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ADF4360-0BCPZRL

Analog Devices

ADF4360-0BCPZRL by Analog Devices

Analog Devices' ADF4360-0BCPZRL is a cellphone IC with 24 terminals, operating at 3.3V. It features BICMOS technology, quad terminal position, and matte tin finish. Ideal for baseband circuits in telecom applications, it has a compact square package style with a very thin profile for industrial use.

Median Price

$5.970

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 750 parts In-Stock

1+ parts

$5.970

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-

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750

$5.970

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VNN

France . 5,364 parts In-Stock

1+ parts

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5,364

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Vyrian

USA . 3,227 parts In-Stock

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3,227

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Digiode

USA . 775 parts In-Stock

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775

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,474 parts In-Stock

1+ parts

$4.300

100+ parts

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2,474

$4.300

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Continental Prestige Electronics

USA . 2,941 parts In-Stock

1+ parts

$5.970

100+ parts

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1k+ parts

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10k+ parts

$5.851

2,941

$5.970

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-

$5.851

Advanced Electronics

New Zealand . 41 parts In-Stock

1+ parts

$6.925

100+ parts

$6.371

1k+ parts

$5.970

10k+ parts

-

41

$6.925

$6.371

$5.970

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AZTECH Wire

Italy . 553 parts In-Stock

1+ parts

$7.478

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553

$7.478

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Aztec Data Supply Inc.

USA . 3,669 parts In-Stock

1+ parts

$8.874

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3,669

$8.874

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Parana Technologies

USA . 3,958 parts In-Stock

1+ parts

$15.177

100+ parts

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1k+ parts

$14.114

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3,958

$15.177

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$14.114

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Corohmni

South Africa . 701 parts In-Stock

1+ parts

$15.853

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701

$15.853

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IDEA Electronic Components Group

UK . 810 parts In-Stock

1+ parts

$16.319

100+ parts

$15.503

1k+ parts

$15.503

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810

$16.319

$15.503

$15.503

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DigiPath Technology Company

USA . 3,958 parts In-Stock

1+ parts

$25.458

100+ parts

$24.439

1k+ parts

-

10k+ parts

$24.439

3,958

$25.458

$24.439

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$24.439

Semicontronic

India . 1,006 parts In-Stock

1+ parts

$663.000

100+ parts

$646.425

1k+ parts

$643.110

10k+ parts

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1,006

$663.000

$646.425

$643.110

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One Stop Electronics

USA . 594 parts In-Stock

1+ parts

$671.000

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594

$671.000

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Ampacity Inc.

Singapore . 877 parts In-Stock

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$754.000

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877

$754.000

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Argo Parts USA

USA . 3,145 parts In-Stock

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3,145

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Corphita

USA . 90 parts In-Stock

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90

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Netroflash

USA . 50 parts In-Stock

1+ parts

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100+ parts

$5.851

1k+ parts

$5.671

10k+ parts

$5.552

50

-

$5.851

$5.671

$5.552

Overview

Discover the ultimate solution for your cellphone IC needs with Analog Devices' ADF4360-0BCPZRL. This high-quality chip carrier offers unmatched performance and reliability, making it the ideal choice for a wide range of applications. With a very thin profile and industrial-grade temperature rating, this quad-terminal IC ensures seamless integration and long-lasting functionality. Trust Analog Devices to deliver cutting-edge technology that exceeds expectations and provides exceptional value for all your telecommunications projects. Elevate your designs with the ADF4360-0BCPZRL and experience unparalleled results like never before.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and quick assembly onto PCBs, saving time and effort during manufacturing.

Package Shape: SQUARE

Square packages are space-efficient and provide stability on the circuit board.

Power Supplies (V): 3.3

Operates efficiently at a standard voltage, ensuring compatibility with various systems.

No. of Terminals: 24

Provides ample connectivity options for integrating the IC into different applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Offers a versatile package style suitable for a range of design requirements.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Operates reliably in low-temperature environments, ensuring performance in various conditions.

Terminal Finish: MATTE TIN

Provides a durable and corrosion-resistant finish for reliable electrical connections.

Terminal Position: QUAD

Quad terminal positions offer stability and ease of soldering during assembly.

Maximum Seated Height: 1 mm

Low profile design allows for compact and space-saving circuit layouts.

Width: 4 mm

Compact width enables efficient use of board space and integration in small devices.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures efficient soldering process during manufacturing with optimized reflow time.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures for reliable solder joints and assembly.

Length: 4 mm

Compact length facilitates integration into small form factor devices.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments with reliable performance.

Technology: BICMOS

Utilizes BiCMOS technology for improved performance and efficiency in analog and digital circuits.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and ensures safe handling.

Telecom IC Type: BASEBAND CIRCUIT

Specifically designed for baseband circuit applications in telecom systems for optimized performance.

Nominal Supply Voltage: 3.3 V

Operates at a standard voltage for compatibility with various systems and power sources.

Terminal Pitch: 0.5 mm

Fine pitch terminals offer high density integration and connectivity options in compact designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the IC has moderate moisture sensitivity, suitable for standard production environments.

Technical Specifications

Cellphone ICs ADF4360-0BCPZRL attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N24

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

ADF4360-0BCPZRL Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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