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TRF4400PWR

Texas Instruments

TRF4400PWR by Texas Instruments

TRF4400PWR by Texas Instruments is a cellphone IC with 24 terminals, operating at 3V. It features CMOS technology, RF and baseband circuit for telecom applications. The package is small outline, thin profile, with shrink pitch, suitable for surface mount assembly.

Median Price

$2.938

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

$2.620

1k+ parts

$2.350

10k+ parts

$2.210

4,000

-

$2.620

$2.350

$2.210

DigiKey

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

$3.030

1k+ parts

-

10k+ parts

-

4,000

-

$3.030

-

-

Verical

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.938

10k+ parts

$2.763

2,000

-

-

$2.938

$2.763

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,559 parts In-Stock

1+ parts

$2.764

100+ parts

-

1k+ parts

-

10k+ parts

-

3,559

$2.764

-

-

-

Vyrian

USA . 2,641 parts In-Stock

1+ parts

$2.910

100+ parts

-

1k+ parts

-

10k+ parts

-

2,641

$2.910

-

-

-

DigiKey Marketplace

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,565 parts In-Stock

1+ parts

$2.619

100+ parts

-

1k+ parts

-

10k+ parts

-

3,565

$2.619

-

-

-

Parana Technologies

USA . 1,888 parts In-Stock

1+ parts

$6.266

100+ parts

-

1k+ parts

$7.021

10k+ parts

-

1,888

$6.266

-

$7.021

-

DigiPath Technology Company

USA . 1,667 parts In-Stock

1+ parts

$6.899

100+ parts

$6.347

1k+ parts

-

10k+ parts

-

1,667

$6.899

$6.347

-

-

ChromeModa Solutions

Germany . 3,782 parts In-Stock

1+ parts

$7.040

100+ parts

$5.773

1k+ parts

-

10k+ parts

-

3,782

$7.040

$5.773

-

-

IDEA Electronic Components Group

UK . 1,341 parts In-Stock

1+ parts

$7.040

100+ parts

-

1k+ parts

$6.336

10k+ parts

-

1,341

$7.040

-

$6.336

-

Overview

Unlock the potential of your cellphone with the TRF4400PWR by Texas Instruments. Designed with precision and expertise, this RF and baseband circuit IC offers unparalleled performance and reliability. From crystal-clear call quality to lightning-fast data speeds, this product ensures a seamless user experience. Whether you're a tech enthusiast or a casual user, the TRF4400PWR delivers value and innovation, making it a must-have for all your mobile communication needs. Elevate your device's capabilities with Texas Instruments' cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes the product cost-effective and lightweight.

Surface Mount: YES

Being surface mountable enables easy and efficient assembly onto PCBs, saving time and space.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on the PCB.

Power Supplies (V): 3

Operating at 3V makes this product compatible with standard power supply voltages, ensuring widespread usability.

No. of Terminals: 24

Having 24 terminals provides ample connectivity options for various functions and interfaces.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style offer space-saving benefits and enhanced PCB design flexibility.

Maximum Operating Temperature: 60 °C

With a maximum operating temperature of 60°C, this product can withstand higher temperature environments.

Minimum Operating Temperature: -20 °C

With a minimum operating temperature of -20°C, this product remains operational even in low-temperature conditions.

Terminal Position: DUAL

The dual terminal position provides redundancy and improved reliability for connections.

Maximum Seated Height: 1.2 mm

The low maximum seated height allows for a compact overall product size.

Width: 4.4 mm

The narrow width contributes to space-saving and compact PCB layout designs.

Length: 7.8 mm

The compact length of 7.8 mm further enhances space efficiency on the PCB.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, benefiting overall performance.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and facilitates efficient soldering during assembly.

Maximum Supply Current: 0.075 mA

With a low maximum supply current of 0.075 mA, this product is energy-efficient and helps prolong battery life.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Combining RF and baseband circuitry in one package simplifies design and integration for telecommunications applications.

Nominal Supply Voltage: 3 V

Having a nominal supply voltage of 3V ensures compatibility with standard power sources and systems.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm enables high-density mounting and fine-pitch assembly, enhancing overall product performance.

Technical Specifications

Cellphone ICs TRF4400PWR attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G24

Length:

7.8 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.075 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

TRF4400PWR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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