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TRF3701CRHCR

Texas Instruments

TRF3701CRHCR by Texas Instruments

TRF3701CRHCR by Texas Instruments is a cellphone IC with 16 terminals, operating at 5V. It features RF and baseband circuits in a square chip carrier package. Ideal for telecom applications, it has a temperature range of 0-70°C and terminal pitch of 0.8mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,353 parts In-Stock

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4,353

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Digiode

USA . 1,805 parts In-Stock

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1,805

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 318 parts In-Stock

1+ parts

$13.730

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318

$13.730

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Parana Technologies

USA . 1,568 parts In-Stock

1+ parts

$14.568

100+ parts

-

1k+ parts

$15.007

10k+ parts

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1,568

$14.568

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$15.007

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ChromeModa Solutions

Germany . 806 parts In-Stock

1+ parts

$16.369

100+ parts

$13.423

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806

$16.369

$13.423

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IDEA Electronic Components Group

UK . 193 parts In-Stock

1+ parts

$16.369

100+ parts

$15.551

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$14.732

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193

$16.369

$15.551

$14.732

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One Stop Electronics

USA . 781 parts In-Stock

1+ parts

$171.000

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781

$171.000

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DigiPath Technology Company

USA . 2,204 parts In-Stock

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$14.758

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2,204

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$14.758

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Corphita

USA . 1,722 parts In-Stock

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Overview

Enhance your cellphone's performance with the TRF3701CRHCR from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability. This Cellphone IC is designed to optimize RF and baseband circuits, providing seamless connectivity and improved signal processing. With a compact square package style and low profile, this chip carrier offers easy integration into your device. Trust Texas Instruments for cutting-edge technology that enhances your mobile experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability, making the product suitable for everyday use.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during production.

Power Supplies (V): 5

Provides a stable power source for the IC, ensuring consistent performance.

No. of Terminals: 16

Sufficient number of terminals for connecting various components, enhancing functionality.

Maximum Operating Temperature: 70 °C

Can withstand higher temperatures, making it suitable for different environmental conditions.

Minimum Operating Temperature: 0 °C

Can operate in lower temperatures without compromising performance, versatile for different applications.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Specifically designed for telecom applications, ensuring compatibility and reliability in communication devices.

Technical Specifications

Cellphone ICs TRF3701CRHCR attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N16

Length:

4 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.16SQ,32

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

TRF3701CRHCR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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