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ADF4360-1BCP

Analog Devices

ADF4360-1BCP by Analog Devices

Analog Devices ADF4360-1BCP is a BICMOS technology Cellphone IC with 24 terminals in a square chip carrier package. It operates at -40 to 85 °C, with a supply voltage of 3.3V and terminal pitch of 0.5mm. Ideal for baseband circuit applications due to its compact size and industrial temperature grade suitability.

Median Price

$5.665

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 729 parts In-Stock

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$5.250

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$4.700

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$4.420

729

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$5.250

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$4.420

DigiKey

USA . 729 parts In-Stock

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$6.080

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729

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$6.080

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Digiode

USA . 134 parts In-Stock

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$5.558

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$5.558

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Vyrian

USA . 912 parts In-Stock

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$5.850

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$5.850

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Dynamic Solutions

Germany . 7,000 parts In-Stock

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Chip Stock

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North Shore Components

USA . 96 parts In-Stock

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Prism Electronics

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Distributors (Availability)

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Native Components

USA . 778 parts In-Stock

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$0.964

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778

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Northwest PG Solutions

USA . 1,745 parts In-Stock

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$1.060

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$1.060

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Semicontronic

India . 229 parts In-Stock

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$4.970

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$4.846

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$4.821

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$4.821

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Corphita

USA . 953 parts In-Stock

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$5.265

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Advanced Electronics

New Zealand . 1,580 parts In-Stock

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$8.763

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$8.675

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$8.325

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$8.763

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Parana Technologies

USA . 2,042 parts In-Stock

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$10.839

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$10.080

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$10.839

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IDEA Electronic Components Group

UK . 496 parts In-Stock

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$11.655

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$11.072

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$11.072

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$11.655

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$11.072

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DigiPath Technology Company

USA . 607 parts In-Stock

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$18.182

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$17.455

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$17.455

607

$18.182

$17.455

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$17.455

Perfect Parts

USA . 607 parts In-Stock

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Overview

Experience the cutting-edge technology of Analog Devices with the ADF4360-1BCP, a top-of-the-line Cellphone IC designed to revolutionize your mobile communication experience. Boasting superior quality and reliability, Analog Devices is a trusted manufacturer known for delivering innovation in telecommunications. This surface mount device offers unparalleled performance and efficiency, making it ideal for a wide range of applications in the telecom industry. Upgrade your devices with the ADF4360-1BCP and unlock a world of possibilities, backed by the expertise of Analog Devices. Elevate your communication game today!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and quick installation onto printed circuit boards, optimizing production efficiency.

Package Shape: SQUARE

Square packages are known for their compact size and efficient use of space, making the product suitable for devices with limited board space.

Power Supplies (V): 3.3

Operating at 3.3V ensures compatibility with a wide range of devices and power sources, providing reliable performance.

No. of Terminals: 24

Having a high number of terminals allows for complex connectivity options and functionalities, enhancing the capabilities of the product.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions and maintain stable performance.

Minimum Operating Temperature: -40 °C

The product's ability to operate at low temperatures ensures reliable functionality in various climates and environments.

Technology: BICMOS

BiCMOS technology combines the benefits of bipolar and CMOS technologies, offering high speed and low power consumption for efficient operation.

Telecom IC Type: BASEBAND CIRCUIT

Being a baseband circuit IC provides essential functions for communication devices, making it a crucial component in mobile phones and other telecom equipment.

Technical Specifications

Cellphone ICs ADF4360-1BCP attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N24

JESD-609 Code:

e0

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

240

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

ADF4360-1BCP Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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