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TRF3040PTR

Texas Instruments

TRF3040PTR by Texas Instruments

TRF3040PTR by Texas Instruments is a cellphone IC with 48 terminals, operating at -40 to 85°C. It features a 3.75V supply voltage and RF/baseband circuit type for telecom applications. The package is square, low profile, with gull wing terminals, suitable for industrial temperature grades.

Median Price

$4.888

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 14,000 parts In-Stock

1+ parts

-

100+ parts

$3.910

1k+ parts

$3.500

10k+ parts

$3.300

14,000

-

$3.910

$3.500

$3.300

DigiKey

USA . 14,000 parts In-Stock

1+ parts

-

100+ parts

$5.150

1k+ parts

-

10k+ parts

-

14,000

-

$5.150

-

-

Verical

USA . 14,000 parts In-Stock

1+ parts

-

100+ parts

$4.888

1k+ parts

$4.375

10k+ parts

$4.125

14,000

-

$4.888

$4.375

$4.125

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,353 parts In-Stock

1+ parts

$4.123

100+ parts

-

1k+ parts

-

10k+ parts

-

1,353

$4.123

-

-

-

Vyrian

USA . 2,565 parts In-Stock

1+ parts

$4.340

100+ parts

-

1k+ parts

-

10k+ parts

-

2,565

$4.340

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 781 parts In-Stock

1+ parts

$3.906

100+ parts

-

1k+ parts

-

10k+ parts

-

781

$3.906

-

-

-

Parana Technologies

USA . 1,916 parts In-Stock

1+ parts

$12.439

100+ parts

$1,155.116

1k+ parts

$11.195

10k+ parts

-

1,916

$12.439

$1,155.116

$11.195

-

DigiPath Technology Company

USA . 1,314 parts In-Stock

1+ parts

$13.696

100+ parts

-

1k+ parts

-

10k+ parts

-

1,314

$13.696

-

-

-

ChromeModa Solutions

Germany . 2,990 parts In-Stock

1+ parts

$13.976

100+ parts

$11.460

1k+ parts

-

10k+ parts

-

2,990

$13.976

$11.460

-

-

IDEA Electronic Components Group

UK . 2,207 parts In-Stock

1+ parts

$13.976

100+ parts

$13.277

1k+ parts

$12.578

10k+ parts

-

2,207

$13.976

$13.277

$12.578

-

Overview

Elevate your cellphone's performance with the TRF3040PTR by Texas Instruments. Crafted with precision and expertise, this RF and baseband circuit IC offers unparalleled quality and reliability. Ideal for various applications in the telecommunications industry, this product boasts a wide temperature range and low profile design for seamless integration. Trust in Texas Instruments to deliver cutting-edge technology that enhances your device's capabilities. Experience the value and benefits of the TRF3040PTR today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and ensuring longevity.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during manufacturing.

Power Supplies (V): 3.75

Provides a stable power source for the cellphone ICs, ensuring reliable performance.

No. of Terminals: 48

Sufficient number of terminals for connecting various components, enabling versatile functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Compact and low-profile design that saves space on the circuit board and allows for better heat dissipation.

Maximum Operating Temperature: 85 °C

Ensures that the ICs can operate efficiently even in high-temperature environments.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures allows the ICs to function effectively in various conditions.

Terminal Position: QUAD

Quad terminal positioning provides stability and reliability in the connection between the IC and other components.

Maximum Seated Height: 1.6 mm

Low profile design that helps in fitting the ICs in compact devices without taking up too much space.

Width: 7 mm

Optimal width for easy handling and installation of the ICs on circuit boards.

Length: 7 mm

Compact length that saves space on the circuit board, allowing for efficient layout and design.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications where the ICs may be exposed to harsh environmental conditions.

Terminal Form: GULL WING

Gull wing terminals provide a robust and reliable connection, ensuring long-lasting performance of the ICs.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Supports both RF and baseband circuit functions, making it versatile and suitable for various communication applications.

Nominal Supply Voltage: 3.75 V

Stable supply voltage that ensures consistent and reliable performance of the ICs during operation.

Terminal Pitch: 0.5 mm

Fine pitch terminal spacing allows for high-density packaging and efficient use of space on the circuit board.

Technical Specifications

Cellphone ICs TRF3040PTR attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.75

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3.75 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Trade Compliance

TRF3040PTR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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