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TRF3705IRGET

Texas Instruments

TRF3705IRGET by Texas Instruments

TRF3705IRGET by Texas Instruments is a 24-terminal cellphone IC with 3.3V supply voltage, operating b/w -40 to 85°C. It features RF and baseband circuitry in a square chip carrier package with nickel palladium gold finish, suitable for industrial telecom applications.

Median Price

$14.850

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,053 parts In-Stock

1+ parts

$9.834

100+ parts

$8.590

1k+ parts

$5.924

10k+ parts

-

7,053

$9.834

$8.590

$5.924

-

DigiKey

USA . 749 parts In-Stock

1+ parts

$14.850

100+ parts

$10.425

1k+ parts

$9.331

10k+ parts

-

749

$14.850

$10.425

$9.331

-

Mouser Electronics

USA . 700 parts In-Stock

1+ parts

$14.850

100+ parts

$10.110

1k+ parts

$9.330

10k+ parts

-

700

$14.850

$10.110

$9.330

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 88 parts In-Stock

1+ parts

$7.382

100+ parts

-

1k+ parts

-

10k+ parts

-

88

$7.382

-

-

-

Digiode

USA . 2,708 parts In-Stock

1+ parts

$9.342

100+ parts

-

1k+ parts

-

10k+ parts

-

2,708

$9.342

-

-

-

Chip Stock

USA . 7,420 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,420

-

-

-

-

Vyrian

USA . 7,098 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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7,098

-

-

-

-

EPE Components Inc.

USA . 236 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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236

-

-

-

-

Bristol Electronics

USA . 236 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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236

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 100 parts In-Stock

1+ parts

$7.382

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$7.382

-

-

-

Ampacity Inc.

Singapore . 2,572 parts In-Stock

1+ parts

$8.360

100+ parts

-

1k+ parts

-

10k+ parts

-

2,572

$8.360

-

-

-

Corphita

USA . 4,578 parts In-Stock

1+ parts

$8.851

100+ parts

-

1k+ parts

-

10k+ parts

-

4,578

$8.851

-

-

-

Parana Technologies

USA . 2,096 parts In-Stock

1+ parts

$13.192

100+ parts

-

1k+ parts

$13.697

10k+ parts

-

2,096

$13.192

-

$13.697

-

IDEA Electronic Components Group

UK . 1,764 parts In-Stock

1+ parts

$14.823

100+ parts

$14.082

1k+ parts

$13.341

10k+ parts

-

1,764

$14.823

$14.082

$13.341

-

ChromeModa Solutions

Germany . 1,591 parts In-Stock

1+ parts

$14.823

100+ parts

$12.155

1k+ parts

-

10k+ parts

-

1,591

$14.823

$12.155

-

-

Lixinc

USA . 19,120 parts In-Stock

1+ parts

-

100+ parts

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19,120

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Kepictronics

USA . 5,921 parts In-Stock

1+ parts

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5,921

-

-

-

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Metaverse IC Inc.

Canada . 5,921 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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5,921

-

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 4,864 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,864

-

-

-

-

DigiPath Technology Company

USA . 2,125 parts In-Stock

1+ parts

-

100+ parts

$13.364

1k+ parts

-

10k+ parts

-

2,125

-

$13.364

-

-

Perfect Parts

USA . 1,828 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,828

-

-

-

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A-Z Elektronik GmbH

Germany . 1,776 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,776

-

-

-

-

Overview

Elevate your cellphone's performance with the TRF3705IRGET by Texas Instruments. Known for their superior quality and innovative technology, Texas Instruments delivers cutting-edge Cellphone ICs that push the boundaries of mobile technology. The TRF3705IRGET offers unparalleled value with its advanced features and reliability. Whether you're designing a new smartphone or upgrading an existing device, this Telecom IC Type is the perfect choice to enhance RF and baseband circuits. Trust Texas Instruments to provide the best solutions for your cellphone needs.

Feature Benefit Bullets

Package Body Material PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for portable devices like smartphones.

Surface Mount YES

Surface mount technology allows for easier and more efficient assembly of the product onto circuit boards, reducing production costs.

Power Supplies (V) 3.3

The low power supply voltage of 3.3V helps in reducing power consumption and extending battery life in mobile devices.

No. of Terminals 24

With 24 terminals, this product can support complex functionality and connectivity with other components in the device.

Maximum Operating Temperature 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even under demanding conditions.

Terminal Finish NICKEL PALLADIUM GOLD

This terminal finish provides excellent conductivity and corrosion resistance for long-lasting performance.

Width 4 mm

The compact width of 4mm allows for space-saving integration of the product into small form factor devices.

Peak Reflow Temperature °C 260

The high peak reflow temperature of 260°C ensures secure soldering during the assembly process, leading to robust connections.

Temperature Grade INDUSTRIAL

The industrial temperature grade makes this product suitable for use in harsh environments and industrial applications.

Terminal Form NO LEAD

The no-lead terminal form is environmentally friendly and complies with RoHS regulations for reducing hazardous substances in electronics.

Technical Specifications

Cellphone ICs TRF3705IRGET attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

TRF3705IRGET Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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