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TCM320AC57IDWR

Texas Instruments

TCM320AC57IDWR by Texas Instruments

TCM320AC57IDWR by Texas Instruments is a Cellphone IC with 20 terminals, CMOS technology, and 5V supply voltage. It operates b/w -40 to 85°C, suitable for industrial use in baseband circuits. The package is small outline, rectangular in shape, with gull wing terminals for surface mount applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,323 parts In-Stock

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7,323

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Digiode

USA . 3,117 parts In-Stock

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3,117

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 130 parts In-Stock

1+ parts

$9.498

100+ parts

-

1k+ parts

$10.101

10k+ parts

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130

$9.498

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$10.101

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DigiPath Technology Company

USA . 1,256 parts In-Stock

1+ parts

$10.459

100+ parts

$9.622

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1,256

$10.459

$9.622

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IDEA Electronic Components Group

UK . 2,097 parts In-Stock

1+ parts

$10.672

100+ parts

$10.138

1k+ parts

$9.605

10k+ parts

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2,097

$10.672

$10.138

$9.605

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ChromeModa Solutions

Germany . 1,755 parts In-Stock

1+ parts

$10.672

100+ parts

$8.751

1k+ parts

-

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1,755

$10.672

$8.751

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AZTECH Wire

Italy . 446 parts In-Stock

1+ parts

$15.584

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446

$15.584

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One Stop Electronics

USA . 1,529 parts In-Stock

1+ parts

$570.000

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1,529

$570.000

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Corphita

USA . 2,893 parts In-Stock

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2,893

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Overview

Unlock the potential of your cellphone with the TCM320AC57IDWR by Texas Instruments. Known for their high-quality products, Texas Instruments delivers reliable Cellphone ICs that are essential for superior performance. This versatile component is designed to enhance your device's functionality, making it ideal for a wide range of applications. With a durable plastic/epoxy body and compact design, this IC offers exceptional value and efficiency. Upgrade your cellphone with the TCM320AC57IDWR and experience unparalleled benefits and advantages that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to damage, making this product reliable for long-term use.

Surface Mount: YES

Being surface-mountable allows for easy integration into various electronic devices, saving space and simplifying the assembly process.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a standardized form factor for easy compatibility with existing circuit designs.

No. of Terminals: 20

Having a sufficient number of terminals allows for versatile connectivity options and functionality in the circuit.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps in saving space on the circuit board and is suitable for compact electronic devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in a wide range of temperature conditions.

Terminal Position: DUAL

Dual terminal positions provide redundancy and flexibility in connection options, enhancing the versatility of the product.

Maximum Seated Height: 2.65 mm

The low seated height makes this product suitable for compact electronic devices with space constraints.

Width: 7.5 mm

The compact width of the package allows for efficient use of space on the circuit board.

Length: 12.8 mm

The moderate length of the package provides a balance between space-saving and compatibility with standard designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions typically found in industrial settings.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, making this product energy-efficient and suitable for a wide range of applications.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and ease of soldering during the assembly process, ensuring a secure connection.

Telecom IC Type: BASEBAND CIRCUIT

The baseband circuit type is essential for processing and transferring data in telecommunications applications, making this product suitable for communication devices.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V is commonly used in electronics, ensuring compatibility with standard power sources.

Terminal Pitch: 1.27 mm

The small terminal pitch provides high density connectivity options, allowing for a compact and efficient circuit design.

Technical Specifications

Cellphone ICs TCM320AC57IDWR attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TCM320AC57IDWR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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