Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TRF4400PWR by Texas Instruments is a cellphone IC with 24 terminals, operating at 3V. It features CMOS technology, RF and baseband circuit for telecom applications. The package is small outline, thin profile, with shrink pitch, suitable for surface mount assembly.
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$2.763
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$2.764
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$2.619
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$6.266
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$7.040
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$6.336
The use of plastic/epoxy for the package body material makes the product cost-effective and lightweight.
Being surface mountable enables easy and efficient assembly onto PCBs, saving time and space.
The rectangular package shape allows for efficient use of space on the PCB.
Operating at 3V makes this product compatible with standard power supply voltages, ensuring widespread usability.
Having 24 terminals provides ample connectivity options for various functions and interfaces.
The small outline, thin profile, and shrink pitch package style offer space-saving benefits and enhanced PCB design flexibility.
With a maximum operating temperature of 60°C, this product can withstand higher temperature environments.
With a minimum operating temperature of -20°C, this product remains operational even in low-temperature conditions.
The dual terminal position provides redundancy and improved reliability for connections.
The low maximum seated height allows for a compact overall product size.
The narrow width contributes to space-saving and compact PCB layout designs.
The compact length of 7.8 mm further enhances space efficiency on the PCB.
Utilizing CMOS technology offers low power consumption and high noise immunity, benefiting overall performance.
The gull wing terminal form provides mechanical strength and facilitates efficient soldering during assembly.
With a low maximum supply current of 0.075 mA, this product is energy-efficient and helps prolong battery life.
Combining RF and baseband circuitry in one package simplifies design and integration for telecommunications applications.
Having a nominal supply voltage of 3V ensures compatibility with standard power sources and systems.
The small terminal pitch of 0.65 mm enables high-density mounting and fine-pitch assembly, enhancing overall product performance.
Cellphone ICs TRF4400PWR attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments
JESD-30 Code:
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TRF4400PWR Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
LM358AN
Onsemi
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
1N4148WT
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
International Devices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
CSNF651
Honeywell Sensing And Control
CSNF651 by Honeywell Sensing And Control is an industrial-grade analog circuit with 3 terminals. It operates b/w -40 to 85°C, supporting supply voltages from -15V to 15V. Ideal for applications requiring a special shape rectangular package style and through-hole terminal form.
STMicroelectronics
SMBJ18CA
First Components International
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.1 V; Polarity: BIDIRECTIONAL; Maximum Repetitive Peak Reverse Voltage: 18 V;
2N7002
Siliconix
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain Current (ID): .115 A; Operating Mode: ENHANCEMENT MODE;
Crystalonics
2N7002,215
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): 30; Transistor Application: SWITCHING; Package Body Material: PLASTIC/EPOXY;
BSS123,215
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Moisture Sensitivity Level (MSL): 1; No. of Terminals: 3; Maximum Time At Peak Reflow Temperature (s): 30;
BAV99
Rfe International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317T
National Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Package Shape: RECTANGULAR; Minimum Input-Output Voltage Differential: 3 V;
1N4148WS
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM555CMX
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LM358MX
Texas Instruments
LM358MX by Texas Instruments is a dual operational amplifier with a max input offset voltage of 9000 uV. It has a nominal voltage of 5V and a min voltage gain of 15000. This op amp is commonly used in applications requiring amplification and signal conditioning.
1N5819HW-7-F
SPC TECHNOLOGY/ MULTICOMP
1N4148
Bkc Semiconductors
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Silicon Standard
Laube Technology
CRG0805F10R
TE Connectivity
TE Connectivity's CRG0805F10R is a 10 ohm fixed resistor with 1% tolerance and 0.125 W power dissipation. It features thick film technology, SMT package style, and matte tin over nickel terminal finish. Ideal for surface mount applications in electronics, offering a temperature coefficient of 200 ppm/°C and operating voltage of 150 V.
TRF370417IRGET
TRF370417IRGET by Texas Instruments is a 24-terminal cellphone IC with a supply voltage of 5V. It operates in industrial temperature range (-40 to 85°C) and features RF and baseband circuit for telecom applications. The package style is chip carrier with very thin profile, suitable for surface mount assembly.
TRF371125IRGZR
TRF371125IRGZR by Texas Instruments is a cellphone IC with 48 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a supply voltage of 5V, making it ideal for telecom applications.
AD6642BBCZRL
Analog Devices
AD6642BBCZRL by Analog Devices is a Cellphone IC with 144 terminals, operating at -40 to 85 °C. It features a 1.8V supply voltage, 0.291mA max current, and RF & baseband circuitry. The package is low profile, square-shaped, with matte tin finish suitable for telecom applications.
AD6654BBCZ
Analog Devices' AD6654BBCZ is a cellphone IC with 256 terminals in a grid array package. Operating temperature ranges from -25 °C to 85°C, with a supply voltage of 1.8V. Ideal for baseband circuit applications due to its compact square shape and surface-mount compatibility.
