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HMC681ALP5E

Analog Devices

HMC681ALP5E by Analog Devices

Analog Devices' HMC681ALP5E is a 32-terminal cellphone IC in a square chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It features RF and baseband circuits with a nominal voltage of 5V, making it ideal for telecom applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 6,257 parts In-Stock

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Digiode

USA . 917 parts In-Stock

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Cyclops Electronics Ltd

UK . 230 parts In-Stock

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Andel Nordic

Denmark . 266 parts In-Stock

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$0.880

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$0.613

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$0.613

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$0.613

AZTECH Wire

Italy . 599 parts In-Stock

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$8.747

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Parana Technologies

USA . 4,318 parts In-Stock

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$8.973

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$8.345

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IDEA Electronic Components Group

UK . 2,133 parts In-Stock

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$9.648

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$9.166

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DigiPath Technology Company

USA . 518 parts In-Stock

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$15.051

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$14.449

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$14.449

518

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$14.449

One Stop Electronics

USA . 1,083 parts In-Stock

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$127.000

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Semicontronic

India . 397 parts In-Stock

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$432.000

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$421.200

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$419.040

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Kepictronics

USA . 6,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,008 parts In-Stock

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Corphita

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Authorized Procurement Solutions

USA . 66 parts In-Stock

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Overview

Elevate your cellphone's performance with the HMC681ALP5E by Analog Devices. Renowned for their top-notch quality, Analog Devices delivers cutting-edge Cellphone ICs that guarantee optimal functionality and reliability. With a package body material of PLASTIC/EPOXY and a maximum operating temperature of 85°C, this RF and baseband circuit offers unmatched value and benefits. Perfect for various telecom applications, this product boasts a very thin profile and a terminal pitch of 0.5 mm, ensuring seamless integration and efficient operation. Upgrade your device today with the HMC681ALP5E and experience unparalleled performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material is lightweight and durable, making the IC easy to handle and resistant to damage during transportation and installation.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and costs during production.

Package Shape: SQUARE

Square package shape is commonly used for ICs, providing a stable and compact form factor for easy integration into electronic devices.

No. of Terminals: 32

Having 32 terminals allows for the IC to have multiple input and output connections, enabling it to perform various functions within a cellphone.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style offers a combination of efficient heat dissipation with a compact and thin profile, making it suitable for small form factor devices like cellphones.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the IC can withstand heat generated during operation without malfunctioning, ensuring reliability in various environmental conditions.

Minimum Operating Temperature: -40 °C

A low minimum operating temperature allows the IC to function in cold environments, providing versatility and performance across a wide temperature range.

Terminal Position: QUAD

Quad terminal position provides stable electrical connections for improved signal transmission and reduced interference, enhancing the overall performance of the IC.

Maximum Seated Height: 1 mm

A low maximum seated height enables a slim and compact design for the IC, making it suitable for thin and lightweight cellphone designs.

Width: 5 mm

With a small width, the IC can be easily integrated into limited space within a cellphone, allowing for efficient use of internal components.

Length: 5 mm

The compact length of the IC contributes to the overall small form factor of the device, ensuring space-efficient design and layout.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the IC can operate reliably in harsh industrial environments, making it suitable for commercial cellphone applications.

Terminal Form: NO LEAD

No lead terminal form reduces the risk of potential environmental hazards and enables compliance with RoHS regulations, promoting a more eco-friendly design.

Telecom IC Type: RF AND BASEBAND CIRCUIT

RF and baseband circuit integration within the IC allows for efficient wireless communication and signal processing in cellphones, enhancing connectivity and performance.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 V, the IC can be easily powered by standard voltage sources commonly used in electronic devices, ensuring compatibility.

Terminal Pitch: 0.5 mm

A small terminal pitch of 0.5 mm enables densely packed connections on the IC, facilitating high-density integration on PCBs and enhancing overall efficiency.

Technical Specifications

Cellphone ICs HMC681ALP5E attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N32

Length:

5 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Trade Compliance

HMC681ALP5E Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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