Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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RF AND BASEBAND CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
Median Price
$25.900
Lifecycle Status
Suppliers In-Stock
9
In-Stock Inventory
1k+
Richardson RFPD
1+ parts
$22.410
100+ parts
-
1k+ parts
10k+ parts
Verical
Chip1Stop
$31.500
$31.100
Digiode
$21.290
Nova Conductors
$23.425
Flip Electronics
Anansix
Vyrian
VNN
Ampacity Inc.
$19.050
Corphita
$20.169
Bastille Electronics
$23.420
$22.249
$20.844
Continental Prestige Electronics
$22.956
Argo Parts USA
Lixinc
UNI Independent Distributors
Cellphone ICs AFSC5G23D37T2 attributes and parameters. Explore more Cellphone ICs devices from NXP Semiconductors
Moisture Sensitivity Level (MSL):
Peak Reflow Temperature (C):
Telecom IC Type:
Maximum Time At Peak Reflow Temperature (s):
AFSC5G23D37T2 Telecommunications trade compliance attributes, and parameters.
HTS
8542.33.00.01
SB
8542.33.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
STM32F405RGT6
STMicroelectronics
STM32F405RGT6 by STMicroelectronics is a 32-bit microcontroller with 2/3.3V power supplies, 16 external interrupts, and 196608 RAM bytes. Ideal for industrial applications, it features CAN(2), I2C(3), SPI(3) connectivity options and operates at a max clock frequency of 26 MHz. With low power mode and DMA support, it offers versatile performance in compact dimensions.
1N4148
Temic Semiconductors
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM358N
NXP Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
1N4148WS
Jiangsu Changjiang Electronics Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358AN
Texas Instruments
LM358AN by Texas Instruments is an Operational Amplifier with 2 functions. It has a Max Input Offset Voltage of 5000 uV and Nominal Common Mode Reject Ratio of 85 dB. Widely used in voltage-feedback applications due to its high Min Voltage Gain of 15000 and Unity Gain Bandwidth of 1000 kHz.
American Power Devices
ULN2003ADR
ULN2003ADR by Texas Instruments is a NPN BJT with 7 elements, max IC of 0.5A, and VCEsat of 1.6V. Ideal for switching applications in small outline packages with Gull Wing terminals.
National Semiconductor
M39029/56-351
Glenair
CONNECTOR ACCESSORY; Associated Backshell Military - Specifications: MIL-DTL-38999; Material: COPPER ALLOY; Associated Military - Specifications: MIL-DTL-38999; Contact Gender: FEMALE; DIN Conformity: NO;
M39029/58-360
Amphenol
CONNECTOR ACCESSORY; MIL Conformity: YES; Associated Military - Specifications: MIL-DTL-38999; Contact Gender: MALE; Terminal Type: CRIMP; IEC Conformity: NO;
2N7002
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; JESD-609 Code: e3; Minimum DS Breakdown Voltage: 60 V;
DS18B20+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Package Shape or Style: RECTANGULAR; Maximum Operating Current: 1.5 mA; Package Equivalence Code: SIP3,.1,50;
MBR0530T1G
Onsemi
MBR0530T1G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.375V and output current of 0.5A. It operates b/w -65°C to 125°C, making it suitable for applications requiring high-speed switching in compact electronic devices like smartphones and tablets. The package style is small outline with gull wing terminals for surface mount assembly.
SS14
Taiwan Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
STM32H743BIT6
STM32H743BIT6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, 208 terminals, and 1085440 bytes of RAM. It features 2 DAC channels, 32 ADC channels, and operates at a max clock frequency of 48 MHz. Ideal for industrial applications requiring high-speed processing and extensive peripheral connectivity.
FDLL4148
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Hitano Enterprise
LL4148
2N2222A
Bharat Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SPC TECHNOLOGY/ MULTICOMP
CC1150-RTY1
CC1150-RTY1 by Texas Instruments is a cellphone IC with 16 terminals, operating at -40 to 85°C. It features a supply voltage of 3V, RF and baseband circuitry, and CMOS technology. This surface-mount chip carrier has a square shape, 0.65mm terminal pitch, and MSL level of 3 for industrial applications.
SARA-R500S-00B
U-blox Ag
RF AND BASEBAND CIRCUIT;
MAX2606EUT+
Analog Devices
MAX2606EUT+ by Analog Devices is a cellphone IC with 6 terminals in a small outline package. It operates b/w -40 to 85 °C, with a supply voltage of 2.75V. Ideal for baseband circuits in telecom applications due to its low profile and dual terminal position.
TRF5901PTRG4
TRF5901PTRG4 by Texas Instruments is a cellphone IC with 48 terminals in a square package. It operates at -40 to 85°C, with supply voltage of 3V and current draw of 0.053mA. This RF and baseband circuit has CMOS technology, suitable for telecom applications due to its low profile design and fine pitch style.
CC2510F32RHH
CC2510F32RHH by Texas Instruments is a cellphone IC with 36 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 3V. This RF and baseband circuit technology has a terminal pitch of 0.5mm, making it suitable for industrial telecom applications.