LMH6523SQ
RF AND BASEBAND CIRCUIT;
TRF4900
TRF4900 by Texas Instruments is a cellphone IC with 24 terminals in a small outline, thin profile package. It operates b/w -20°C to 60°C and has a supply voltage of 3V. This RF and baseband circuit is ideal for telecom applications due to its compact size and dual terminal position.
MAX2309ETI+T
MAX2309ETI+T by Analog Devices is a cellphone IC with 28 terminals in a square package. It operates at -40 to 85 °C, with power supplies of 3/3.3V. Ideal for baseband circuits, it has a terminal pitch of 0.5mm and low supply current of 0.0415mA.
MAX2150ETI+T
Analog Devices' MAX2150ETI+T is a cellphone IC with 28 terminals in a square chip carrier package. It operates at -40 to 85 °C, with power supplies of 3/3.3V and max supply current of 0.107mA. Ideal for RF and baseband circuits in telecom applications due to its compact size and industrial temperature grade suitability.
CC1101RTKG3
CC1101RTKG3 by Texas Instruments is a cellphone IC with 20 terminals, operating at 1.8-3.6V. It features a square shape, nickel palladium gold finish, and industrial temperature grade suitable for RF and baseband circuits. This chip carrier has a very thin profile, measures 4x4mm in size, and can withstand peak reflow temperatures up to 260°C in surface mount applications.
TRF370417TDA1
RF AND BASEBAND CIRCUIT; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
ADF4360-3BCPZRL7
Analog Devices' ADF4360-3BCPZRL7 is a cellphone IC with 24 terminals, operating at 3.3V. It features BICMOS technology, -40 to 85°C temperature range, and matte tin finish. Ideal for baseband circuits in telecom applications due to its compact square package and low profile design.
1200
The Texas Instruments 1200 is a Cellphone IC with CMOS technology, suitable for RF and baseband circuits. It features a square package style, quad terminal position, and operates in industrial temperature grades (-40 to 85°C). With a nominal voltage of 3V and compact dimensions (4x4mm), it's ideal for telecom applications requiring surface mount compatibility.
CC115LRTKT
CC115LRTKT by Texas Instruments is a cellphone IC with a package style of chip carrier, suitable for RF and baseband circuits. It operates in industrial temperature range (-40 to 85°C) with a nominal voltage of 3.6V. This surface-mount device has 20 terminals, nickel palladium gold finish, and compact dimensions (4x4mm).
TRF3701IRHC
TRF3701IRHC by Texas Instruments is a cellphone IC with 16 terminals, operating at -40 to 85°C. It features a 5V supply voltage, RF and baseband circuit for telecom applications. The chip carrier package has a square shape, nickel palladium gold finish, and is surface mountable.
LMV225URX/NOPB
LMV225URX/NOPB by Texas Instruments is a cellphone IC with surface mount capability. It features a grid array package style, very thin profile, and fine pitch terminals. Ideal for RF and baseband circuits, it has a max supply current of 8mA and can withstand peak reflow temperatures up to 260°C for 30 seconds.
MAMF-011139-TR1000
M/a-com Technology Solutions
RF FRONT END CIRCUIT;
HL7692
Sierra Wireless
Sierra Wireless' HL7692 is a surface-mount RF and baseband circuit IC with 146 terminals in a grid array package. Operating b/w -40°C to 85°C, it has a compact size of 22mm width and 23mm length, making it ideal for cellphone applications requiring high-performance telecom capabilities.
AD607ARS
AD607ARS by Analog Devices is a cellphone IC with 20 terminals in a small outline package. It operates b/w -25°C to 85°C, with a supply voltage of 3V. Ideal for baseband circuits, it features gull wing terminals and tin lead finish for surface mounting applications.
ADF4360-9BCPZ
Analog Devices' ADF4360-9BCPZ is a BICMOS technology Cellphone IC with 24 terminals in a square chip carrier package. It operates at -40 to 85°C, with a supply voltage of 3.3V and terminal pitch of 0.5mm. Ideal for baseband circuits, it features matte tin finish and very thin profile for industrial telecom applications.
TCM320AC57IDW
TCM320AC57IDW by Texas Instruments is a Cellphone IC with 20 terminals, operating at temperatures from -40 to 85°C. It features a 13-bit linear coding and A-Law companding law, suitable for baseband circuit applications. This small outline package has a rectangular shape, gull wing terminal form, and requires a 5V supply voltage.
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CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
TRF4000PWP
RF AND BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: HTSSOP; Package Shape: RECTANGULAR;
TRF4400PW
RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: TSSOP; Package Shape: RECTANGULAR;
TRF4400PWG4
TRF4400PWRG4
TRF4900PW
RF AND BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: TSSOP; Package Shape: RECTANGULAR;
TRF4900PWG4
TRF4900PWR
TRF4900PWRG4
TRF4903PW
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: TSSOP; Package Shape: RECTANGULAR;
TRF4903PWG4
TRF4903PWR
TRF4903PWRG4
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