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TCM320AC56CPT

Texas Instruments

TCM320AC56CPT by Texas Instruments

TCM320AC56CPT by Texas Instruments is a cellphone IC with 48 terminals, operating at 0-70°C. It features a 13-bit linear coding, μ-law companding law, and operates on a 5V supply voltage. This baseband circuit IC has a low profile flatpack package suitable for telecom applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,717 parts In-Stock

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8,717

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Digiode

USA . 551 parts In-Stock

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551

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,901 parts In-Stock

1+ parts

$6.929

100+ parts

-

1k+ parts

$7.522

10k+ parts

-

1,901

$6.929

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$7.522

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DigiPath Technology Company

USA . 287 parts In-Stock

1+ parts

$7.629

100+ parts

$7.019

1k+ parts

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287

$7.629

$7.019

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IDEA Electronic Components Group

UK . 1,334 parts In-Stock

1+ parts

$7.785

100+ parts

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1k+ parts

$7.006

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1,334

$7.785

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$7.006

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ChromeModa Solutions

Germany . 328 parts In-Stock

1+ parts

$7.785

100+ parts

$6.384

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328

$7.785

$6.384

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AZTECH Wire

Italy . 630 parts In-Stock

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$16.951

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630

$16.951

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One Stop Electronics

USA . 1,237 parts In-Stock

1+ parts

$937.000

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1,237

$937.000

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Corphita

USA . 3,980 parts In-Stock

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3,980

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Overview

Unlock the potential of your cellphone with the TCM320AC56CPT by Texas Instruments. Known for their exceptional quality and reliability, Texas Instruments brings you a top-of-the-line Cellphone IC that promises unparalleled performance. Whether you're looking to enhance audio quality, improve signal processing, or optimize power consumption, this product delivers on all fronts. Say goodbye to subpar cellphone experiences and hello to a new level of efficiency and functionality with the TCM320AC56CPT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and reliability for the cellphone ICs.

Surface Mount: YES

Being surface mountable makes it easy to integrate the ICs onto circuit boards quickly and efficiently.

Power Supplies (V): 5

Operating at a standard voltage of 5V makes these ICs compatible with a wide range of devices and power sources.

No. of Terminals: 48

Having 48 terminals allows for a greater level of connectivity and functionality within the ICs.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, these ICs can withstand high heat environments without compromising performance.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high-speed performance, making these ICs energy-efficient and effective.

Telecom IC Type: BASEBAND CIRCUIT

Being designed as a baseband circuit telecom IC ensures optimal signal processing and communication functionality for cellphones.

Technical Specifications

Cellphone ICs TCM320AC56CPT attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

Companding Law:

MU-LAW

Filter:

YES

Maximum Gain Tolerance:

1 dB

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Linear Coding:

13-BIT

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Codecs

Maximum Supply Current:

.0099 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Trade Compliance

TCM320AC56CPT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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