Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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CC1101RTKRG3 by Texas Instruments is a cellphone IC with 20 terminals in a square chip carrier package. It operates at temperatures from -40 to 85°C, with a supply voltage of 1.8/3.6V. This RF and baseband circuit is ideal for industrial telecom applications due to its compact size and surface-mount capability.
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Plastic/Epoxy body material provides durability and reliability to the product, ensuring longevity and resistance to wear and tear.
Surface mount technology makes the product easy to assemble and allows for efficient use of PCB space.
The variety of power supply options (1.8V and 3.6V) allows for flexibility in design and compatibility with different systems.
The various package styles enable efficient heat dissipation, compact design, and compatibility with thin-profile applications.
With a high maximum operating temperature of 85°C, the product can withstand a wide range of environmental conditions.
Nickel Palladium Gold terminal finish provides excellent conductivity and corrosion resistance for reliable performance.
Designed specifically for RF and baseband circuits in cellphones, ensuring optimized performance and connectivity.
The 3V supply voltage is commonly used in cellphones, making this product compatible with standard power requirements.
Cellphone ICs CC1101RTKRG3 attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments
JESD-30 Code:
JESD-609 Code:
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Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
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Peak Reflow Temperature (C):
Power Supplies (V):
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Telecom IC Type:
Temperature Grade:
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CC1101RTKRG3 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
2N2222A
Infineon Technologies
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
FDC5614P
TAIZHOU ELECTRONICS CO LTD
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.92 W; Maximum Operating Temperature: 150 Cel; Package Body Material: PLASTIC/EPOXY;
LM7805CT
Silicon Group
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Package Body Material: PLASTIC/EPOXY; Maximum Load Regulation: .05 %;
BSS138LT3G
Onsemi
BSS138LT3G by Onsemi is a N-CHANNEL FET with a min DS breakdown voltage of 50V. It is used for switching applications and has a max drain current of 0.2A and max drain-source on resistance of 3.5 ohm.
Forward International Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .6 A;
BSS138
Siemens
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain-Source On Resistance: 3.5 ohm; Terminal Finish: Tin/Lead (Sn/Pb);
1N4148
Itt Components
RECTIFIER DIODE; Surface Mount: NO; Config: SINGLE; Maximum Operating Temperature: 200 Cel; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Output Current: .15 A;
2N7002
North American Philips Discrete Products Div
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Operating Mode: ENHANCEMENT MODE; Maximum Drain Current (ID): .115 A;
LM2675M-ADJ/NOPB
National Semiconductor
SWITCHING REGULATOR; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
IRLML6401TRPBF
IRLML6401TRPBF by Infineon is a P-CHANNEL FET for SWITCHING applications. It features a 12V DS Breakdown Voltage, 34A IDM, and 0.05ohm RDS(on). With a small outline package style, it operates in an ambient temperature range of -55 to 150 °C.
Central Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Drain Current (ID): .115 A; Maximum Drain Current (Abs) (ID): .115 A;
STMicroelectronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .6 A;
BSS138-TP
Micro Commercial Components
BSS138-TP by Micro Commercial Components is a N-channel small signal FET with a min DS breakdown voltage of 50V and max drain current of 0.22A. It is commonly used in applications requiring enhancement mode operation, such as power management and switching circuits.
SMBJ18CA
Multicomp Pro
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Diode Element Material: SILICON; Technology: AVALANCHE; Maximum Repetitive Peak Reverse Voltage: 18 V; Nominal Breakdown Voltage: 21.05 V;
ULN2803ADWRG4
Texas Instruments
ULN2803ADWRG4 by Texas Instruments is a peripheral driver with 8 functions, open-collector output, and built-in transient protection. It operates b/w -40 to 85 °C with a max supply voltage of 3 V. Ideal for applications requiring sink current flow direction in a small outline package style.
Db Lectro
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MMBT3904-7-F
Diodes Incorporated
Diodes Inc. MMBT3904-7-F is a NPN BJT transistor for switching applications. Features include VCEsat of 0.3V, hFE of 30, and IC of 0.2A. With a max operating temp of 150°C, it's ideal for small outline SMT designs in automotive electronics.
