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TRF370333IRGET

Texas Instruments

TRF370333IRGET by Texas Instruments

TRF370333IRGET by Texas Instruments is a cellphone IC with 24 terminals, operating at -40 to 85°C. It features a 5V supply, RF and baseband circuit for telecom applications, and terminal finish of NiPdAu. The chip carrier package has a square shape, measures 4x4mm in size, and is suitable for industrial temperature grades.

Median Price

$11.766

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 30 parts In-Stock

1+ parts

$1.658

100+ parts

$1.603

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-

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30

$1.658

$1.603

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Chip1Stop

Japan . 30 parts In-Stock

1+ parts

$7.510

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-

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30

$7.510

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Texas Instruments

USA . 35,045 parts In-Stock

1+ parts

$11.766

100+ parts

$10.278

1k+ parts

$7.088

10k+ parts

-

35,045

$11.766

$10.278

$7.088

-

Mouser Electronics

USA . 297 parts In-Stock

1+ parts

$17.490

100+ parts

$13.430

1k+ parts

$11.110

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-

297

$17.490

$13.430

$11.110

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Rochester

USA . 5,147 parts In-Stock

1+ parts

-

100+ parts

$10.190

1k+ parts

$9.120

10k+ parts

$8.580

5,147

-

$10.190

$9.120

$8.580

DigiKey

USA . 5,147 parts In-Stock

1+ parts

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$13.410

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5,147

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$13.410

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Verical

USA . 4,925 parts In-Stock

1+ parts

-

100+ parts

$12.738

1k+ parts

$11.400

10k+ parts

$10.725

4,925

-

$12.738

$11.400

$10.725

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,176 parts In-Stock

1+ parts

$5.906

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3,176

$5.906

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Vyrian

USA . 1,499 parts In-Stock

1+ parts

$6.217

100+ parts

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1,499

$6.217

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DigiKey Marketplace

USA . 5,147 parts In-Stock

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5,147

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Bristol Electronics

USA . 4,211 parts In-Stock

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Dan-Mar Components

USA . 1,250 parts In-Stock

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Netsource Technology, Inc.

USA . 312 parts In-Stock

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312

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Speed Components Ltd

Israel . 250 parts In-Stock

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250

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EZ Electronic Parts

Israel . 242 parts In-Stock

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242

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Microfarads

USA . 80 parts In-Stock

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80

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PC Components Company LLC

USA . 22 parts In-Stock

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22

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Cyclops Electronics Ltd

UK . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,902 parts In-Stock

1+ parts

$5.595

100+ parts

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3,902

$5.595

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Parana Technologies

USA . 1,286 parts In-Stock

1+ parts

$9.854

100+ parts

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$10.422

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1,286

$9.854

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$10.422

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DigiPath Technology Company

USA . 1,954 parts In-Stock

1+ parts

$10.851

100+ parts

$9.983

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1,954

$10.851

$9.983

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ChromeModa Solutions

Germany . 2,120 parts In-Stock

1+ parts

$11.072

100+ parts

$9.079

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2,120

$11.072

$9.079

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IDEA Electronic Components Group

UK . 541 parts In-Stock

1+ parts

$11.072

100+ parts

$10.518

1k+ parts

$9.965

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541

$11.072

$10.518

$9.965

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Lixinc

USA . 19,087 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,154 parts In-Stock

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Perfect Parts

USA . 1,794 parts In-Stock

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Kepictronics

USA . 1,500 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 105 parts In-Stock

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105

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Overview

Elevate your cellphone's performance with the TRF370333IRGET by Texas Instruments. Crafted with precision and expertise, this Cellphone IC offers unmatched quality and reliability. From enhancing signal processing to optimizing power consumption, this product is designed to elevate your mobile experience. Whether you're a tech enthusiast or a casual user, this innovative solution guarantees seamless connectivity and superior functionality. Trust Texas Instruments for cutting-edge technology that delivers exceptional value and performance. Upgrade your device today with the TRF370333IRGET.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making it ideal for mobile devices that require a compact and sturdy design.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, reducing manufacturing costs and improving overall product reliability.

Power Supplies (V): 5

Operating at a standard voltage of 5V makes this IC compatible with a wide range of applications and power sources.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability and performance in various environmental conditions, making it suitable for industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections and long-term durability.

Telecom IC Type: RF AND BASEBAND CIRCUIT

A versatile IC type that can handle both RF and baseband functions, making it suitable for a wide range of telecommunications applications.

Technical Specifications

Cellphone ICs TRF370333IRGET attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

235 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

TRF370333IRGET Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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