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TCM4400EPN

Texas Instruments

TCM4400EPN by Texas Instruments

Texas Instruments TCM4400EPN is a Cellphone IC with 80 terminals in a square flatpack package. Operating b/w -25 to 85°C, it uses BICMOS technology and requires 3V supply voltage. Ideal for baseband circuits, this IC has a low supply current of 0.03mA and compact dimensions of 12x12mm.

Median Price

$5.090

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,132 parts In-Stock

1+ parts

-

100+ parts

$4.400

1k+ parts

$3.940

10k+ parts

$3.700

1,132

-

$4.400

$3.940

$3.700

DigiKey

USA . 611 parts In-Stock

1+ parts

-

100+ parts

$5.090

1k+ parts

-

10k+ parts

-

611

-

$5.090

-

-

Verical

USA . 521 parts In-Stock

1+ parts

-

100+ parts

$5.500

1k+ parts

$4.925

10k+ parts

$4.625

521

-

$5.500

$4.925

$4.625

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,791 parts In-Stock

1+ parts

$4.646

100+ parts

-

1k+ parts

-

10k+ parts

-

1,791

$4.646

-

-

-

Vyrian

USA . 2,621 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,621

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 682 parts In-Stock

1+ parts

$4.160

100+ parts

-

1k+ parts

-

10k+ parts

-

682

$4.160

-

-

-

Semicontronic

India . 664 parts In-Stock

1+ parts

$4.160

100+ parts

$4.056

1k+ parts

$4.035

10k+ parts

-

664

$4.160

$4.056

$4.035

-

Corphita

USA . 4,323 parts In-Stock

1+ parts

$4.401

100+ parts

-

1k+ parts

-

10k+ parts

-

4,323

$4.401

-

-

-

Corohmni

South Africa . 175 parts In-Stock

1+ parts

$4.890

100+ parts

-

1k+ parts

-

10k+ parts

-

175

$4.890

-

-

-

Parana Technologies

USA . 435 parts In-Stock

1+ parts

$7.133

100+ parts

$662.440

1k+ parts

$6.420

10k+ parts

-

435

$7.133

$662.440

$6.420

-

DigiPath Technology Company

USA . 50 parts In-Stock

1+ parts

$7.855

100+ parts

$7.226

1k+ parts

-

10k+ parts

-

50

$7.855

$7.226

-

-

ChromeModa Solutions

Germany . 4,994 parts In-Stock

1+ parts

$8.015

100+ parts

$6.572

1k+ parts

-

10k+ parts

-

4,994

$8.015

$6.572

-

-

IDEA Electronic Components Group

UK . 866 parts In-Stock

1+ parts

$8.015

100+ parts

-

1k+ parts

$7.214

10k+ parts

-

866

$8.015

-

$7.214

-

Overview

Enhance the performance of your cellphone with the TCM4400EPN by Texas Instruments. Crafted with precision and quality, this innovative baseband circuit IC offers unparalleled reliability and efficiency. From seamless connectivity to enhanced signal processing, this product is designed to elevate your mobile experience. Trust in Texas Instruments' expertise in semiconductor manufacturing to deliver cutting-edge technology that exceeds expectations. Upgrade your device today with the TCM4400EPN and unlock a new level of functionality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, reducing the overall weight of the product and increasing its longevity.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation of the IC onto a PCB, saving time and effort during assembly.

Package Shape: SQUARE

The square package shape provides a compact form factor, making it easier to fit into tight spaces within the device.

Power Supplies (V): 3

Operating at a standard voltage of 3V makes the IC compatible with a wide range of applications and power sources.

No. of Terminals: 80

Having 80 terminals allows for a greater number of connections and functionalities, making the IC versatile and capable of handling complex tasks.

Package Style (Meter): FLATPACK

The flatpack package style offers a low profile design, saving space and allowing for efficient heat dissipation.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the IC can withstand high temperature environments without compromising performance.

Minimum Operating Temperature: -25 °C

The ability to operate at temperatures as low as -25°C ensures the IC can function reliably in cold conditions.

Terminal Position: QUAD

The quad terminal position offers stability and secure connections, reducing the risk of signal interference or disconnections.

Maximum Seated Height: 1.6 mm

With a maximum seated height of 1.6mm, the IC can be easily integrated into compact devices without adding unnecessary bulk.

Width: 12 mm

A width of 12mm provides a balance between compactness and ease of handling during installation or replacement.

Length: 12 mm

A length of 12mm ensures the IC can fit comfortably within the device's design constraints without protruding or causing interference.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high performance and low power consumption.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable connections, reducing the risk of signal loss or damage during installation or operation.

Maximum Supply Current: 0.03 mA

With a maximum supply current of 0.03mA, the IC consumes minimal power, prolonging battery life in portable devices.

Telecom IC Type: BASEBAND CIRCUIT

Being a baseband circuit IC, it is responsible for essential functions like signal processing and data transmission, making it a critical component in telecom devices.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3V ensures compatibility with standard power sources, simplifying design and integration into various applications.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5mm allows for precise and compact connections, ensuring efficient signal transfer and reducing the risk of signal interference.

Technical Specifications

Cellphone ICs TCM4400EPN attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G80

Length:

12 mm

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.03 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Trade Compliance

TCM4400EPN Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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