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TLV320AC57CDWR

Texas Instruments

TLV320AC57CDWR by Texas Instruments

TLV320AC57CDWR by Texas Instruments is a cellphone IC with 20 terminals, CMOS technology, and 3V supply voltage. It operates b/w 0-70°C, suitable for baseband circuits in telecom applications due to its small outline package and gull wing terminal form.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,582 parts In-Stock

1+ parts

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4,582

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Vyrian

USA . 2,773 parts In-Stock

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2,773

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,853 parts In-Stock

1+ parts

$5.496

100+ parts

-

1k+ parts

$6.233

10k+ parts

-

1,853

$5.496

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$6.233

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ChromeModa Solutions

Germany . 1,520 parts In-Stock

1+ parts

$6.175

100+ parts

$5.064

1k+ parts

-

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1,520

$6.175

$5.064

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IDEA Electronic Components Group

UK . 585 parts In-Stock

1+ parts

$6.175

100+ parts

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$5.558

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585

$6.175

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$5.558

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One Stop Electronics

USA . 1,118 parts In-Stock

1+ parts

$14.000

100+ parts

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1,118

$14.000

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AZTECH Wire

Italy . 565 parts In-Stock

1+ parts

$17.399

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565

$17.399

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DigiPath Technology Company

USA . 2,194 parts In-Stock

1+ parts

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100+ parts

$5.567

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2,194

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$5.567

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Corphita

USA . 1,127 parts In-Stock

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1,127

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Overview

Experience the ultimate in cellphone IC technology with the TLV320AC57CDWR by Texas Instruments. Known for their high-quality products, Texas Instruments delivers a top-of-the-line solution that is sure to impress. This versatile IC is perfect for a wide range of applications and offers customers unmatched value, benefits, and advantages. Trust Texas Instruments to provide you with the best in telecom IC technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product portable and long-lasting.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto circuit boards, saving time and space.

No. of Terminals: 20

Having 20 terminals allows for versatile connectivity options and functionality in the product.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance even in warmer environments.

Technology: CMOS

CMOS technology offers low power consumption and high-speed performance, making the product energy-efficient.

Nominal Supply Voltage: 3 V

The 3V supply voltage is common and easily accessible, ensuring compatibility with a wide range of systems and applications.

Technical Specifications

Cellphone ICs TLV320AC57CDWR attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TLV320AC57CDWR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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