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LMV226TL

Texas Instruments

LMV226TL by Texas Instruments

LMV226TL by Texas Instruments is a cellphone IC with a package style of grid array, very thin profile, and fine pitch. It operates in industrial temperature range from -40 to 85°C and has a nominal voltage of 2.7V. This RF and baseband circuit IC is designed for telecom applications requiring precise performance in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 6,150 parts In-Stock

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6,150

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Vyrian

USA . 5,130 parts In-Stock

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5,130

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Digiode

USA . 513 parts In-Stock

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513

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Anansix

USA . 283 parts In-Stock

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283

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Prism Electronics

USA . 20 parts In-Stock

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20

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 408 parts In-Stock

1+ parts

$7.371

100+ parts

-

1k+ parts

$7.864

10k+ parts

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408

$7.371

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$7.864

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DigiPath Technology Company

USA . 1,295 parts In-Stock

1+ parts

$8.116

100+ parts

$7.467

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1,295

$8.116

$7.467

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ChromeModa Solutions

Germany . 6,105 parts In-Stock

1+ parts

$8.282

100+ parts

$6.791

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6,105

$8.282

$6.791

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IDEA Electronic Components Group

UK . 1,825 parts In-Stock

1+ parts

$8.282

100+ parts

$7.868

1k+ parts

$7.454

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1,825

$8.282

$7.868

$7.454

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AZTECH Wire

Italy . 239 parts In-Stock

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$16.429

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239

$16.429

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One Stop Electronics

USA . 1,543 parts In-Stock

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$105.000

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1,543

$105.000

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Corphita

USA . 2,241 parts In-Stock

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Overview

Enhance the performance of your cellphone with the LMV226TL by Texas Instruments, a high-quality RF and baseband circuit designed to optimize communication capabilities. Manufactured with precision and expertise by Texas Instruments, this IC offers unparalleled reliability and efficiency in a compact and durable package. Perfect for a wide range of applications, this product provides customers with exceptional value, benefits, and advantages that will elevate their mobile experience. Upgrade your device today with the LMV226TL and enjoy seamless connectivity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability for the product, making it suitable for long-term use.

Surface Mount: YES

Surface mount technology allows for easier assembly, compact design, and better performance in high-frequency applications.

Package Shape: SQUARE

The square shape provides efficient use of space and easier integration into circuit designs.

No. of Terminals: 4

Having a low number of terminals simplifies installation and reduces chances of error during assembly.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style offers high density, low profile, and fine pitch for advanced circuit designs and performance.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions and extended usage.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product's functionality in cold environments without compromising performance.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides excellent conductivity, corrosion resistance, and solderability for reliable connections.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates easier PCB layout and soldering, enhancing overall manufacturing efficiency.

Maximum Seated Height: 0.675 mm

The low seated height allows for slim product profiles and enables compact device designs.

Width: 1.014 mm

The narrow width contributes to space-saving layouts and compatibility with tight design constraints.

Length: 1.014 mm

The compact length of the product allows for efficient use of board space and streamlined circuit layouts.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in rugged environments and industrial applications.

Terminal Form: BALL

Ball terminals offer secure connections, high electrical performance, and ease of soldering during assembly.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Supports both RF and baseband circuit applications, making it a versatile choice for communication devices.

Nominal Supply Voltage: 2.7 V

The nominal supply voltage is suitable for efficient power consumption and compatibility with various systems.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density integration, precise connections, and improved signal integrity.

Technical Specifications

Cellphone ICs LMV226TL attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B4

JESD-609 Code:

e1

Length:

1.014 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

.675 mm

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

1.014 mm

Trade Compliance

LMV226TL Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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