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ADRF5547BCPZN-R7

Analog Devices

ADRF5547BCPZN-R7 by Analog Devices

Analog Devices' ADRF5547BCPZN-R7 is a cellphone IC with 40 terminals in a square chip carrier package. It operates b/w -40 to 105°C, suitable for industrial use. This RF front end circuit has a nominal voltage of 5V and terminal pitch of 0.5mm, making it ideal for telecom applications.

Median Price

$27.110

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Analog Devices Inc

USA . 14,363 parts In-Stock

1+ parts

$27.110

100+ parts

$20.833

1k+ parts

$15.440

10k+ parts

-

14,363

$27.110

$20.833

$15.440

-

DigiKey

USA . 562 parts In-Stock

1+ parts

$31.400

100+ parts

$23.623

1k+ parts

$20.792

10k+ parts

-

562

$31.400

$23.623

$20.792

-

Verical

USA . 14,250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$16.611

10k+ parts

-

14,250

-

-

$16.611

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 373 parts In-Stock

1+ parts

$24.871

100+ parts

-

1k+ parts

-

10k+ parts

-

373

$24.871

-

-

-

Vyrian

USA . 897 parts In-Stock

1+ parts

$26.180

100+ parts

-

1k+ parts

-

10k+ parts

-

897

$26.180

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,023 parts In-Stock

1+ parts

$16.159

100+ parts

-

1k+ parts

$15.028

10k+ parts

-

1,023

$16.159

-

$15.028

-

IDEA Electronic Components Group

UK . 1,845 parts In-Stock

1+ parts

$17.375

100+ parts

$16.506

1k+ parts

$16.506

10k+ parts

-

1,845

$17.375

$16.506

$16.506

-

Native Components

USA . 355 parts In-Stock

1+ parts

$18.320

100+ parts

-

1k+ parts

-

10k+ parts

-

355

$18.320

-

-

-

Northwest PG Solutions

USA . 2,367 parts In-Stock

1+ parts

$20.152

100+ parts

$18.137

1k+ parts

-

10k+ parts

-

2,367

$20.152

$18.137

-

-

Semicontronic

India . 25 parts In-Stock

1+ parts

$22.250

100+ parts

$21.694

1k+ parts

$21.582

10k+ parts

-

25

$22.250

$21.694

$21.582

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Corphita

USA . 773 parts In-Stock

1+ parts

$23.562

100+ parts

-

1k+ parts

-

10k+ parts

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773

$23.562

-

-

-

DigiPath Technology Company

USA . 1,844 parts In-Stock

1+ parts

$27.105

100+ parts

$26.021

1k+ parts

-

10k+ parts

$26.021

1,844

$27.105

$26.021

-

$26.021

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,000

-

-

-

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Overview

Unlock the full potential of your cellphone with the ADRF5547BCPZN-R7 by Analog Devices. Known for their superior quality and cutting-edge technology, Analog Devices delivers top-of-the-line Cellphone ICs that are guaranteed to enhance performance and efficiency. This versatile RF Front End Circuit boasts a wide range of applications, ensuring seamless communication and connectivity. With a compact square package style and a maximum operating temperature of 105°C, this product is designed to exceed expectations. Elevate your device's capabilities with the ADRF5547BCPZN-R7 and experience unmatched value and reliability.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto printed circuit boards, saving time and costs during manufacturing.

Package Shape: SQUARE

Square package shape allows for a compact design, making it suitable for space-constrained applications.

No. of Terminals: 40

Having a high number of terminals provides flexibility in connectivity and functionality, allowing for more complex circuit designs.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles allows for efficient heat dissipation and a reduced overall footprint, making it ideal for compact devices with thermal constraints.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures reliability even in harsh environments where temperature fluctuations occur.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in cold environments without compromising performance.

Terminal Position: QUAD

Quad terminal position provides a stable and secure connection, reducing the risk of signal interference or loss.

Maximum Seated Height: 1 mm

The low maximum seated height enables a compact design and facilitates installation in slim devices.

Width: 6 mm

The compact width of 6 mm allows for efficient use of space on a circuit board, enabling a streamlined design layout.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures that the IC is not subjected to excessive heat for an extended period, reducing the risk of damage during manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for robust soldering connections during assembly, ensuring reliable performance in various operating conditions.

Length: 6 mm

The compact length of 6 mm contributes to the overall small form factor of the IC, making it suitable for applications where space is limited.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the IC can operate reliably in demanding industrial environments with temperature fluctuations.

Terminal Form: NO LEAD

No lead terminal form is environmentally friendly and complies with regulations on hazardous substances, making it a sustainable choice.

Telecom IC Type: RF FRONT END CIRCUIT

Being designed for RF front-end circuit applications, this IC offers high performance and efficiency in wireless communication systems.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 V makes this IC compatible with standard power sources, simplifying integration into existing systems.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm allows for dense packing of terminals on a small footprint, enhancing connectivity options in a limited space.

Moisture Sensitivity Level (MSL): 3

MSL level of 3 indicates that this IC can withstand exposure to moderate levels of moisture during handling and assembly processes, ensuring reliability in humid environments.

Technical Specifications

Cellphone ICs ADRF5547BCPZN-R7 attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N40

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

ADRF5547BCPZN-R7 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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