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TCM4300PZ

Texas Instruments

TCM4300PZ by Texas Instruments

Texas Instruments TCM4300PZ is a cellphone IC with 100 terminals, operating at -40 to 85°C. It features 3.3/5V power supplies, suitable for RF and baseband circuits in telecom applications. The package is a square flatpack with low profile, fine pitch design, ideal for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,650 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,650

-

-

-

-

Digiode

USA . 2,765 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,765

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,328 parts In-Stock

1+ parts

$12.267

100+ parts

$1,139.165

1k+ parts

$11.040

10k+ parts

-

2,328

$12.267

$1,139.165

$11.040

-

DigiPath Technology Company

USA . 808 parts In-Stock

1+ parts

$13.507

100+ parts

$12.427

1k+ parts

-

10k+ parts

-

808

$13.507

$12.427

-

-

ChromeModa Solutions

Germany . 6,888 parts In-Stock

1+ parts

$13.783

100+ parts

$11.302

1k+ parts

-

10k+ parts

-

6,888

$13.783

$11.302

-

-

IDEA Electronic Components Group

UK . 1,992 parts In-Stock

1+ parts

$13.783

100+ parts

$13.094

1k+ parts

$12.405

10k+ parts

-

1,992

$13.783

$13.094

$12.405

-

AZTECH Wire

Italy . 893 parts In-Stock

1+ parts

$14.580

100+ parts

-

1k+ parts

-

10k+ parts

-

893

$14.580

-

-

-

One Stop Electronics

USA . 1,025 parts In-Stock

1+ parts

$195.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,025

$195.000

-

-

-

Corphita

USA . 1,397 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,397

-

-

-

-

Overview

Experience the seamless performance and reliability with the TCM4300PZ by Texas Instruments. As a leading manufacturer in cellphone ICs, Texas Instruments delivers top-notch quality and cutting-edge technology to meet your communication needs. With a package style that is flatpack, low profile, and fine pitch, this versatile component offers a wide range of applications in the telecom industry. Trust in Texas Instruments to provide you with superior products that will enhance your devices and ensure optimal performance. Choose the TCM4300PZ for unmatched value, benefits, and advantages that will elevate your products to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the cellphone IC, making it suitable for long-term use.

Surface Mount: YES

Surface mount capability allows for easier and more efficient integration into circuit boards, saving time and effort during assembly.

Power Supplies (V): 3.3/5

Versatile power supply options of 3.3V or 5V provide flexibility in usage and compatibility with different system requirements.

No. of Terminals: 100

Having 100 terminals allows for a high level of connectivity and functionality within the cellphone IC, enabling complex operations and features.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this cellphone IC can withstand high temperature environments, ensuring reliable performance in various conditions.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating indicates that this product is designed to operate reliably in harsh industrial environments, making it a dependable choice for industrial applications.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Combining RF and baseband circuits in one IC offers integrated telecommunications capabilities, streamlining design complexity and enhancing overall performance.

Technical Specifications

Cellphone ICs TCM4300PZ attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Telecom ICs

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Trade Compliance

TCM4300PZ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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