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MAX2308ETI+T

Analog Devices

MAX2308ETI+T by Analog Devices

Analog Devices' MAX2308ETI+T is a cellphone IC with 28 terminals in a square chip carrier package. It operates at -40 to 85 °C, with power supplies of 3/3.3V and max supply current of 0.0415mA. Ideal for baseband circuits, it has a terminal pitch of 0.5mm and is suitable for industrial temperature grade applications.

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4

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1k+

MAX2308ETI+T by Analog Devices
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Vyrian

USA . 7,574 parts In-Stock

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Chip Stock

USA . 6,499 parts In-Stock

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6,499

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Anansix

USA . 2,401 parts In-Stock

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Digiode

USA . 800 parts In-Stock

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800

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MARBEL Systems

Belgium . 90 parts In-Stock

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$11.951

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90

$11.951

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AZTECH Wire

Italy . 795 parts In-Stock

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$13.297

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795

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Texas Native Microelectronics

USA . 450 parts In-Stock

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$13.737

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$13.188

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$12.775

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$12.089

450

$13.737

$13.188

$12.775

$12.089

Kenton Components

USA . 421 parts In-Stock

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$16.484

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$14.506

421

$16.484

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Qasali Group International

UK . 300 parts In-Stock

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$37.090

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$34.494

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$32.639

300

$37.090

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One Stop Electronics

USA . 1,177 parts In-Stock

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$524.000

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Semicontronic

India . 384 parts In-Stock

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$931.000

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$907.725

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$903.070

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384

$931.000

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Corphita

USA . 615 parts In-Stock

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Overview

Elevate your cellphone's performance with the MAX2308ETI+T by Analog Devices. This high-quality Cellphone IC boasts a square package shape and a very thin profile, making it ideal for compact designs. With a wide operating temperature range and low supply current, this IC offers exceptional reliability and efficiency. From baseband circuits to power management, the MAX2308ETI+T is versatile and essential for various telecom applications. Trust Analog Devices to deliver cutting-edge technology that enhances your device's capabilities. Experience the difference with the MAX2308ETI+T.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on a circuit board, saving time and space in the manufacturing process.

Package Shape: SQUARE

The square package shape helps optimize space on the circuit board and allows for efficient layout designs.

Power Supplies (V): 3/3.3

Provides flexibility in power supply options, allowing compatibility with a range of systems and devices.

No. of Terminals: 28

With a high number of terminals, this IC can accommodate a variety of connections and functions, making it versatile for different applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles offers thermal efficiency, compactness, and reliability in the product design.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even under demanding conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for use in a wide range of environments, including harsh climates.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides a durable and corrosion-resistant terminal surface, enhancing the longevity of the IC.

Terminal Position: QUAD

The quad terminal position offers stable and secure connections, contributing to the overall reliability of the product.

Maximum Seated Height: 0.8 mm

The low maximum seated height helps in maintaining a slim profile, making it suitable for compact device designs.

Width: 5 mm

The compact width allows for efficient space utilization on the circuit board, enabling more components to be accommodated within a limited area.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature aids in preventing overheating or damage during the manufacturing process.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures effective soldering and bonding, maintaining strong connections within the IC.

Length: 5 mm

The compact length contributes to the overall small form factor of the IC, making it suitable for portable and space-constrained devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates the robustness and reliability of the IC, suitable for use in challenging industrial environments.

Terminal Form: NO LEAD

The no-lead terminal form complies with environmental regulations and offers improved soldering properties, enhancing the overall eco-friendliness of the product.

Maximum Supply Current: 0.0415 mA

The low maximum supply current helps in minimizing power consumption and heat generation, contributing to energy efficiency and longer battery life.

Telecom IC Type: BASEBAND CIRCUIT

Being a baseband circuit IC type, it offers essential functionalities for communication systems, making it a reliable choice for telecom applications.

Nominal Supply Voltage: 2.75 V

The nominal supply voltage of 2.75 V provides stable power input for the IC, ensuring consistent performance within the specified voltage range.

Terminal Pitch: 0.5 mm

The small terminal pitch enables higher density and precision in circuit connections, enhancing the overall performance and reliability of the IC.

Technical Specifications

Cellphone ICs MAX2308ETI+T attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N28

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC28,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.0415 mA

Nominal Supply Voltage:

2.75 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

MAX2308ETI+T Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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