LM2931AZ-5.0G
LM2931AZ-5.0G by Onsemi is a fixed positive single output LDO regulator with a nominal output voltage of 5V and max output current of 0.1A. It has a max dropout voltage of 0.6V, making it suitable for applications requiring stable power supply in temperature-sensitive environments up to 125°C. The package style is cylindrical with wire terminals, ideal for rail packing methods in various electronic devices.
LM358ADR
LM358ADR by Texas Instruments is an operational amplifier with 2 functions, featuring a max input offset voltage of 5000 uV and nominal voltage of 5V. Widely used in applications requiring high voltage gain, it operates within a temperature range of 0-70°C and offers frequency compensation for stability.
Laube Technology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LMV226UR/NOPB
Texas Instruments LMV226UR/NOPB is a cellphone IC with surface mount capability. It features grid array package style, 260°C peak reflow temperature, and 8mA max supply current. Ideal for RF and baseband circuits in telecommunications applications.
CC2420ZRTCR
CC2420ZRTCR by Texas Instruments is a cellphone IC with 48 terminals in a square package. It operates b/w -40 to 85°C, with a supply voltage of 1.8V. This RF and baseband circuit has a terminal pitch of 0.5mm, making it suitable for industrial telecom applications.
MAX2900ETI+T
Analog Devices
Analog Devices' MAX2900ETI+T is a cellphone IC with 28 terminals in a square chip carrier package. Operating from -40 to 85°C, it's ideal for industrial telecom applications requiring RF and baseband circuit integration. With a nominal voltage of 4.5V, this IC features a very thin profile and matte tin terminal finish for robust performance.
CC1050SK
CC1050SK by Texas Instruments is a cellphone IC with 24 terminals in a small outline package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3V, making it ideal for telecom applications.
MAX5864ETM+
Analog Devices' MAX5864ETM+ is a cellphone IC with 48 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a terminal pitch of 0.5mm, making it ideal for telecom applications.
HMC682LP6CE
Analog Devices' HMC682LP6CE is a 40-terminal cellphone IC in a square chip carrier package with matte tin finish. It operates b/w -40 to 85°C, suitable for industrial telecom applications requiring RF and baseband circuits at a nominal 5V supply voltage. The compact design features a very thin profile, making it ideal for space-constrained environments.
TRF3040PT
TRF3040PT by Texas Instruments is a 48-terminal cellphone IC with 3.75V supply voltage, suitable for RF and baseband circuits. It features a flatpack, low profile package style with gull wing terminals, operating b/w -40 to 85°C. Ideal for telecom applications requiring a compact square-shaped surface-mount design.
MAX5865ETM-T
Maxim Integrated
MAX5865ETM-T by Maxim Integrated is a 48-terminal cellphone IC with 2 channels. It operates b/w -40 to 85°C, offering an output voltage of up to 3V in OFFSET BINARY code. Ideal for RF and baseband circuits, this CMOS technology chip has a compact square package style suitable for telecom applications.
TLV320AC57IDWR
TLV320AC57IDWR by Texas Instruments is a Cellphone IC with 20 terminals, CMOS technology, and 3V supply voltage. It operates b/w -40 to 85°C, suitable for industrial use in baseband circuits. The small outline package measures 7.5mm x 12.8mm with a seated height of 2.65mm, making it ideal for compact cellphone designs.
TCM320AC56CN
Texas Instruments TCM320AC56CN is a 20-terminal IC with 5V power supply, operating b/w 0-70°C. It features a 13-bit linear coding, μ-law companding law, and telecom baseband circuit type. Ideal for cellphone applications due to its compact rectangular package style and through-hole terminal form.
TLV320AC56IPT
TLV320AC56IPT by Texas Instruments is a 48-terminal cellphone IC with 3V supply voltage. It features a 13-bit linear coding, mu-law companding law, and operates in industrial temperature range (-40 to 85°C). Ideal for baseband circuits, this CMOS technology IC has a low profile flatpack package style.
CC1110F32RSP
CC1110F32RSP by Texas Instruments is a cellphone IC with 36 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a supply voltage of 3V, making it ideal for telecom applications.
