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LP3939ILQ

Texas Instruments

LP3939ILQ by Texas Instruments

LP3939ILQ by Texas Instruments is a cellphone IC with 16 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It features RF and baseband circuits, nominal voltage of 3V, and terminal pitch of 0.5mm for telecom applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,110 parts In-Stock

1+ parts

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6,110

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Digiode

USA . 1,639 parts In-Stock

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1,639

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Anansix

USA . 851 parts In-Stock

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851

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Distributors (Availability)

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AZTECH Wire

Italy . 452 parts In-Stock

1+ parts

$8.480

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452

$8.480

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Parana Technologies

USA . 1,769 parts In-Stock

1+ parts

$11.320

100+ parts

$1,051.225

1k+ parts

$10.188

10k+ parts

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1,769

$11.320

$1,051.225

$10.188

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DigiPath Technology Company

USA . 924 parts In-Stock

1+ parts

$12.465

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924

$12.465

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ChromeModa Solutions

Germany . 6,650 parts In-Stock

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$12.719

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$10.430

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6,650

$12.719

$10.430

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IDEA Electronic Components Group

UK . 679 parts In-Stock

1+ parts

$12.719

100+ parts

$12.083

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$11.447

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679

$12.719

$12.083

$11.447

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One Stop Electronics

USA . 951 parts In-Stock

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$482.000

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951

$482.000

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Corphita

USA . 4,471 parts In-Stock

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4,471

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Overview

Enhance your cellphone's performance with the LP3939ILQ by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Cellphone ICs that guarantee reliable functionality. Designed for telecom applications, this IC offers a range of benefits including high efficiency, stability, and durability. With a compact package body material and advanced technology, the LP3939ILQ ensures optimal performance even in extreme temperatures. Upgrade your device with this innovative solution and experience seamless connectivity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body ensures durability and reliability in various environmental conditions.

Surface Mount: YES

Being surface mountable makes it easier to integrate this IC into electronic circuit boards, saving space and improving assembly efficiency.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board, enabling compact device designs.

No. of Terminals: 16

Having 16 terminals provides ample connectivity options for different components in the circuit, offering versatility in circuit design.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles ensure efficient heat dissipation and space-saving design.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this IC can perform reliably in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The wide temperature range from -40 to 85°C ensures the IC can function in extreme cold and hot conditions.

Terminal Position: QUAD

The quad terminal position allows for easy connection to other components in the circuit, enhancing overall system performance.

Maximum Seated Height: 0.8 mm

The low maximum seated height of 0.8 mm enables a slim device profile and efficient use of vertical space in the circuit layout.

Width: 4 mm

The compact 4 mm width of the IC contributes to space-saving designs and facilitates crowded circuit board layouts.

Length: 4 mm

The 4 mm length of the IC ensures a square form factor, enabling symmetric and efficient placement on the circuit board.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates that this IC is designed to operate reliably in harsh industrial environments with varying temperature conditions.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the soldering process and enhances the overall reliability of the IC's electrical connections.

Telecom IC Type: RF AND BASEBAND CIRCUIT

The RF and baseband circuit integration in this IC makes it suitable for telecommunications applications, offering versatile connectivity options.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3V, this IC is energy-efficient and compatible with various power sources in electronic devices.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm allows for high-density integration on the circuit board, optimizing connectivity and signal transmission.

Technical Specifications

Cellphone ICs LP3939ILQ attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N16

Length:

4 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

LP3939ILQ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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