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CC113LRTKT

Texas Instruments

CC113LRTKT by Texas Instruments

The Texas Instruments CC113LRTKT is a cellphone IC with 20 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3V, making it ideal for telecom applications.

Median Price

$1.918

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 190 parts In-Stock

1+ parts

$1.620

100+ parts

$1.620

1k+ parts

-

10k+ parts

-

190

$1.620

$1.620

-

-

Rochester

USA . 750 parts In-Stock

1+ parts

-

100+ parts

$1.810

1k+ parts

$1.620

10k+ parts

$1.530

750

-

$1.810

$1.620

$1.530

DigiKey

USA . 750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.100

10k+ parts

-

750

-

-

$2.100

-

Verical

USA . 750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.025

10k+ parts

$1.913

750

-

-

$2.025

$1.913

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,163 parts In-Stock

1+ parts

$1.919

100+ parts

-

1k+ parts

-

10k+ parts

-

2,163

$1.919

-

-

-

Vyrian

USA . 6,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,800

-

-

-

-

DigiKey Marketplace

USA . 750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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750

-

-

-

-

Euro-Tech

UK . 227 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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227

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 858 parts In-Stock

1+ parts

$1.434

100+ parts

-

1k+ parts

-

10k+ parts

-

858

$1.434

-

-

-

Northwest PG Solutions

USA . 1,294 parts In-Stock

1+ parts

$1.578

100+ parts

-

1k+ parts

-

10k+ parts

-

1,294

$1.578

-

-

-

Corphita

USA . 2,710 parts In-Stock

1+ parts

$1.818

100+ parts

-

1k+ parts

-

10k+ parts

-

2,710

$1.818

-

-

-

Component Stockers USA

USA . 1,018 parts In-Stock

1+ parts

$2.080

100+ parts

$1.960

1k+ parts

-

10k+ parts

-

1,018

$2.080

$1.960

-

-

Corohmni

South Africa . 800 parts In-Stock

1+ parts

$10.899

100+ parts

-

1k+ parts

-

10k+ parts

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800

$10.899

-

-

-

Parana Technologies

USA . 605 parts In-Stock

1+ parts

$11.373

100+ parts

-

1k+ parts

$11.798

10k+ parts

-

605

$11.373

-

$11.798

-

DigiPath Technology Company

USA . 1,339 parts In-Stock

1+ parts

$12.523

100+ parts

$11.522

1k+ parts

-

10k+ parts

-

1,339

$12.523

$11.522

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-

IDEA Electronic Components Group

UK . 1,862 parts In-Stock

1+ parts

$12.779

100+ parts

$12.140

1k+ parts

$11.501

10k+ parts

-

1,862

$12.779

$12.140

$11.501

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ChromeModa Solutions

Germany . 1,150 parts In-Stock

1+ parts

$12.779

100+ parts

$10.479

1k+ parts

-

10k+ parts

-

1,150

$12.779

$10.479

-

-

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$18.986

100+ parts

$17.277

1k+ parts

$15.569

10k+ parts

-

3,000

$18.986

$17.277

$15.569

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,000

-

-

-

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Kepictronics

USA . 1,560 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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1,560

-

-

-

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Perfect Parts

USA . 784 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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784

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-

Overview

Discover the cutting-edge CC113LRTKT by Texas Instruments, a top-of-the-line Cellphone IC designed for seamless integration and superior performance. With Texas Instruments' reputation for quality and innovation, this product offers unparalleled reliability and efficiency in various applications. Elevate your device with the advanced features of the CC113LRTKT, including its robust build and impressive temperature range. Trust in Texas Instruments to deliver excellence, value, and a competitive edge to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides good protection for the internal components of the IC and ensures durability.

Surface Mount: YES

Surface mount enables easy and efficient PCB assembly, saving time and resources.

Package Shape: SQUARE

Square package shape allows for compact and efficient placement on the PCB, optimizing space usage.

Telecom IC Type: RF AND BASEBAND CIRCUIT

RF and Baseband circuit design is ideal for cellphone applications, providing high performance and connectivity.

Nominal Supply Voltage: 3 V

3V supply voltage is commonly used in cellphone circuits, ensuring compatibility and reliable operation.

Technical Specifications

Cellphone ICs CC113LRTKT attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N20

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

CC113LRTKT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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