MAX2306ETI+T
Analog Devices' MAX2306ETI+T is a cellphone IC with 28 terminals in a square chip carrier package. Operating at -40 to 85 °C, it has a supply voltage of 3/3.3V and max current of 0.0415mA. Ideal for baseband circuits, this IC is designed for telecom applications requiring industrial temperature grade performance.
MAX20461AATJD/V+
BASEBAND CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 1; JESD-609 Code: e3; Terminal Finish: Matte Tin (Sn) - annealed;
CC2420-RTB2
CC2420-RTB2 by Texas Instruments is a cellphone IC with 48 terminals, operating at -40 to 85°C. It features a supply voltage of 1.8V, CMOS technology, and RF/baseband circuitry. This surface-mount chip carrier has a square shape, 0.5mm terminal pitch, and is ideal for industrial temperature-grade applications.
TLV320AC56IPT
TLV320AC56IPT by Texas Instruments is a 48-terminal cellphone IC with 3V supply voltage. It features a 13-bit linear coding, mu-law companding law, and operates in industrial temperature range (-40 to 85°C). Ideal for baseband circuits, this CMOS technology IC has a low profile flatpack package style.
HMC601LP4ETR
Analog Devices' HMC601LP4ETR is a 24-terminal cellphone IC in a square chip carrier package with matte tin finish. Operating temperature range from -40 to 85 °C, suitable for industrial telecom applications. Features RF front end circuit, 3.3V supply voltage, and compact dimensions of 4x4mm for space-constrained designs.
HMC686LP4TR
Analog Devices' HMC686LP4TR is a 24-terminal cellphone IC in a square chip carrier package. Operating temperature range from -40 to 85 °C, suitable for industrial use. Features BICMOS technology for RF and baseband circuits with a nominal voltage of 5V.
MAX20461AATJP/V+
BASEBAND CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
TCM8002IFR
Texas Instruments TCM8002IFR is a cellphone IC with 44 terminals in a square flatpack package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. Features include CMOS technology, 3.3V supply voltage, and baseband circuit for telecom applications.
CC1110F8RSPR
The Texas Instruments CC1110F8RSPR is a cellphone IC with 36 terminals in a square chip carrier package. Operating temperature range from -40 to 85°C, CMOS technology, and RF/baseband circuit for telecom applications. Nominal voltage of 3V, terminal pitch of 0.5mm, and MSL level of 3 make it ideal for industrial use.
MAX2674EWT+T
MAX2674EWT+T by Analog Devices is a Cellphone IC with BICMOS tech, 3.3V supply voltage, and RF/Baseband circuit type. It has a temp range of -40 to 85°C, package style GRID ARRAY, and terminal finish of TIN SILVER COPPER NICKEL. Ideal for telecom applications requiring high performance in a compact form factor.
CC1000/T&R
CC1000/T&R by Texas Instruments is a cellphone IC with 28 terminals, operating at -40 to 85°C. It features a supply voltage of 3V, CMOS technology, and RF/baseband circuit for telecom applications. The package is small outline, thin profile, with shrink pitch and gull wing terminal form.
ADRV9010BBCZ-REEL
Analog Devices' ADRV9010BBCZ-REEL is a cellphone IC with 289 terminals in a low profile, fine pitch grid array package. It operates b/w -40 °C to 110°C and supports RF and baseband circuits at a nominal voltage of 1V. Ideal for telecom applications requiring precise signal processing in compact devices.
CC113LRGPR
The Texas Instruments CC113LRGPR is a cellphone IC with 20 terminals in a square chip carrier package. Operating at temperatures from -40 to 85°C, it has a supply voltage of 1.8/3.6V and data rate of 0.6 Mbps. Ideal for RF and baseband circuits, this IC is surface mountable and features a moisture sensitivity level of 3.
ADF7020BCPZ
Analog Devices' ADF7020BCPZ is a cellphone IC with 48 terminals, operating at -40 to 85°C. It features a supply voltage of 3V, RF and baseband circuitry, and a terminal pitch of 0.5mm. Ideal for telecom applications requiring industrial temperature grade performance in a compact square package.
LMV228UR/NOPB
RF AND BASEBAND CIRCUIT; JESD-609 Code: e1; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 1; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: TIN SILVER COPPER;
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AFSC5G26D37T1
AFSC5G26D37T2
RF AND BASEBAND CIRCUIT; JESD-609 Code: e4; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Terminal Finish: NICKEL GOLD; Maximum Time At Peak Reflow Temperature (s): 40;
AFSC5G26E38
Cellular Telephone Circuits;
AFSC5G35D35T2
RF AND BASEBAND CIRCUIT; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;
AFSC5G35D37T2
RF AND BASEBAND CIRCUIT; Moisture Sensitivity Level (MSL): 3; Terminal Finish: NICKEL GOLD; Peak Reflow Temperature (C): 260; JESD-609 Code: e4; Maximum Time At Peak Reflow Temperature (s): 40;
AFSC5G37D37T2
RF AND BASEBAND CIRCUIT; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260;
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