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ADS58C20IPFPR

Texas Instruments

ADS58C20IPFPR by Texas Instruments

Texas Instruments ADS58C20IPFPR is an 80-terminal cellphone IC with a max analog input of 3.45V and operating temperature range from -40 to 85°C. It features a flatpack package style, gull wing terminal form, and is suitable for RF and baseband circuit applications in the telecom industry.

Median Price

$127.030

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,556 parts In-Stock

1+ parts

$122.822

100+ parts

$119.128

1k+ parts

$92.347

10k+ parts

-

2,556

$122.822

$119.128

$92.347

-

Rochester

USA . 847 parts In-Stock

1+ parts

$127.030

100+ parts

$119.410

1k+ parts

$111.790

10k+ parts

-

847

$127.030

$119.410

$111.790

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DigiKey

USA . 847 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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847

-

-

-

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Verical

USA . 847 parts In-Stock

1+ parts

-

100+ parts

$149.262

1k+ parts

$139.738

10k+ parts

-

847

-

$149.262

$139.738

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 743 parts In-Stock

1+ parts

$116.681

100+ parts

-

1k+ parts

-

10k+ parts

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743

$116.681

-

-

-

DigiKey Marketplace

USA . 847 parts In-Stock

1+ parts

$133.400

100+ parts

-

1k+ parts

-

10k+ parts

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847

$133.400

-

-

-

Vyrian

USA . 3,980 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,980

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,781 parts In-Stock

1+ parts

$11.716

100+ parts

-

1k+ parts

$12.108

10k+ parts

-

1,781

$11.716

-

$12.108

-

DigiPath Technology Company

USA . 1,329 parts In-Stock

1+ parts

$12.901

100+ parts

-

1k+ parts

-

10k+ parts

-

1,329

$12.901

-

-

-

ChromeModa Solutions

Germany . 1,783 parts In-Stock

1+ parts

$13.164

100+ parts

$10.794

1k+ parts

-

10k+ parts

-

1,783

$13.164

$10.794

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IDEA Electronic Components Group

UK . 328 parts In-Stock

1+ parts

$13.164

100+ parts

$12.506

1k+ parts

$11.848

10k+ parts

-

328

$13.164

$12.506

$11.848

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Native Components

USA . 321 parts In-Stock

1+ parts

$64.449

100+ parts

-

1k+ parts

-

10k+ parts

$61.871

321

$64.449

-

-

$61.871

Northwest PG Solutions

USA . 387 parts In-Stock

1+ parts

$70.894

100+ parts

-

1k+ parts

-

10k+ parts

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387

$70.894

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-

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Corphita

USA . 2,931 parts In-Stock

1+ parts

$110.540

100+ parts

-

1k+ parts

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10k+ parts

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2,931

$110.540

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A-Z Elektronik GmbH

Germany . 7,436 parts In-Stock

1+ parts

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7,436

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Alle Elektronik GmbH

Germany . 4,957 parts In-Stock

1+ parts

-

100+ parts

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4,957

-

-

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Kepictronics

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,000

-

-

-

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,000

-

-

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GreenTree Electronics

Israel . 306 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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306

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Overview

Experience cutting-edge technology with the ADS58C20IPFPR by Texas Instruments, a top-tier manufacturer known for delivering high-quality Cellphone ICs. This innovative device offers unparalleled performance and reliability, making it perfect for a wide range of applications. With a sleek design and advanced features, this product promises to enhance your electronic devices with ease. Trust Texas Instruments to provide you with the best in telecom IC technology, setting new standards in the industry. Elevate your creations with the ADS58C20IPFPR and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and cost-effective, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for efficient and compact PCB design, saving space and improving overall product performance.

Package Shape: SQUARE

Square packages are easy to handle and provide a stable mounting platform for the IC.

No. of Terminals: 80

Having a higher number of terminals allows for more connectivity options and functions within the IC.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the IC can function reliably in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that the IC can continue to function even in extremely cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Width: 12 mm

Compact width allows for easy integration into various device designs, saving space and enhancing flexibility.

Maximum Analog Input: 3.45 V

High maximum analog input allows for versatile usage scenarios and compatibility with a wide range of systems.

Telecom IC Type: RF AND BASEBAND CIRCUIT

The combination of RF and baseband circuitry within the IC enables seamless communication and data processing in telecommunications applications.

Technical Specifications

Cellphone ICs ADS58C20IPFPR attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

Maximum Analog Input:

3.45 V

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Trade Compliance

ADS58C20IPFPR Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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