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TRF371125IRGZT

Texas Instruments

TRF371125IRGZT by Texas Instruments

TRF371125IRGZT by Texas Instruments is a cellphone IC with 48 terminals, operating at -40 to 85°C. It features RF and baseband circuits, suitable for telecom applications. The package style is chip carrier with a very thin profile, making it ideal for compact designs.

Median Price

$22.632

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,202 parts In-Stock

1+ parts

$16.190

100+ parts

$15.870

1k+ parts

$15.540

10k+ parts

-

3,202

$16.190

$15.870

$15.540

-

Texas Instruments

USA . 5,086 parts In-Stock

1+ parts

$25.043

100+ parts

$21.875

1k+ parts

$15.086

10k+ parts

-

5,086

$25.043

$21.875

$15.086

-

DigiKey

USA . 3,202 parts In-Stock

1+ parts

-

100+ parts

$20.650

1k+ parts

-

10k+ parts

-

3,202

-

$20.650

-

-

Verical

USA . 2,480 parts In-Stock

1+ parts

-

100+ parts

$24.613

1k+ parts

$22.262

10k+ parts

-

2,480

-

$24.613

$22.262

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,921 parts In-Stock

1+ parts

$19.902

100+ parts

-

1k+ parts

-

10k+ parts

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2,921

$19.902

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-

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Vyrian

USA . 1,283 parts In-Stock

1+ parts

$20.950

100+ parts

-

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-

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1,283

$20.950

-

-

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DigiKey Marketplace

USA . 3,202 parts In-Stock

1+ parts

-

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-

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3,202

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-

-

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Cyclops Electronics Ltd

UK . 3 parts In-Stock

1+ parts

-

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-

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3

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,313 parts In-Stock

1+ parts

$9.208

100+ parts

-

1k+ parts

$9.850

10k+ parts

-

1,313

$9.208

-

$9.850

-

ChromeModa Solutions

Germany . 3,013 parts In-Stock

1+ parts

$10.346

100+ parts

$8.484

1k+ parts

-

10k+ parts

-

3,013

$10.346

$8.484

-

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IDEA Electronic Components Group

UK . 1,165 parts In-Stock

1+ parts

$10.346

100+ parts

$9.829

1k+ parts

$9.311

10k+ parts

-

1,165

$10.346

$9.829

$9.311

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Corphita

USA . 2,812 parts In-Stock

1+ parts

$18.855

100+ parts

-

1k+ parts

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2,812

$18.855

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-

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Lixinc

USA . 6,149 parts In-Stock

1+ parts

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6,149

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A-Z Elektronik GmbH

Germany . 5,208 parts In-Stock

1+ parts

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5,208

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Perfect Parts

USA . 847 parts In-Stock

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847

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DigiPath Technology Company

USA . 525 parts In-Stock

1+ parts

-

100+ parts

$9.328

1k+ parts

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525

-

$9.328

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Overview

Elevate your cellphone's performance with the TRF371125IRGZT by Texas Instruments. Crafted with precision and expertise, this innovative RF and baseband circuit offers unparalleled quality and reliability. Perfect for a wide range of applications, this IC ensures seamless communication and connectivity. Experience the value and benefits of Texas Instruments' cutting-edge technology, providing you with a competitive edge in the fast-paced world of telecommunications. Trust in the TRF371125IRGZT to deliver exceptional performance and efficiency, setting a new standard in cellphone ICs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body makes the product lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation onto circuit boards.

Package Shape: SQUARE

The square package shape makes it compact and space-saving in design.

Power Supplies (V): 5

The 5V power supply ensures stable and reliable performance.

No. of Terminals: 48

Having 48 terminals allows for versatile connectivity options.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile design enhances thermal management and space efficiency.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the product can withstand high temperature conditions.

Minimum Operating Temperature: -40 °C

The product can operate efficiently even in extreme cold temperatures down to -40°C.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The terminal finish of nickel, palladium, gold, and silver provides excellent conductivity and corrosion resistance.

Terminal Position: QUAD

The quad terminal position enables efficient connection within the circuit.

Maximum Seated Height: 1 mm

The low seated height of 1mm helps in compact design and space-saving layout.

Width: 7 mm

The 7mm width ensures compatibility with standard board layouts.

Maximum Time At Peak Reflow Temperature (s): 30

The 30 seconds maximum time at peak reflow temperature ensures proper soldering and reliability during assembly.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the product can withstand the soldering process without damage.

Length: 7 mm

The 7mm length contributes to the overall compactness of the product.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh environmental conditions.

Terminal Form: NO LEAD

The no lead terminal form is environmentally friendly and compliant with RoHS regulations.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Being designed for RF and baseband circuits, the product is suitable for telecommunications applications.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage is standard and widely compatible with various systems.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density mounting and interconnection.

Moisture Sensitivity Level (MSL): 2

With MSL 2 rating, the product has moderate sensitivity to moisture during storage and handling.

Technical Specifications

Cellphone ICs TRF371125IRGZT attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TRF371125IRGZT Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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