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TLV320AC57IDWR

Texas Instruments

TLV320AC57IDWR by Texas Instruments

TLV320AC57IDWR by Texas Instruments is a Cellphone IC with 20 terminals, CMOS technology, and 3V supply voltage. It operates b/w -40 to 85°C, suitable for industrial use in baseband circuits. The small outline package measures 7.5mm x 12.8mm with a seated height of 2.65mm, making it ideal for compact cellphone designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,489 parts In-Stock

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8,489

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Digiode

USA . 2,078 parts In-Stock

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2,078

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 49 parts In-Stock

1+ parts

$15.756

100+ parts

-

1k+ parts

$16.115

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49

$15.756

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$16.115

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AZTECH Wire

Italy . 202 parts In-Stock

1+ parts

$17.077

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202

$17.077

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DigiPath Technology Company

USA . 98 parts In-Stock

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$17.349

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98

$17.349

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ChromeModa Solutions

Germany . 4,220 parts In-Stock

1+ parts

$17.703

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$14.516

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4,220

$17.703

$14.516

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IDEA Electronic Components Group

UK . 169 parts In-Stock

1+ parts

$17.703

100+ parts

$16.818

1k+ parts

$15.933

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169

$17.703

$16.818

$15.933

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One Stop Electronics

USA . 502 parts In-Stock

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$423.000

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502

$423.000

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Semicontronic

India . 1,494 parts In-Stock

1+ parts

$694.000

100+ parts

$676.650

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$673.180

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1,494

$694.000

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$673.180

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Ampacity Inc.

Singapore . 686 parts In-Stock

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$706.000

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686

$706.000

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Corphita

USA . 2,980 parts In-Stock

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2,980

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Corohmni

South Africa . 179 parts In-Stock

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Overview

Experience exceptional audio quality and seamless connectivity with the TLV320AC57IDWR by Texas Instruments. As a global leader in semiconductor manufacturing, Texas Instruments ensures top-notch reliability and performance in all their products. This cellphone IC is perfect for a wide range of applications, including smartphones and tablets. With its compact design and industrial-grade temperature grade, this baseband circuit offers unmatched value and benefits to customers looking for advanced telecommunications solutions. Trust Texas Instruments to deliver cutting-edge technology that exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost during manufacturing.

Package Shape: RECTANGULAR

Rectangular shape provides a compact design, saving space on the PCB and allowing for more components to be included.

No. of Terminals: 20

Having 20 terminals allows for multiple connections and functionalities to be integrated into the product.

Package Style (Meter): SMALL OUTLINE

Small outline package style further contributes to the compact design, ideal for smaller electronic devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stability and reliability even in harsh environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the product to function in cold conditions without any issues.

Terminal Position: DUAL

Dual terminal position provides redundancy and increases the reliability of the connections.

Maximum Seated Height: 2.65 mm

Low seated height allows for a slim profile, ideal for thin and compact electronic devices.

Width: 7.5 mm

Narrow width contributes to the compact design, allowing for more components to be placed closely together.

Length: 12.8 mm

Compact length saves space on the PCB and makes the product suitable for smaller electronic devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the product can withstand a wide range of temperature variations in industrial settings.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form provides a secure connection and ease of soldering during assembly.

Telecom IC Type: BASEBAND CIRCUIT

Baseband circuit is essential for communication functions in cellphones, ensuring reliable signal processing and data transmission.

Nominal Supply Voltage: 3 V

Nominal supply voltage of 3V is standard for many electronic devices, ensuring compatibility and efficient power consumption.

Terminal Pitch: 1.27 mm

Narrow terminal pitch allows for compact layout and efficient use of PCB real estate, making the product suitable for small devices.

Technical Specifications

Cellphone ICs TLV320AC57IDWR attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TLV320AC57IDWR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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