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ADRF5545ABCPZN-RL

Analog Devices

ADRF5545ABCPZN-RL by Analog Devices

Analog Devices' ADRF5545ABCPZN-RL is a cellphone IC with 40 terminals in a square chip carrier package. It operates b/w -40 to 105 °C, suitable for industrial telecom applications. With RF and baseband circuits, it has a nominal voltage of 5V and terminal pitch of 0.5mm.

Median Price

$19.186

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 15,000 parts In-Stock

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$19.186

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$19.186

Distributors (In-Stock)

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Digiode

USA . 713 parts In-Stock

1+ parts

$19.864

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$19.864

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Vyrian

USA . 3,734 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 1,962 parts In-Stock

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$7.147

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$6.647

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1,962

$7.147

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$6.647

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IDEA Electronic Components Group

UK . 1,220 parts In-Stock

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$7.685

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$7.301

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$7.685

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DigiPath Technology Company

USA . 87 parts In-Stock

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$11.989

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$11.509

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$11.509

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$11.509

Semicontronic

India . 14,954 parts In-Stock

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$16.310

100+ parts

$15.902

1k+ parts

$15.821

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$15.902

$15.821

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AZTECH Wire

Italy . 602 parts In-Stock

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$17.520

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Native Components

USA . 976 parts In-Stock

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$18.320

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Corphita

USA . 724 parts In-Stock

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$18.819

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Northwest PG Solutions

USA . 1,132 parts In-Stock

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$20.152

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$18.137

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Overview

Elevate your cellphone ICs with the ADRF5545ABCPZN-RL by Analog Devices. Known for their superior quality and cutting-edge technology, Analog Devices delivers top-notch products that exceed industry standards. This surface mount package offers a compact square shape with 40 terminals, making it ideal for various telecom applications. With a wide temperature range, nickel palladium gold finish, and industrial-grade reliability, this RF and baseband circuit is sure to enhance your device's performance. Upgrade your design with the ADRF5545ABCPZN-RL and experience unmatched value and benefits.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Package Shape: SQUARE

Square packages are often more space-efficient and can facilitate better heat dissipation compared to other shapes.

No. of Terminals: 40

Provides ample connectivity options for various components and peripherals in the cellphone circuit.

Maximum Operating Temperature: 105 °C

Ensures reliable performance even under demanding temperature conditions.

Minimum Operating Temperature: -40 °C

Allows for operation in cold environments without performance degradation.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance for long-lasting performance.

Terminal Position: QUAD

Quad terminal position offers better stability and reliability compared to other configurations.

Width: 6 mm

Compact width allows for space-saving integration within the cellphone circuit.

Peak Reflow Temperature °C: 260

Can withstand high-temperature reflow processes during assembly without compromising performance.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications where reliability and durability are crucial.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Specifically designed for telecommunications applications, ensuring optimal performance in cellphone circuits.

Nominal Supply Voltage: 5 V

Compatible with standard 5V supply, making it easy to integrate into existing cellphone systems.

Moisture Sensitivity Level (MSL): 3

Indicates moderate sensitivity to moisture, suitable for controlled environments in cellphone applications.

Technical Specifications

Cellphone ICs ADRF5545ABCPZN-RL attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

ADRF5545ABCPZN-RL Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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