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HMC686LP4TR

Analog Devices

HMC686LP4TR by Analog Devices

Analog Devices' HMC686LP4TR is a 24-terminal cellphone IC in a square chip carrier package. Operating temperature range from -40 to 85 °C, suitable for industrial use. Features BICMOS technology for RF and baseband circuits with a nominal voltage of 5V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,047 parts In-Stock

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8,047

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Digiode

USA . 782 parts In-Stock

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782

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Distributors (Availability)

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Parana Technologies

USA . 1,994 parts In-Stock

1+ parts

$5.842

100+ parts

-

1k+ parts

$5.433

10k+ parts

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1,994

$5.842

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$5.433

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IDEA Electronic Components Group

UK . 2,373 parts In-Stock

1+ parts

$6.282

100+ parts

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$5.968

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2,373

$6.282

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$5.968

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DigiPath Technology Company

USA . 2,199 parts In-Stock

1+ parts

$9.800

100+ parts

$9.408

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2,199

$9.800

$9.408

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AZTECH Wire

Italy . 360 parts In-Stock

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$14.196

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360

$14.196

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Semicontronic

India . 1,364 parts In-Stock

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$50.000

100+ parts

$48.750

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$48.500

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1,364

$50.000

$48.750

$48.500

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One Stop Electronics

USA . 1,537 parts In-Stock

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$78.000

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1,537

$78.000

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Corphita

USA . 588 parts In-Stock

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588

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Overview

Unlock the full potential of your cellphone with the HMC686LP4TR by Analog Devices. Known for their top-quality products, Analog Devices delivers cutting-edge Cellphone ICs that are essential for optimal performance. This versatile chip carrier is designed with a very thin profile for seamless integration into various devices. With a wide temperature range and industrial-grade technology, this RF and baseband circuit ensures reliable operation in any environment. Elevate your mobile experience and enjoy superior connectivity and functionality with the HMC686LP4TR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to environmental factors, making the product suitable for long-term use.

Surface Mount: YES

Enables easy and efficient installation on circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

Allows for efficient use of space on the circuit board, maximizing the overall functionality in a compact design.

No. of Terminals: 24

Offers sufficient connectivity options for various functions, ensuring versatility and compatibility with different systems.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Enhances thermal management and overall performance of the IC, enabling optimal functionality in demanding industrial environments.

Maximum Operating Temperature: 85 °C

Ensures reliable operation even in high-temperature conditions, making the IC suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

Maintains stability and performance in low-temperature environments, increasing the product's versatility for use in various climates.

Terminal Position: QUAD

Facilitates efficient signal transmission and processing, enhancing the overall performance and reliability of the IC.

Maximum Seated Height: 1 mm

Allows for compact integration and space-saving design in electronic devices, maintaining a sleek and slim profile.

Width: 4 mm

Provides a compact footprint, enabling the IC to fit comfortably within small electronic devices without compromising on performance.

Length: 4 mm

Offers a balanced form factor, ensuring easy integration and compatibility with various electronic systems.

Temperature Grade: INDUSTRIAL

Meets the rigorous standards for industrial applications, ensuring reliable operation in demanding environments.

Technology: BICMOS

Combines the benefits of both bipolar and CMOS technologies, offering high-speed performance and low power consumption for efficient operation.

Terminal Form: NO LEAD

Enhances reliability and connectivity, ensuring stable and secure terminal connections for uninterrupted performance.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Supports both wireless communication and signal processing functions, making the IC versatile for use in telecommunication applications.

Nominal Supply Voltage: 5 V

Operates at a standard voltage level, making it compatible with a wide range of electronic devices and power sources.

Terminal Pitch: 0.5 mm

Enables precise and compact terminal spacing, facilitating efficient signal transmission and reducing the risk of signal interference.

Technical Specifications

Cellphone ICs HMC686LP4TR attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N24

Length:

4 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

HMC686LP4TR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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