SI4721-B20-GM
Skyworks Solutions
RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;
CC1020RUZ
The Texas Instruments CC1020RUZ is a cellphone IC with 32 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3V, making it ideal for telecom applications.
CC1110F16RSPRG3
CC1110F16RSPRG3 by Texas Instruments is a cellphone IC with 36 terminals in a square chip carrier package. It operates at temperatures ranging from -40 to 85°C and has a supply voltage of 3V. This RF and baseband circuit technology is ideal for industrial telecom applications due to its compact size, low profile, and surface-mount capability.
AFSC5G23D37T2
NXP Semiconductors
RF AND BASEBAND CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
TRF5901PTR
TRF5901PTR by Texas Instruments is a cellphone IC with 48 terminals in a square package. It operates at -40 to 85°C, consuming 0.053mA at 3V supply voltage. This RF and baseband circuit has a low profile flatpack design for industrial telecom applications.
SARA-R510M8S-71B
U-blox Ag
RF AND BASEBAND CIRCUIT;
LMH6523SQE
CC1100RTKG3
CC1100RTKG3 by Texas Instruments is a cellphone IC with 20 terminals, operating at temperatures from -40 to 85°C. It features a supply voltage of 1.8/3.6V, CMOS technology, and RF/baseband circuitry for telecom applications. This surface-mount chip carrier has a square shape and very thin profile, making it suitable for industrial use in compact devices.
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UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
CC1101RGPR
CC1101RGPR by Texas Instruments is a cellphone IC with 20 terminals in a square chip carrier package. Operating at temperatures from -40 to 85°C, it has a supply voltage of 3V and data rate of 0.5 Mbps. Ideal for RF and baseband circuits, this IC is surface mountable and features a moisture sensitivity level of 3.
CC1101RGPT
CC1101RGPT by Texas Instruments is a cellphone IC with 20 terminals in a square chip carrier package. Operating at temperatures from -40 to 85°C, it supports RF and baseband circuits with a data rate of 0.5 Mbps. Ideal for industrial applications, this IC has a supply voltage of 3V and terminal pitch of 0.5mm.
CC1101RGP
CC1101RGP by Texas Instruments is a cellphone IC with 20 terminals, operating at 1.8/3.6V and supporting data rates up to 0.5 Mbps. It features a square chip carrier package style suitable for RF and baseband circuits in industrial temperature environments. The IC is surface mountable, with a compact size of 4x4mm and terminal pitch of 0.5mm, making it ideal for mobile communication applications.
CC110LRGPR
CC110LRGPR by Texas Instruments is a cellphone IC with 20 terminals in a square chip carrier package. It operates at temperatures ranging from -40 to 85°C and has a supply voltage of 3V. This RF and baseband circuit supports data rates up to 0.6 Mbps, making it ideal for industrial telecom applications.
CC115LRGPR
CC115LRGPR by Texas Instruments is a cellphone IC with 20 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. With RF and baseband circuitry, it supports data rates up to 0.6 Mbps, making it ideal for telecom applications.
CC1101QRHBRG4Q1
CC1101QRHBRG4Q1 by Texas Instruments is a cellphone IC with 32 terminals, operating at 1.8/3.6V and data rate of 0.25 Mbps. It is an RF and baseband circuit suitable for automotive applications due to AEC-Q100 screening, -40 to 125°C temperature range, and moisture sensitivity level of 2.
CC115LRTKT
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;
CC115LRGPT
CC115LRGPT by Texas Instruments is a cellphone IC with a square package and 20 terminals. It operates at temperatures ranging from -40 to 85 °C and has a data rate of 0.6 Mbps. This RF and baseband circuit is suitable for telecom applications.
CC115LRTKR
CC115LRTKR by Texas Instruments is a cellphone IC with a square package and 20 terminals. It operates at temperatures ranging from -40 to 85 °C and has a nominal voltage of 3.6 V. This RF and baseband circuit is suitable for industrial applications.
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE;
CC1110EMK433
CC1110EMK868-915
CC1100RTKR
CC1110F32RSPR
CC1111F32RSPRG3
RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: QCCN; Package Shape: SQUARE;
CC1101RTK
CC1100RTKRG3
CC1101RTKG3
CC1101RTKR
CC1100ERTKT
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