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HMC601LP4E

Analog Devices

HMC601LP4E by Analog Devices

Analog Devices' HMC601LP4E is a 24-terminal cellphone IC in a square chip carrier package. With an operating temperature range of -40 to 85°C, it's ideal for industrial telecom applications requiring RF front end circuits. The IC operates at a nominal voltage of 3.3V and features matte tin over nickel terminal finish.

Median Price

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Lifecycle Status

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6

In-Stock Inventory

1k+

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Chip Stock

USA . 6,124 parts In-Stock

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Vyrian

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Digiode

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Prism Electronics

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Cogito LLC

Ukraine . 7 parts In-Stock

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Speed Components Ltd

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AZTECH Wire

Italy . 843 parts In-Stock

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$12.286

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Parana Technologies

USA . 4,565 parts In-Stock

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$13.956

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$12.979

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IDEA Electronic Components Group

UK . 101 parts In-Stock

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$15.006

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$14.256

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DigiPath Technology Company

USA . 4,565 parts In-Stock

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$23.409

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$22.473

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One Stop Electronics

USA . 138 parts In-Stock

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Semicontronic

India . 1,068 parts In-Stock

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$937.000

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$908.890

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RC Electronics

USA . 5,000 parts In-Stock

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Corphita

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Overview

Elevate your cellphone's performance with the HMC601LP4E by Analog Devices. Manufactured with precision and expertise, this cutting-edge Cellphone IC offers unparalleled quality and reliability. Designed for seamless integration, this chip carrier package boasts a very thin profile and matte tin over nickel terminal finish for optimal performance. Ideal for RF front end circuits, this Industrial-grade telecom IC operates at a nominal supply voltage of 3.3V, ensuring efficient power consumption. Experience enhanced connectivity and superior functionality with the HMC601LP4E, the ultimate choice for tech-savvy consumers seeking exceptional value and performance in their devices.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for use in portable electronic devices.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly of the product onto circuit boards, saving time and simplifying the manufacturing process.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product can perform reliably even in high temperature environments, ensuring stable operation under various conditions.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V ensures compatibility with a wide range of electronic systems, making it versatile and easily integrable into different applications.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for high-density mounting of components on circuit boards, maximizing space efficiency and enabling compact device designs.

Technical Specifications

Cellphone ICs HMC601LP4E attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4 mm

Trade Compliance

HMC601LP4E Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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