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TCM320AC56CDW

Texas Instruments

TCM320AC56CDW by Texas Instruments

TCM320AC56CDW by Texas Instruments is a 20-terminal cellphone IC with 5V power supply, operating b/w 0-70°C. It features a compact rectangular package style, companding law MU-LAW, and telecom IC type BASEBAND CIRCUIT. Ideal for applications requiring small outline packages and high gain tolerance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,638 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,638

-

-

-

-

Digiode

USA . 1,845 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,845

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 197 parts In-Stock

1+ parts

$10.869

100+ parts

-

1k+ parts

$11.346

10k+ parts

-

197

$10.869

-

$11.346

-

DigiPath Technology Company

USA . 426 parts In-Stock

1+ parts

$11.968

100+ parts

$11.010

1k+ parts

-

10k+ parts

-

426

$11.968

$11.010

-

-

ChromeModa Solutions

Germany . 6,979 parts In-Stock

1+ parts

$12.212

100+ parts

$10.014

1k+ parts

-

10k+ parts

-

6,979

$12.212

$10.014

-

-

IDEA Electronic Components Group

UK . 1,954 parts In-Stock

1+ parts

$12.212

100+ parts

$11.601

1k+ parts

$10.991

10k+ parts

-

1,954

$12.212

$11.601

$10.991

-

AZTECH Wire

Italy . 376 parts In-Stock

1+ parts

$18.435

100+ parts

-

1k+ parts

-

10k+ parts

-

376

$18.435

-

-

-

One Stop Electronics

USA . 141 parts In-Stock

1+ parts

$615.000

100+ parts

-

1k+ parts

-

10k+ parts

-

141

$615.000

-

-

-

Corphita

USA . 3,495 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,495

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-

-

-

Overview

Enhance the performance of your cellphone with the TCM320AC56CDW by Texas Instruments, a top-tier manufacturer known for producing high-quality Cellphone ICs. This innovative product offers seamless integration, compact design, and superior functionality to elevate your device's capabilities. Whether you're looking to improve sound quality, optimize signal processing, or enhance overall performance, this cutting-edge technology provides the value, benefits, and advantages you need. Upgrade your cellphone experience with the TCM320AC56CDW and enjoy unparalleled results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material is cost-effective and lightweight, making it suitable for cellphones where weight and cost are important factors.

Surface Mount: YES

Surface mount technology allows for efficient assembly and compact designs, making the cellphone ICs easy to integrate into the overall smartphone design.

Power Supplies (V): 5

Operating at 5V makes it compatible with standard power sources found in most electronic devices, ensuring easy integration and compatibility.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the cellphone ICs energy-efficient and reliable for long-term use.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the cellphone ICs can operate reliably even under moderate to high temperature conditions, ensuring consistent performance.

Technical Specifications

Cellphone ICs TCM320AC56CDW attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

Companding Law:

MU-LAW

Filter:

YES

Maximum Gain Tolerance:

1 dB

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Linear Coding:

13-BIT

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Codecs

Maximum Supply Current:

.0099 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

TCM320AC56CDW Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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