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TCM320AC57IDW

Texas Instruments

TCM320AC57IDW by Texas Instruments

TCM320AC57IDW by Texas Instruments is a Cellphone IC with 20 terminals, operating at temperatures from -40 to 85°C. It features a 13-bit linear coding and A-Law companding law, suitable for baseband circuit applications. This small outline package has a rectangular shape, gull wing terminal form, and requires a 5V supply voltage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,410 parts In-Stock

1+ parts

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5,410

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Digiode

USA . 2,971 parts In-Stock

1+ parts

-

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-

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2,971

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 287 parts In-Stock

1+ parts

$10.143

100+ parts

-

1k+ parts

-

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287

$10.143

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Parana Technologies

USA . 1,209 parts In-Stock

1+ parts

$11.864

100+ parts

-

1k+ parts

$12.261

10k+ parts

-

1,209

$11.864

-

$12.261

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DigiPath Technology Company

USA . 1,450 parts In-Stock

1+ parts

$13.063

100+ parts

$12.018

1k+ parts

-

10k+ parts

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1,450

$13.063

$12.018

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ChromeModa Solutions

Germany . 3,633 parts In-Stock

1+ parts

$13.330

100+ parts

$10.931

1k+ parts

-

10k+ parts

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3,633

$13.330

$10.931

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IDEA Electronic Components Group

UK . 88 parts In-Stock

1+ parts

$13.330

100+ parts

$12.664

1k+ parts

$11.997

10k+ parts

-

88

$13.330

$12.664

$11.997

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One Stop Electronics

USA . 435 parts In-Stock

1+ parts

$681.000

100+ parts

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435

$681.000

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Corphita

USA . 3,582 parts In-Stock

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3,582

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Overview

Upgrade your cellphone's performance with the TCM320AC57IDW by Texas Instruments. Crafted with precision and expertise, this cellphone IC delivers unparalleled quality and reliability. Designed for optimal functionality and efficiency, this product is perfect for a wide range of applications in the telecommunications industry. Experience seamless communication and enhanced user experience with this cutting-edge technology. Trust Texas Instruments to provide you with the best solutions for your technological needs. Elevate your devices with the TCM320AC57IDW and enjoy superior performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product easy to handle and resistant to damage during handling and installation.

Surface Mount: YES

Being surface mountable, this product can be easily mounted on circuit boards, saving space and simplifying the manufacturing process.

Power Supplies (V): 5

Operating at a standard voltage of 5V, this product can be easily integrated into existing systems without the need for additional power sources.

No. of Terminals: 20

With a high number of terminals, this product offers versatile connectivity options and can support complex circuit configurations.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures reliable performance even in demanding environmental conditions.

Technology: CMOS

Utilizing CMOS technology, this product offers low power consumption and high noise immunity, making it efficient and reliable for use.

Technical Specifications

Cellphone ICs TCM320AC57IDW attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

Companding Law:

A-LAW

Filter:

YES

Maximum Gain Tolerance:

1 dB

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Linear Coding:

13-BIT

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Codecs

Maximum Supply Current:

.0099 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

TCM320AC57IDW Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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