 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

S-XXMA-N85

2.4 mm

19.6 mm

19.6 mm

LARA-R6001D-00B by U-blox Ag

LARA-R6001D-00B

U-blox Ag

RF AND BASEBAND CIRCUIT;

RF AND BASEBAND CIRCUIT

SARA-R510M8S-00B by U-blox Ag

SARA-R510M8S-00B

U-blox Ag

RF AND BASEBAND CIRCUIT;

RF AND BASEBAND CIRCUIT

SARA-R410M-02B-01 by U-blox Ag

SARA-R410M-02B-01

U-blox Ag

RF AND BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 96; Package Code: LGA; Package Shape: RECTANGULAR;

RF AND BASEBAND CIRCUIT

COMMERCIAL

NO LEAD

96

LGA

RECTANGULAR

UNSPECIFIED

YES

1

3.8 V

GRID ARRAY

LGA96(UNSPEC)

65 Cel

-20 Cel

BOTTOM

R-XLGA-N96

4

2.78 mm

16 mm

-40 to 85 extended operating temp available

26 mm

ADF4360-4BCPZRL7 by Analog Devices

ADF4360-4BCPZRL7

Analog Devices

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;

BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N24

3

1 mm

4 mm

Not Qualified

e3

30

260

4 mm

SARA-R410M-02B by U-blox Ag

SARA-R410M-02B

U-blox Ag

RF AND BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 96; Package Code: LGA; Package Shape: RECTANGULAR;

RF AND BASEBAND CIRCUIT

COMMERCIAL

NO LEAD

96

LGA

RECTANGULAR

UNSPECIFIED

YES

1

3.8 V

GRID ARRAY

65 Cel

-20 Cel

BOTTOM

R-XBGA-N96

4

2.78 mm

16 mm

26 mm

NRF24L01 by Nordic Semiconductor Asa

NRF24L01

Nordic Semiconductor Asa

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N20

2

.95 mm

4 mm

e3

260

4 mm

LE910C1EU06T060100 by Telit Communications Plc

LE910C1EU06T060100

Telit Communications Plc

RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 181; Package Code: XMA; Package Shape: SQUARE; Package Style (Meter): MICROELECTRONIC ASSEMBLY;

RF AND BASEBAND CIRCUIT

NO LEAD

181

XMA

SQUARE

UNSPECIFIED

NO

1

3.8 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

S-XXMA-N181

2.2 mm

28.2 mm

28.2 mm

ADL5561ACPZ-WP by Analog Devices

ADL5561ACPZ-WP

Analog Devices

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N16

3

1 mm

3 mm

e3

30

260

3 mm

ME310G1WW04T050400 by Telit Communications Plc

ME310G1WW04T050400

Telit Communications Plc

RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 94; Package Code: XMA; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED;

RF AND BASEBAND CIRCUIT

NO LEAD

94

XMA

RECTANGULAR

UNSPECIFIED

NO

1

3.8 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N94

2.6 mm

15 mm

18 mm

EG91EXGA-128-SGNS by Quectel Wireless Solutions

EG91EXGA-128-SGNS

Quectel Wireless Solutions

RF AND BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: NO LEAD; No. of Terminals: 102; Package Code: XMA; Package Shape: RECTANGULAR;

RF AND BASEBAND CIRCUIT

COMMERCIAL EXTENDED

NO LEAD

102

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.8 V

MICROELECTRONIC ASSEMBLY

75 Cel

-35 Cel

UNSPECIFIED

R-XXMA-N102

2.3 mm

25 mm

Also has Extended temp from -40 Deg c to 85 Deg c

29 mm

OC2321VQFN8XTMA2 by Infineon Technologies

OC2321VQFN8XTMA2

Infineon Technologies

RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Surface Mount: YES;

RF AND BASEBAND CIRCUIT

NO LEAD

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.8 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.24

1.27 mm

105 Cel

-40 Cel

DUAL

R-PDSO-N8

1

.9 mm

6 mm

5 mm

MAX4003EUA-T by Maxim Integrated

MAX4003EUA-T

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE;

RF AND BASEBAND CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e0

3 mm

MAX4003EUA+T by Analog Devices

MAX4003EUA+T

Analog Devices

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE;

RF AND BASEBAND CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e3

30

260

3 mm

LE910C1EU10T100700 by Telit Communications Plc

LE910C1EU10T100700

Telit Communications Plc

RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; Package Code: XMA; Package Shape: SQUARE; Terminal Position: UNSPECIFIED; No. of Functions: 1;

RF AND BASEBAND CIRCUIT

NO LEAD

XMA

SQUARE

UNSPECIFIED

NO

1

3.8 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

S-XXMA-N181

2.2 mm

28.2 mm

28.2 mm

CC110LRGPR by Texas Instruments

CC110LRGPR

Texas Instruments

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

1.8/3.6

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC20,.16SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

QUAD

.6 Mbps

S-PQCC-N20

3

1 mm

4 mm

Not Qualified

e4

30

260

4 mm

BGA725L6E6327FTSA1 by Infineon Technologies

BGA725L6E6327FTSA1

Infineon Technologies

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 6; Package Code: BCC; Package Shape: RECTANGULAR;

BASEBAND CIRCUIT

INDUSTRIAL

BUTT

6

BCC

RECTANGULAR

UNSPECIFIED

YES

1

1.8 V

CHIP CARRIER

.2 mm

85 Cel

-40 Cel

GOLD

BOTTOM

R-XBCC-B6

1

.4 mm

.7 mm

e4

1.1 mm

SARA-R422M8S-00B by U-blox Ag

SARA-R422M8S-00B

U-blox Ag

RF AND BASEBAND CIRCUIT;

RF AND BASEBAND CIRCUIT

BC66NB-04-STD by Quectel Wireless Solutions

BC66NB-04-STD

Quectel Wireless Solutions

RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 58; Package Code: QMA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 75 Cel;

RF AND BASEBAND CIRCUIT

NO LEAD

58

QMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

75 Cel

-35 Cel

QUAD

R-XQMA-N58

2 mm

15.8 mm

EXTENDED TEMP AVAILABLE WITH -40 TO 85

17.7 mm

SARA-R422S-00B by U-blox Ag

SARA-R422S-00B

U-blox Ag

RF AND BASEBAND CIRCUIT;

RF AND BASEBAND CIRCUIT

HMC832LP6GETR by Analog Devices

HMC832LP6GETR

Analog Devices

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE;

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-N40

1

.9 mm

6 mm

e3

6 mm

AD9361BBC-CSH by Analog Devices

AD9361BBC-CSH

Analog Devices

RF AND BASEBAND CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;

RF AND BASEBAND CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

AT86RF233-ZU by Microchip Technology

AT86RF233-ZU

Microchip Technology

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

1.8,3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

1 mm

5 mm

Not Qualified

e3

5 mm

SARA-R422S-01B by U-blox Ag

SARA-R422S-01B

U-blox Ag

RF AND BASEBAND CIRCUIT;

RF AND BASEBAND CIRCUIT

LMH2110TM/NOPB by Texas Instruments

LMH2110TM/NOPB

Texas Instruments

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 6; Package Code: VFBGA; Package Shape: RECTANGULAR;

RF AND BASEBAND CIRCUIT

INDUSTRIAL

BALL

6

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1

5.5 mA

4.5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B6

1

.675 mm

.84 mm

e1

30

260

1.24 mm

SARA-R422M10S-01B by U-blox Ag

SARA-R422M10S-01B

U-blox Ag

RF AND BASEBAND CIRCUIT;

RF AND BASEBAND CIRCUIT